XC6SLX16-2FTG256I - 14,579-Cell Spartan-6 LX FPGA | AMD
Teilenummer: XC6SLX16-2FTG256I ⚠ Letzte BestellmöglichkeitXC6SLX16-2FTG256I Übersicht
A field-programmable gate array is a semiconductor whose digital logic, memory, and signal-processing blocks are configured after fabrication. In the product hierarchy, an FPGA sits above programmable logic devices and integrates configurable logic, fixed or block memory, DSP processing, clock management, and programmable I/O. This integration allows one package to replace combinations of processors, interface controllers, data converters, and discrete programmable logic while preserving upgradeability through a configuration bitstream.
Key resources include 2,278 adaptive logic modules, 186 user I/Os, 14,579 logic cells, and 1,139 CLBs. The source data also identifies 375 MHz as another stated frequency and gives a core-voltage range of 1.14 V to 1.26 V. The FTG256 package uses a 17 mm by 17 mm body with a 1 mm ball pitch, supporting dense PCB integration without requiring a large leaded package.
The Spartan-6 LX architecture combines programmable logic with block RAM, DSP slices, digital clock managers, and PLLs. Those resources allow parallel data-path designs, protocol bridging, control-plane logic, and fixed-point signal processing to share one FPGA. A 667 MHz stated internal frequency supports demanding clock domains, but achievable system performance remains dependent on the selected design, timing constraints, memory interface implementation, and I/O standards.
Typical uses include industrial control and automation, embedded communications gateways, video and image-processing pipelines, instrumentation, and low-cost data-acquisition systems. In these applications, the 186 I/Os provide connectivity, while the 14,579 logic cells allow control logic and datapaths to be consolidated. The Spartan-6 family is particularly relevant to designs that require FPGA flexibility without moving to a larger or more expensive device family.
Designers should use the official Spartan-6 package pinout files for every FTG256 ball assignment and verify the selected bank supplies, configuration pins, clock-capable pins, and I/O standards against the design constraints. PCB layout must also account for the 1 mm pitch, power and ground distribution, configuration-boot behavior, and high-speed routing required by the implemented interfaces.
This page consolidates the verified specifications, distributor pricing, same-footprint alternatives, and application-oriented design guidance available for the XC6SLX16-2FTG256I. It also distinguishes documented values from unresolved lifecycle, pin-level, and pricing details so engineers can make a traceable sourcing decision.
Drop-in-Alternativen für XC6SLX16-2FTG256I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit XC6SLX16-2FTG256I (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Logic Cells, Speed Grade, Process Technology.
XC6SLX16-2FTG256C
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →XC6SLX16-3FTG256I
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →XC6SLX16-2FT256I
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →XC6SLX16-3FT256I
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →XC6SLX16-1FTG256I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC6SLX16-2FTG256I Grenzwerte & elektrische Eigenschaften
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 14,579 cells |
| Configurable Logic Blocks | 1,139 CLBs |
| Adaptive Logic Modules | 2,278 ALMs |
| User I/Os | 186 I/Os |
| Internal Frequency | 667 MHz |
| Additional Stated Frequency | 375 MHz |
| Core Supply Voltage | 1.14 V to 1.26 V |
| Process Technology | CMOS |
| Gehäuse | FTGBGA-256 |
| Package Body Size | 17 mm x 17 mm |
| Package Ball Pitch | 1.00 mm |
| Lead-Free Status | Lead free |
| Betriebstemperatur | 0°C to 85°C |
| Speed Grade | -2 |
| Embedded Resources | DCM, PLL, block RAM, and DSP |
XC6SLX16-2FTG256I 1.00 mm Pinbelegungsleitfaden
Pinbelegung für XC6SLX16-2FTG256I (1.00 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für XC6SLX16-2FTG256I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
XC6SLX16-2FTG256I ist geeignet für 6 Anwendungs: Industrial Automation and Control, Embedded Communications Gateway, Data Acquisition and Instrumentation, Video and Image Processing, Motor Control and Power Systems, Networked IoT Edge Device.
Industrial Automation and Control
The XC6SLX16-2FTG256I fits industrial automation controllers because it combines 14,579 logic cells, 1,139 CLBs, and 186 I/Os in one Spartan-6 LX device. Parallel control logic, interlocks, counters, and communication protocols can be consolidated without a separate CPLD. Its DCM and PLL resources support deterministic internal clocking, while the 667 MHz stated internal frequency provides headroom for demanding control paths. The verified 0°C to 85°C operating-temperature range should be checked against the cabinet ambient, including heater and fan failures.
Empfohlen
Embedded Communications Gateway
The XC6SLX16-2FTG256I is well suited to protocol conversion and communications gateways because its programmable logic can support multiple serial interfaces while its DSP and block-RAM resources handle framing and buffering. The 186 I/Os allow parallel data paths and status signals to be integrated on the same device. A 1.14 V to 1.26 V core-voltage range supports a partitioned supply architecture, while DCM and PLL blocks simplify clock-domain generation. Timing must be checked against the selected I/O standard and external transceiver propagation delay.
Empfohlen
Data Acquisition and Instrumentation
The XC6SLX16-2FTG256I can implement parallel ADC capture, digital filtering, calibration, and data packing in a single Spartan-6 LX FPGA. Its 186 I/Os provide substantial connectivity to converters, sensors, memory, and host processors, while 14,579 logic cells support acquisition state machines and control logic. The stated 667 MHz internal frequency is useful for timing-critical sampling paths, and block RAM can buffer samples before DMA transfer. Interface voltage, clock jitter, and FPGA I/O timing require board-level verification.
Empfohlen
Video and Image Processing
The XC6SLX16-2FTG256I can support compact video pipelines that require pixel movement, timing generation, filtering, and interface conversion. Its DSP slices and block RAM allow parallel arithmetic and line-buffer functions, while the programmable I/O bank structure supports compatible digital interfaces. With 14,579 logic cells, the device can consolidate frame counters, synchronization, and control beside the datapath. Resolution, refresh rate, pixel clock, and memory bandwidth determine whether the available resources meet the design target.
Empfohlen
Motor Control and Power Systems
The XC6SLX16-2FTG256I is applicable to digital motor controllers, power-conversion controllers, and protection systems where fast deterministic logic is required. The FPGA can execute PWM generation, current sampling, fault handling, and supervisory sequences in parallel, while its 186 I/Os simplify connection to gate drivers and sensors. Its PLLs and DCMs support internal timing, and the 667 MHz stated internal frequency provides ample computational margin. Isolation and gate-drive components must be selected separately for the voltage and safety requirements of the power stage.
Empfohlen
Networked IoT Edge Device
The XC6SLX16-2FTG256I can consolidate sensing, local decision logic, protocol handling, and secure data staging in a compact IoT edge device. Its 14,579 logic cells and 186 I/Os accommodate sensor interfaces and local state machines, while Ethernet or serial companion devices handle network connectivity. Block RAM supports local buffering, and the configurable logic permits field updates without changing the PCB. Designers should assess power consumption, startup configuration, security requirements, and thermal performance rather than relying on logic-cell count alone.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XC6SLX16-2FTG256I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XC6SLX16-2FTG256C | XC6SLX16-3FTG256I | XC6SLX16-2FT256I | XC6SLX16-3FT256I | XC6SLX16-1FTG256I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | FTGBGA-256 | FTGBGA-256 - same package | FTGBGA-256 - same package | FTGBGA-256 - same package | FTGBGA-256 - same package | FTGBGA-256 - same package |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Logic Cells | 14,579 cells | 14,579 cells | 14,579 cells | 14,579 cells | 14,579 cells | 14,579 cells |
| Configurable Logic Blocks | 1,139 CLBs | 1,139 CLBs | 1,139 CLBs | 1,139 CLBs | 1,139 CLBs | 1,139 CLBs |
| User I/Os | 186 I/Os | 186 I/Os | 186 I/Os | 186 I/Os | 186 I/Os | 186 I/Os |
| Speed Grade | -2 | -2 | -3 | -2 | -3 | -1 |
| Temperature Designation | I | C - commercial | I | I | I | I |
Wichtigste Unterscheidungsmerkmale
- Exact logic-density and package match for the commercial-temperature alternative (vs. XC6SLX16-2FTG256C)
- Higher performance option without changing the density or footprint (vs. XC6SLX16-3FTG256I)
- Lower-power timing option for designs with adequate performance margin (vs. XC6SLX16-1FTG256I)
Designhinweise
Use the official Spartan-6 FTG256 package file to assign every BGA ball before releasing the PCB. The verified package is 17 mm by 17 mm with 1.00 mm ball pitch, so escape routing and assembly inspection require the exact land pattern. Confirm configuration pins, clock-capable pins, bank supplies, and I/O standards against the selected Spartan-6 LX resource; pin compatibility with another device does not guarantee that every ball has the same electrical function.
Plan the power architecture around the documented 1.14 V to 1.26 V core-voltage range and the separate I/O supply requirements. Provide low-impedance decoupling at each supply ball group and distribute power and ground planes according to the official Spartan-6 PCB guidelines. The supplied data does not provide current ratings or power dissipation, so thermal calculations require the selected device's official electrical data. Estimated: P_D = (V_IN - V_OUT) x I_OUT, using the actual rail difference and load current.
Preserve clock and high-speed data routing quality through short return paths, continuous reference planes, and controlled impedance. Use DCM and PLL outputs only after checking the supported clock inputs and generated-clock constraints in the implementation tools. The stated 667 MHz internal frequency does not guarantee that an external interface can operate at that rate; the limiting factors include I/O standards, package pins, PCB loss, skew, and source-synchronous timing.
Do not treat the FTG256 footprint alone as proof of functional interchangeability. The AMD support result notes that pins unavailable in smaller Spartan-6 LX devices may become no-connects in larger ones. Likewise, the -1, -2, and -3 speed grades and C versus I temperature designations alter performance or operating limits. Compare the configuration bitstream, utilization, timing, memory, power, boot behavior, and every ball assignment before releasing a replacement order.
Compliance-Informationen
The verified package snippets identify the XC6SLX16-2FTG256I as lead free. No explicit RoHS, REACH, AEC-Q100, halogen-free, or conflict-minerals statement was present in the supplied results.
