XC6SLX16-2FTG256I - 14,579-Cell Spartan-6 LX FPGA | AMD
Référence : XC6SLX16-2FTG256I ⚠ Dernier achatXC6SLX16-2FTG256I Présentation
A field-programmable gate array is a semiconductor whose digital logic, memory, and signal-processing blocks are configured after fabrication. In the product hierarchy, an FPGA sits above programmable logic devices and integrates configurable logic, fixed or block memory, DSP processing, clock management, and programmable I/O. This integration allows one package to replace combinations of processors, interface controllers, data converters, and discrete programmable logic while preserving upgradeability through a configuration bitstream.
Key resources include 2,278 adaptive logic modules, 186 user I/Os, 14,579 logic cells, and 1,139 CLBs. The source data also identifies 375 MHz as another stated frequency and gives a core-voltage range of 1.14 V to 1.26 V. The FTG256 package uses a 17 mm by 17 mm body with a 1 mm ball pitch, supporting dense PCB integration without requiring a large leaded package.
The Spartan-6 LX architecture combines programmable logic with block RAM, DSP slices, digital clock managers, and PLLs. Those resources allow parallel data-path designs, protocol bridging, control-plane logic, and fixed-point signal processing to share one FPGA. A 667 MHz stated internal frequency supports demanding clock domains, but achievable system performance remains dependent on the selected design, timing constraints, memory interface implementation, and I/O standards.
Typical uses include industrial control and automation, embedded communications gateways, video and image-processing pipelines, instrumentation, and low-cost data-acquisition systems. In these applications, the 186 I/Os provide connectivity, while the 14,579 logic cells allow control logic and datapaths to be consolidated. The Spartan-6 family is particularly relevant to designs that require FPGA flexibility without moving to a larger or more expensive device family.
Designers should use the official Spartan-6 package pinout files for every FTG256 ball assignment and verify the selected bank supplies, configuration pins, clock-capable pins, and I/O standards against the design constraints. PCB layout must also account for the 1 mm pitch, power and ground distribution, configuration-boot behavior, and high-speed routing required by the implemented interfaces.
This page consolidates the verified specifications, distributor pricing, same-footprint alternatives, and application-oriented design guidance available for the XC6SLX16-2FTG256I. It also distinguishes documented values from unresolved lifecycle, pin-level, and pricing details so engineers can make a traceable sourcing decision.
Alternatives de remplacement direct pour XC6SLX16-2FTG256I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC6SLX16-2FTG256I (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Logic Cells, Speed Grade, Process Technology.
XC6SLX16-2FTG256C
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX16-3FTG256I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX16-2FT256I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX16-3FT256I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX16-1FTG256I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC6SLX16-2FTG256I Valeurs maximales et caractéristiques électriques
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 14,579 cells |
| Configurable Logic Blocks | 1,139 CLBs |
| Adaptive Logic Modules | 2,278 ALMs |
| User I/Os | 186 I/Os |
| Internal Frequency | 667 MHz |
| Additional Stated Frequency | 375 MHz |
| Core Supply Voltage | 1.14 V to 1.26 V |
| Process Technology | CMOS |
| Boîtier | FTGBGA-256 |
| Package Body Size | 17 mm x 17 mm |
| Package Ball Pitch | 1.00 mm |
| Lead-Free Status | Lead free |
| Température de fonctionnement | 0°C to 85°C |
| Speed Grade | -2 |
| Embedded Resources | DCM, PLL, block RAM, and DSP |
Guide de configuration des broches du XC6SLX16-2FTG256I 1.00 mm
Configuration des broches du XC6SLX16-2FTG256I (boîtier 1.00 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC6SLX16-2FTG256I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC6SLX16-2FTG256I convient pour 6 applications: Industrial Automation and Control, Embedded Communications Gateway, Data Acquisition and Instrumentation, Video and Image Processing, Motor Control and Power Systems, Networked IoT Edge Device.
Industrial Automation and Control
The XC6SLX16-2FTG256I fits industrial automation controllers because it combines 14,579 logic cells, 1,139 CLBs, and 186 I/Os in one Spartan-6 LX device. Parallel control logic, interlocks, counters, and communication protocols can be consolidated without a separate CPLD. Its DCM and PLL resources support deterministic internal clocking, while the 667 MHz stated internal frequency provides headroom for demanding control paths. The verified 0°C to 85°C operating-temperature range should be checked against the cabinet ambient, including heater and fan failures.
Recommandé
Embedded Communications Gateway
The XC6SLX16-2FTG256I is well suited to protocol conversion and communications gateways because its programmable logic can support multiple serial interfaces while its DSP and block-RAM resources handle framing and buffering. The 186 I/Os allow parallel data paths and status signals to be integrated on the same device. A 1.14 V to 1.26 V core-voltage range supports a partitioned supply architecture, while DCM and PLL blocks simplify clock-domain generation. Timing must be checked against the selected I/O standard and external transceiver propagation delay.
Recommandé
Data Acquisition and Instrumentation
The XC6SLX16-2FTG256I can implement parallel ADC capture, digital filtering, calibration, and data packing in a single Spartan-6 LX FPGA. Its 186 I/Os provide substantial connectivity to converters, sensors, memory, and host processors, while 14,579 logic cells support acquisition state machines and control logic. The stated 667 MHz internal frequency is useful for timing-critical sampling paths, and block RAM can buffer samples before DMA transfer. Interface voltage, clock jitter, and FPGA I/O timing require board-level verification.
Recommandé
Video and Image Processing
The XC6SLX16-2FTG256I can support compact video pipelines that require pixel movement, timing generation, filtering, and interface conversion. Its DSP slices and block RAM allow parallel arithmetic and line-buffer functions, while the programmable I/O bank structure supports compatible digital interfaces. With 14,579 logic cells, the device can consolidate frame counters, synchronization, and control beside the datapath. Resolution, refresh rate, pixel clock, and memory bandwidth determine whether the available resources meet the design target.
Recommandé
Motor Control and Power Systems
The XC6SLX16-2FTG256I is applicable to digital motor controllers, power-conversion controllers, and protection systems where fast deterministic logic is required. The FPGA can execute PWM generation, current sampling, fault handling, and supervisory sequences in parallel, while its 186 I/Os simplify connection to gate drivers and sensors. Its PLLs and DCMs support internal timing, and the 667 MHz stated internal frequency provides ample computational margin. Isolation and gate-drive components must be selected separately for the voltage and safety requirements of the power stage.
Recommandé
Networked IoT Edge Device
The XC6SLX16-2FTG256I can consolidate sensing, local decision logic, protocol handling, and secure data staging in a compact IoT edge device. Its 14,579 logic cells and 186 I/Os accommodate sensor interfaces and local state machines, while Ethernet or serial companion devices handle network connectivity. Block RAM supports local buffering, and the configurable logic permits field updates without changing the PCB. Designers should assess power consumption, startup configuration, security requirements, and thermal performance rather than relying on logic-cell count alone.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC6SLX16-2FTG256I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC6SLX16-2FTG256C | XC6SLX16-3FTG256I | XC6SLX16-2FT256I | XC6SLX16-3FT256I | XC6SLX16-1FTG256I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | FTGBGA-256 | FTGBGA-256 - same package | FTGBGA-256 - same package | FTGBGA-256 - same package | FTGBGA-256 - same package | FTGBGA-256 - same package |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Logic Cells | 14,579 cells | 14,579 cells | 14,579 cells | 14,579 cells | 14,579 cells | 14,579 cells |
| Configurable Logic Blocks | 1,139 CLBs | 1,139 CLBs | 1,139 CLBs | 1,139 CLBs | 1,139 CLBs | 1,139 CLBs |
| User I/Os | 186 I/Os | 186 I/Os | 186 I/Os | 186 I/Os | 186 I/Os | 186 I/Os |
| Speed Grade | -2 | -2 | -3 | -2 | -3 | -1 |
| Temperature Designation | I | C - commercial | I | I | I | I |
Principaux différenciateurs
- Exact logic-density and package match for the commercial-temperature alternative (vs XC6SLX16-2FTG256C)
- Higher performance option without changing the density or footprint (vs XC6SLX16-3FTG256I)
- Lower-power timing option for designs with adequate performance margin (vs XC6SLX16-1FTG256I)
Notes de conception
Use the official Spartan-6 FTG256 package file to assign every BGA ball before releasing the PCB. The verified package is 17 mm by 17 mm with 1.00 mm ball pitch, so escape routing and assembly inspection require the exact land pattern. Confirm configuration pins, clock-capable pins, bank supplies, and I/O standards against the selected Spartan-6 LX resource; pin compatibility with another device does not guarantee that every ball has the same electrical function.
Plan the power architecture around the documented 1.14 V to 1.26 V core-voltage range and the separate I/O supply requirements. Provide low-impedance decoupling at each supply ball group and distribute power and ground planes according to the official Spartan-6 PCB guidelines. The supplied data does not provide current ratings or power dissipation, so thermal calculations require the selected device's official electrical data. Estimated: P_D = (V_IN - V_OUT) x I_OUT, using the actual rail difference and load current.
Preserve clock and high-speed data routing quality through short return paths, continuous reference planes, and controlled impedance. Use DCM and PLL outputs only after checking the supported clock inputs and generated-clock constraints in the implementation tools. The stated 667 MHz internal frequency does not guarantee that an external interface can operate at that rate; the limiting factors include I/O standards, package pins, PCB loss, skew, and source-synchronous timing.
Do not treat the FTG256 footprint alone as proof of functional interchangeability. The AMD support result notes that pins unavailable in smaller Spartan-6 LX devices may become no-connects in larger ones. Likewise, the -1, -2, and -3 speed grades and C versus I temperature designations alter performance or operating limits. Compare the configuration bitstream, utilization, timing, memory, power, boot behavior, and every ball assignment before releasing a replacement order.
Informations de conformité
The verified package snippets identify the XC6SLX16-2FTG256I as lead free. No explicit RoHS, REACH, AEC-Q100, halogen-free, or conflict-minerals statement was present in the supplied results.
