XC6SLX150-3FG676I - 147443-Cell Spartan-6 LX FPGA | AMD
Teilenummer: XC6SLX150-3FG676I ✓ AktivXC6SLX150-3FG676I Übersicht
A field-programmable gate array is a reconfigurable digital semiconductor in which the logic fabric, input/output blocks, clocking resources, and embedded memory are programmed after manufacture. The Spartan-6 LX family targets the FPGA > programmable logic > semiconductor hierarchy, combining high logic density with a broad set of embedded resources for communications, industrial control, instrumentation, embedded processing, and high-volume electronic systems. The XC6SLX150-3FG676I is the large-density member of that family.
The device provides 147443 logic cells on a mature 45 nm low-power copper CMOS process. Its 1.2 V core voltage identifies the core operating rail, while separate I/O supply options allow interface standards to be matched to board requirements when their supported values are confirmed in the Spartan-6 documentation. The 676-BGA package provides a high pin count and a compact body measuring 19 x 19 mm with 0.80 mm pitch, according to the package listing. The -3 grade is intended for the highest performance in the LX speed-grade range.
Its operating temperature range is 0 to 85 degrees Celsius, making the device appropriate for industrial-temperature equipment that remains within this specified envelope. Designers should use the AMD Spartan-6 package pinout files when assigning balls to power, ground, configuration pins, clock pins, and user I/O. The architecture is particularly useful when a design needs parallel channels, deterministic latency, hardware timing, or configurable logic that can be updated independently of a general-purpose software runtime.
Typical applications include industrial automation, test and measurement equipment, communications infrastructure, embedded control systems, video and image processing, and signal acquisition. These uses benefit from the device's combination of logic density, programmable I/O, and parallel processing resources. System designs must still account for external memory, clock jitter, power sequencing, decoupling, signal integrity, and thermal performance at the selected operating speed.
For PCB implementation, follow the manufacturer package and pinout files for ball assignment and escape routing, provide continuous power and ground planes, and keep high-speed clocks and differential interfaces away from noisy switching nodes. Configuration storage and its interface should also follow the Spartan-6 design guidance. The key engineering trade-off is that the -3 grade prioritizes performance, whereas a lower-speed grade may offer a different balance of timing margin, power, and thermal requirements.
This product overview combines the device's package, density, process, speed-grade, temperature, and electrical attributes with practical FPGA design guidance. It also distinguishes same-package alternatives by logic density, speed grade, and temperature suffix, helping engineers verify pin compatibility and performance requirements before approving a replacement.
Drop-in-Alternativen für XC6SLX150-3FG676I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit XC6SLX150-3FG676I (gleiche Bauform und Footprint) – abweichend in Device Type, Package, Temperature Grade, Speed Grade, Lead-Free Status.
XC6SLX150-3FGG676I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC6SLX150-2FGG676I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC6SLX150-2FG676I
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →XC6SLX150T-3FG676I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC6SLX150T-3FGG676I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC6SLX150-3FG676I Grenzwerte & elektrische Eigenschaften
| Device Type | Spartan-6 LX FPGA |
| Logic Cells | 147443 cells |
| FPGA Family | Spartan-6 LX |
| Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Internal Frequency | 667 MHz |
| Speed Grade | -3 |
| Gehäuse | 676-BGA, 19 x 19 mm, 0.80 mm pitch |
| Package Family | FBGA |
| Betriebstemperatur | 0 to 85 C |
| Temperature Grade | Industrial |
| Lead-Free Status | Lead-free package |
| Montageart | Surface Mount |
| Device Pin Count | 676 pins |
| Programmability | Field programmable |
XC6SLX150-3FG676I fbga Pinbelegungsleitfaden
Pinbelegung für XC6SLX150-3FG676I (fbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für XC6SLX150-3FG676I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
XC6SLX150-3FG676I ist geeignet für 6 Anwendungs: Industrial Automation and Control, Test and Measurement Instrumentation, Communications Interface Equipment, Embedded Video and Image Processing, Signal Acquisition and Processing, High-Performance Embedded Processing.
Industrial Automation and Control
The XC6SLX150-3FG676I fits industrial automation controllers because 147443 logic cells can implement parallel motion, sequencing, interlocks, and machine-control functions in dedicated hardware. Its 0 to 85 C operating range supports industrial-temperature equipment when the complete board remains inside that envelope. The -3 grade favors demanding timing paths, while the 1.2 V core rail requires a clean, well-decoupled power design. For a controller with multiple machine axes, deterministic hardware execution can reduce dependence on a real-time software scheduler, although timing closure, safe-state I/O behavior, and industrial EMC requirements still need complete verification.
Empfohlen
Test and Measurement Instrumentation
The XC6SLX150-3FG676I is suitable for parallel data-acquisition and instrument-control logic because a large programmable fabric can combine acquisition control, timing, data formatting, and interface functions. Its 147443 logic cells provide room for concurrent channels, while the -3 speed grade supports designs with demanding sequential timing. The 1.2 V core supply and 676-ball FBGA require careful power-plane design, clock routing, and thermal analysis. Compared with a processor-only controller, programmable parallel logic can produce deterministic transfers and flexible channel counts, but calibration, trigger latency, I/O voltage selection, and signal-integrity margins must be evaluated at the system level.
Empfohlen
Communications Interface Equipment
The XC6SLX150-3FG676I can implement parallel protocol engines, packet-processing pipelines, and multiple interface adapters in a single Spartan-6 LX device. Its 147443 logic cells permit concurrent datapaths, while the -3 speed grade is useful when timing margins are limited. A communications board can place framing, buffering, and error-control logic beside a processor, reducing off-chip transfers and making behavior programmable. The principal engineering constraints are the 1.2 V core rail, supported I/O standards, clock quality, board-level signal integrity, and synchronization across parallel channels. Complete timing analysis should cover every clock domain and interface crossing before the design is released to production.
Empfohlen
Embedded Video and Image Processing
The XC6SLX150-3FG676I offers substantial programmable logic for parallel pixel pipelines, format conversion, thresholding, and interface timing in embedded imaging systems. Using 147443 logic cells allows designers to implement deterministic stages that process multiple samples simultaneously instead of relying solely on sequential software instructions. The -3 grade helps preserve timing margin in pipelined datapaths, while the 676-BGA package offers a high pin count for external memories and image sensors. Designers must verify supported I/O voltages, memory-interface timing, clock jitter, power consumption, and heat dissipation. Pipeline latency and frame synchronization should also be documented because programmable logic can deliver predictable results when its clocking architecture is properly constrained.
Empfohlen
Signal Acquisition and Processing
The XC6SLX150-3FG676I is appropriate for parallel signal-processing front ends that require deterministic sampling, filtering, correlation, or real-time decision logic. The large 147443-cell fabric can host multiple parallel lanes, and the -3 speed grade supports demanding timing relationships between acquisition and processing stages. The 1.2 V core supply should be generated with low-noise, stable regulation and local high-frequency decoupling, while analog front-end isolation remains the responsibility of the surrounding circuitry. Timing analysis, jitter budgeting, channel skew, and input-voltage compatibility are essential because FPGA performance alone cannot compensate for an inadequately conditioned analog signal. The final design should also verify thermal margin at the selected ambient temperature.
Empfohlen
High-Performance Embedded Processing
The XC6SLX150-3FG676I can surround a hard or soft processor with dedicated accelerators, custom peripherals, memory interfaces, and real-time control logic. Its 147443 logic cells provide substantial capacity for parallel work while the -3 grade improves available timing margin over lower speed grades. This architecture can move repetitive operations into programmable hardware and reduce processor bottlenecks, provided the accelerator interface is partitioned carefully. The 676-BGA footprint requires dense escape routing, uninterrupted power planes, and careful via placement around the device. Designers should assess cache, memory bandwidth, interrupt latency, clock-domain crossings, and tool-supported processor integration. A soft processor also requires initialization, bus arbitration, and verification resources.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XC6SLX150-3FG676I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XC6SLX150-3FGG676I | XC6SLX150-2FGG676I | XC6SLX150-2FG676I | XC6SLX150T-3FG676I | XC6SLX150T-3FGG676I |
|---|---|---|---|---|---|---|
| Package | 676-BGA, 19 x 19 mm, 0.80 mm pitch | 676-BGA | 676-BGA | 676-BGA | 676-BGA | 676-BGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LXT | Spartan-6 LXT |
| Logic Cells | 147443 cells | 147443 cells | 147443 cells | 147443 cells | 147443 cells | 147443 cells |
| Speed Grade | -3 | -3 | -2 | -2 | -3 | -3 |
| Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Wichtigste Unterscheidungsmerkmale
- Uses the -3 performance grade (vs. XC6SLX150-2FGG676I)
- Remains within the Spartan-6 LX family (vs. XC6SLX150T-3FG676I)
- Combines 147443 logic cells with a 1.2 V core (vs. XC6SLX150-3FGG676I)
Designhinweise
The device uses a 1.2 V core supply, so separate the core rail from I/O supplies according to the AMD power-architecture guidance. Place the required bulk and high-frequency decoupling capacitors at the associated supply and ground balls, with very short return paths. Validate startup sequencing, voltage tolerances, and power-consumption limits for the exact speed grade and design utilization before releasing the schematic.
Use the AMD Spartan-6 package device pinout files as the authority for all 676 ball assignments and PCB land pattern details. Keep clock routing short and controlled, provide uninterrupted reference planes beneath the device, and route high-speed or differential signals away from switching power-conversion nodes. Because this page does not include a verified 676-ball package diagram, do not infer ball numbering from a similar smaller FPGA package.
The XC6SLX150-3FG676I is specified for a 0 to 85 C operating range, but the board and enclosure determine the actual ambient environment. Estimate the FPGA power from the final utilization and timing report, then check junction temperature against the package-specific limit. Provide copper area and thermal vias under the BGA where permitted by the package guidance, and avoid enclosing the board without a defined heat-transfer path.
Do not approve a replacement solely because it has 676 balls or 147443 logic cells. The XC6SLX150T alternatives identify the LXT family, while -2 alternatives use a lower speed grade, and FGG ordering codes differ from FG676I. Compare package files, temperature grade, pin multiplexing, embedded resources, timing constraints, and the generated bitstream target before changing the approved part number.
Compliance-Informationen
The package listing identifies the 676-BGA device as lead-free. RoHS, REACH, halogen-free, and conflict-minerals status require confirmation from the applicable manufacturer product documentation.
