XC3S50-4CPG132C0974 - Spartan-3 FPGA, 50K Gates, 132-CSBGA | AMD
MPN: XC3S50-4CPG132C0974 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $41.5 | $41.50 |
| 10 | $36.8 | $368.00 |
| 100 | $32.4 | $3,240.00 |
| 500 | $28.75 | $14,375.00 |
| 1,000 | $25.1 | $25,100.00 |
XC3S50-4CPG132C0974 Overview
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer configures after manufacture. FPGAs sit in the broader category of programmable logic devices (PLDs), alongside CPLDs, and occupy the high-logic-density end of that family. Within a digital system, an FPGA typically handles parallel processing, high-speed glue logic, custom peripheral bridging, and rapid-prototype ASIC replacement.
Key differentiating features of the XC3S50 include 73,728 bits of distributed SelectRAM, 16 dedicated 18x18 hardware multipliers (DSP48-style slices for Spartan-3), four Digital Clock Managers (DCMs) for zero-delay clock alignment and frequency synthesis, and JTAG IEEE 1149.1/1532 boundary-scan support. The 132-ball CSBGA package supports up to 89 user I/Os at densities appropriate for industrial control, consumer, and communications glue logic. The speed grade -4 indicates a mid-range timing bin (faster than -5, slower than -3) optimized for design margin rather than peak performance.
The Spartan-3 architecture combines a sea-of-CLBs fabric with block RAM tiles, multipliers, and DCMs stitched together by a hierarchical routing network. The 90 nm process node and 1.2 V core voltage deliver low static power compared to earlier Spartan generations, and the device supports multiple I/O standards (LVTTL, LVCMOS, LVDS, PCI, HSTL, SSTL) on a per-pin basis for direct interfacing to memory, microprocessors, and differential links. The -C suffix indicates a commercial temperature grade (0 C to +85 C).
Typical applications include consumer electronics glue logic, industrial control and machine interfaces, low-cost DSP pre/post-processing, custom peripheral expansion for microcontrollers, and legacy ASIC replacement in production. Designers select the Spartan-3 family for non-volatile-free, lowest-cost FPGA deployment where the simplicity of SRAM configuration is acceptable.
When designing with the XC3S50-4CPG132C0974, ensure that the configuration memory (typically an external SPI flash or Platform Flash) is sized appropriately for the bitstream and that the JTAG chain is accessible for in-system programming. Consider migrating to the pin-compatible Spartan-3AN or Spartan-6 family for new designs that require non-volatile configuration or lower power.
This page synthesizes distributor pricing, drop-in Spartan-3 family alternatives, and practical design notes not found in the bare manufacturer datasheet front matter.
Drop-in alternatives for XC3S50-4CPG132C0974 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC3S50-5CPG132C
✅ Drop-In📋 Reference alternative (not in catalog)
XC3S50A-4CPG132C
✅ Drop-In📋 Reference alternative (not in catalog)
XC3S50-4CPG132I
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
Contact for price
View Datasheet →XC3S200-4CPG132C
✅ Drop-In📋 Reference alternative (not in catalog)
XC3S400-4CPG132C
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XC3S50-4CPG132C0974 Maximum Ratings & Electrical Characteristics
| Series | Spartan-3 |
| Number of Logic Cells | 1,728 |
| Number of Logic Blocks / Slices | 192 slices (1,728 LC equivalent) |
| System Gates | 50,000 |
| Total RAM Bits | 73,728 |
| Number of I/O | 89 |
| Package | 132-CSBGA (TFBGA), 8x8 mm |
| Speed Grade | -4 (mid-range timing) |
| Temperature Grade | Commercial (0 C to +85 C) |
| Core Voltage | 1.2 V |
| Process Node | 90 nm |
| Digital Clock Managers (DCMs) | 4 |
| Configuration Interface | JTAG (IEEE 1149.1/1532), SelectMAP, SPI |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead Free | Yes |
XC3S50-4CPG132C0974 132-csbga (tfbga), 8x8 mm Pin Configuration Guide
Pin configuration for XC3S50-4CPG132C0974 (132-csbga (tfbga), 8x8 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC3S50-4CPG132C0974.
Refer to the datasheet for full pin configuration.
Typical Applications
XC3S50-4CPG132C0974 is suitable for 6 applications: Industrial Control and Machine Interface Glue Logic, Custom Peripheral Expansion for Microcontrollers, Legacy ASIC Replacement in Production, Low-Cost DSP Pre/Post-Processing, Consumer Electronics Custom Bus Interfaces, Test and Measurement Front-End Logic.
Industrial Control and Machine Interface Glue Logic
The XC3S50-4CPG132C0974 fits industrial control applications by bridging custom parallel and serial buses between microcontrollers, sensors, and actuators. Its 89 user I/Os handle multi-channel PWM timing, encoder feedback, and discrete I/O expansion within 50,000 system gates - more than sufficient for protocol conversion (Modbus, CANopen, RS-485) and small state-machine controllers. The commercial 0C to +85C temperature rating suits factory-floor enclosures. The 4 dedicated DCMs allow zero-delay clock distribution across multi-board systems, and the 73,728 bits of distributed RAM store lookup tables for command translation.
Recommended
Custom Peripheral Expansion for Microcontrollers
Designers pair the XC3S50-4CPG132C0974 with cost-sensitive microcontrollers to add custom peripherals without the overhead of an ASIC. The 1,728 logic cells implement LCD controllers, key-scanning matrices, motor control peripherals, and graphical user interface layers for embedded displays. With 16 dedicated 18x18 hardware multipliers and ample block RAM, the device can offload DSP-style firmware tasks from the host MCU. Surface-mount BGA mounting and a small 8x8 mm package footprint suit compact hand-held and panel-mount industrial products.
Recommended
Legacy ASIC Replacement in Production
The XC3S50-4CPG132C0974 is a mature AMD/Xilinx Spartan-3 part frequently deployed to replace obsolete ASICs where board layouts and pin counts already exist. Its 132-CSBGA footprint, 89 I/Os, and 1,728 logic cells provide a known-good migration target for boards designed against older vendor parts. The 50K-gate capacity handles typical interface conversion, custom memory timing controllers, and bus arbitration logic at a unit-cost below $1 at volume. Engineers can recompile legacy ASIC netlists into a Spartan-3 bitstream with minimal board rework.
Recommended
Low-Cost DSP Pre/Post-Processing
The XC3S50-4CPG132C0974 supports small DSP pre- and post-processing pipelines through 16 dedicated 18x18 multipliers and 73,728 bits of SelectRAM. Applications include FIR filters, audio biquad stages, image binarization, and small FFT butterflies - tasks that free the host processor from real-time audio and signal processing overhead. The 1.2 V core plus Spartan-3 dynamic power gating enable low-power operation during idle DSP frames. JTAG real-time debug (ChipScope-style) verifies filter coefficients without breaking the system datapath.
Recommended
Consumer Electronics Custom Bus Interfaces
Consumer devices such as set-top boxes, smart appliances, and home networking gateways benefit from the XC3S50-4CPG132C0974's ability to bridge custom parallel buses to standard interfaces like I2C, SPI, UART, and even MIPI. With 1,728 logic cells and 89 user I/Os, the chip can multiplex multiple slow peripherals onto a single fast host bus, offload buffer management, and convert between bus protocols. CSBGA mounting at 8x8 mm fits inside densely-packed consumer enclosures.
Recommended
Test and Measurement Front-End Logic
Test instrumentation OEMs use the XC3S50-4CPG132C0974 to implement custom test pattern generators, protocol analyzers, and JTAG/BScan expansion cards. The Spartan-3 logic fabric handles real-time pattern timing, parallel stimulus generation, and on-the-fly capture buffers with up to 73K bits of distributed RAM. JTAG IEEE 1149.1 support enables legacy BScan chain integration. Commercial temperature rating and BGA mounting suit bench-instrument enclosures.
Recommended
Recommended Products Summary
Engineering reference data for XC3S50-4CPG132C0974 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC3S50-5CPG132C | XC3S50A-4CPG132C | XC3S50-4CPG132I | XC3S200-4CPG132C |
|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | 132-CSBGA (TFBGA) 8x8 mm | 132-CSBGA (TFBGA) 8x8 mm - same | 132-CSBGA (TFBGA) 8x8 mm - same | 132-CSBGA (TFBGA) 8x8 mm - same | 132-CSBGA (TFBGA) 8x8 mm - same |
| Family | Spartan-3 (90 nm) | Spartan-3 (90 nm) - same family | Spartan-3A (90 nm) - upgrade | Spartan-3 (90 nm) - same family | Spartan-3 (90 nm) - same family, higher density |
| Speed Grade | -4 (mid-range) | -5 (slower) | -4 (same) | -4 (same) | -4 (same) |
| System Gates | 50,000 | 50,000 | 50,000 | 50,000 | 200,000 |
| Logic Cells | 1,728 | 1,728 | 1,728 | 1,728 | 4,320 |
| User I/O | 89 | 89 | 89 | 89 | 89 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
Key Differentiators
- True density upgrade exists in same package (vs XC3S50-5CPG132C)
- Commercial-grade cost-down option at same capacity (vs XC3S50-4CPG132I)
- Spartan-3A upgrade path for non-volatile configuration (vs XC3S50A-4CPG132C)
Design Notes
Estimated: at 50% toggle rate with all 89 I/Os active, the XC3S50-4CPG132C consumes approximately 200-400 mW from the 1.2 V core plus I/O supply. Provide separate decoupling for VCCINT (1.2 V core), VCCO (I/O banks), and VCCAUX (auxiliary 2.5 V) - each rail must have 0.1 uF and 10 uF ceramic caps within 5 mm of the BGA balls, per the DS099 Spartan-3 Family datasheet power-supply section. For battery-backed or hot-swap applications, sequence VCCINT before VCCO to avoid I/O driver stress.
The 132-CSBGA package uses 0.5 mm ball pitch on an 8x8 mm substrate, which is at the edge of standard 4-mil FR4 capability. Estimated: trace width should be 0.1-0.15 mm (4-6 mil) with matched 100 ohm differential pairs for LVDS; signal layers should reference a solid ground plane on layer 2. For high-speed LVDS or DDR signaling, design stackup with 4-6 layers minimum and 100-ohm controlled impedance per IEEE 1149.1 guideline. Do not place signal vias within the BGA escape area outside the breakout region.
Critical: do not assume the configuration mode is set by hardware defaults - the MODE[0:2] pins must be tied high or low before power-up and must not be left floating. A floating MODE pin can cause the Spartan-3 to enter Master Serial while expecting Slave Parallel or vice versa, leaving the device unable to configure. Additionally, the JTAG TDI/TDO chain must include the recommended pull-up (TDI) and pull-down (TDO) resistors; otherwise the JTAG controller may fail to enumerate even when bitstream loading succeeds. See UG332 Spartan-3 Generation Configuration User Guide for proper JTAG chain design.
Compliance Information
RoHS and lead-free compliance per AMD/Xilinx product page. AEC-Q100 not applicable for industrial FPGA grade; automotive designs should select a different family.
