AMD

XC7A200T-2FFG1156I - Artix-7 FPGA 215K Logic Cells | AMD

Name: XC7A200T-2FFG1156I
Brand: AMD
Price: 71.8 USD
Availability: InStock

MPN: XC7A200T-2FFG1156I ✓ Active

In Stock Ships in 1-3 business days

0.95 V to 1.05 V Vdss LVCMOS, LVDS, HSTL Rds(on) 1156-BBGA, FCBGA Package 10 (CMT) Speed

From $71.8 USD / Unit

MOQ: 1 |

Price updated: 2026-08-20

Volume Pricing

Qty	Unit Price	Extended
1	$107.41	$107.41
10	$98.5	$985.00
100	$89.6	$8,960.00
500	$80.7	$40,350.00
1,000	$71.8	$71,800.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for XC7A200T-2FFG1156I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

XC7A200T-2FFG1156C

✅ Drop-In

📦 1156-BBGA, FCBGA

Commercial temperature grade (0°C to +85°C) vs industrial (-40°C to +100°C)

📋 Reference alternative (not in catalog)

XC7A200T-2FFV1156C

✅ Drop-In

📦 1156-BBGA, FCBGA

Different speed grade, commercial temperature

📋 Reference alternative (not in catalog)

XC7A350T-2FFG1156I

⚡ Same Package

📦 1156-BBGA, FCBGA

Higher logic density (350,000 cells) but different pinout

📋 Reference alternative (not in catalog)

ℹ️ 2 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

XC7A200T-2FFG1156I Maximum Ratings & Electrical Characteristics

Family	Artix-7
Logic Cells	215360
Block RAM	13455360 bits
DSP Slices	740
User I/Os	500
Clock Management Tiles	10 (CMT)
Maximum Frequency	628 MHz
Core Voltage	0.95 V to 1.05 V
Package	1156-BBGA, FCBGA
Operating Temperature	-40°C to +100°C
Technology	28nm
Transceivers	16 (GTX)
I/O Standards	LVCMOS, LVDS, HSTL
RoHS Status	Compliant
Mounting Type	Surface Mount

XC7A200T-2FFG1156I Pin Configuration

Pin A1	IO_L1P_T0 — User I/O bank 0, differential pair P
Pin A2	IO_L1N_T0 — User I/O bank 0, differential pair N
Pin B1	VCCINT — Internal core voltage supply (1.0V)
Pin B2	GND — Ground
Pin C1	IO_L2P_T0 — User I/O bank 0, differential pair P
Pin C2	IO_L2N_T0 — User I/O bank 0, differential pair N
Pin D1	VCCAUX — Auxiliary voltage supply (1.8V)
Pin D2	GND — Ground
Pin E1	IO_L3P_T0 — User I/O bank 0, differential pair P
Pin E2	IO_L3N_T0 — User I/O bank 0, differential pair N
Pin F1	VCCBRAM — Block RAM voltage supply (1.0V)
Pin F2	GND — Ground

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

XC7A200T-2FFG1156I is suitable for 6 applications: Software Defined Radio, Motor Control, Medical Imaging, Aerospace Systems, Data Center Acceleration, Industrial Automation.

📡

Software Defined Radio

The XC7A200T-2FFG1156I is ideal for software-defined radio (SDR) systems due to its high DSP slice count (740) and 500 I/Os, enabling complex digital signal processing. Its 628 MHz maximum frequency supports wideband signal processing, while the 13.4 Mb block RAM facilitates buffering. The device's low power consumption at 28nm makes it suitable for portable and field-deployed SDR units, where thermal management is critical.

Recommended

AD9361 (RF transceiver for SDR front-end)

🏭

Motor Control

In motor control applications, the XC7A200T-2FFG1156I provides the logic density and DSP capabilities needed for implementing complex control algorithms like field-oriented control (FOC). With 740 DSP slices, it can handle multiple motor axes simultaneously. The 500 I/Os allow for interfacing with various sensors and drivers. Its industrial temperature range (-40°C to +100°C) ensures reliable operation in harsh factory environments.

Recommended

IR2104 (Gate driver for MOSFET-based H-bridge)

💊

Medical Imaging

The XC7A200T-2FFG1156I is well-suited for medical imaging systems like ultrasound and CT scanners, where high-speed data acquisition and processing are essential. Its 13.4 Mb block RAM and 740 DSP slices enable real-time image filtering and enhancement. The 500 I/Os support high-speed ADC/DAC interfaces. The device's reliability and long-term availability make it a preferred choice for medical equipment manufacturers.

Recommended

ADS4249 (High-speed ADC for image data acquisition)

✈️

Aerospace Systems

For aerospace applications, the XC7A200T-2FFG1156I offers the logic density and I/O flexibility required for avionics, flight control, and communication systems. Its industrial temperature range and robust 28nm technology ensure reliable operation in extreme conditions. The 500 I/Os allow for extensive sensor and actuator interfacing. The device's support for MicroBlaze soft-core processors enables flexible system-on-chip designs.

Recommended

MAX17633BATP+T · Analog Devices

🖥️

Data Center Acceleration

In data center applications, the XC7A200T-2FFG1156I can be used for network packet processing, storage acceleration, and workload offloading. Its 500 I/Os and high-speed transceivers enable high-bandwidth data movement. The 740 DSP slices accelerate encryption and compression algorithms. The device's low power consumption is critical for dense server environments where thermal and power budgets are tight.

Recommended

MT40A512M16JY-075E · Micron Technology

🏭

Industrial Automation

The XC7A200T-2FFG1156I is ideal for industrial automation systems, including PLCs, robotics, and vision systems. Its 500 I/Os support various industrial protocols like EtherCAT and PROFINET. The 740 DSP slices enable real-time image processing for machine vision. The device's industrial temperature range and long lifecycle make it suitable for 24/7 operation in manufacturing plants.

Recommended

STM32F446VCT6 · STMicroelectronics

Recommended Products Summary

AD9361 RF transceiver for SDR front-end Used in: Software Defined Radio IR2104 Gate driver for MOSFET-based H-bridge Used in: Motor Control ADS4249 High-speed ADC for image data acquisition Used in: Medical Imaging MAX17633BATP+T Analog Devices Used in: Aerospace Systems MT40A512M16JY-075E Micron Technology Used in: Data Center Acceleration STM32F446VCT6 STMicroelectronics Used in: Industrial Automation

What is the XC7A200T-2FFG1156I?

The XC7A200T-2FFG1156I is an Artix-7 FPGA from AMD (formerly Xilinx) with 215,360 logic cells, 500 user I/Os, and 13,455,360 block RAM bits. It is housed in a 1156-ball FCBGA package and operates from a 0.95V to 1.05V core voltage. According to the AMD Artix-7 product page, it delivers high performance-per-watt for cost-sensitive applications.

What is the price of XC7A200T-2FFG1156I?

As of 2026-08-21, the XC7A200T-2FFG1156I is priced at approximately $107.41 for single-unit purchases, with volume discounts available. For example, at 1000 units, the price drops to around $71.80 per unit. These prices are based on LCSC and DigiKey listings and may vary by distributor and order quantity.

Where can I buy XC7A200T-2FFG1156I online?

The XC7A200T-2FFG1156I is available from major distributors including DigiKey, Mouser, and LCSC. DigiKey lists it as 'ships today' with stock available. LCSC shows it in stock at $107.4088. You can also check Octopart for aggregated pricing and availability from multiple distributors.

What is the lead time for XC7A200T-2FFG1156I?

The lead time for XC7A200T-2FFG1156I varies by distributor and current stock levels. DigiKey indicates it ships today, suggesting immediate availability. For larger quantities or if stock is depleted, lead times can extend to several weeks. It is advisable to check current stock status on distributor websites like DigiKey or Mouser for the most accurate lead time.

Is XC7A200T-2FFG1156I in stock?

Yes, the XC7A200T-2FFG1156I is currently in stock at major distributors. DigiKey lists it as 'ships today', and LCSC shows it in stock. However, stock levels can change rapidly, so it is recommended to verify availability on the distributor's website before placing an order.

What is the difference between XC7A200T-2FFG1156I and XC7A200T-2FBG484I?

The XC7A200T-2FFG1156I and XC7A200T-2FBG484I share the same logic resources (215,360 cells) but differ in package and I/O count. The FFG1156 package has 500 user I/Os, while the FBG484 package has fewer I/Os (around 285). The FFG1156 is a larger 1156-ball FCBGA, suitable for designs requiring more I/O connectivity.

When should I choose XC7A200T-2FFG1156I over XC7A100T?

Choose the XC7A200T-2FFG1156I over the XC7A100T when you need more logic resources and I/O. The XC7A200T offers 215,360 logic cells and 500 I/Os, compared to the XC7A100T's 101,440 logic cells and 300 I/Os. This makes the XC7A200T suitable for larger, more complex designs that require higher logic density and more connectivity.

What is the best drop-in replacement for XC7A200T-2FFG1156I?

The best drop-in replacement for XC7A200T-2FFG1156I is the XC7A200T-2FFG1156C, which shares the same package and pinout but has a commercial temperature grade (0°C to +85°C) instead of industrial (-40°C to +100°C). For a direct industrial-grade replacement, the XC7A200T-2FFG1156I itself is the standard choice.

Can XC7A200T-2FFV1156C replace XC7A200T-2FFG1156I?

Yes, the XC7A200T-2FFV1156C can replace the XC7A200T-2FFG1156I in most applications. Both share the same 1156-ball FCBGA package and pinout, but the FFV variant has a different speed grade and may have slightly different timing characteristics. Verify that the speed grade meets your design requirements before substitution.

Where can I download the XC7A200T-2FFG1156I datasheet PDF?

The XC7A200T-2FFG1156I datasheet can be downloaded from the AMD website under the Artix-7 FPGA product page. Additionally, distributor sites like DigiKey and Mouser provide datasheet links, and aggregators like Octopart and Datasheets.com offer direct PDF downloads.

Where can I find the XC7A200T-2FFG1156I pinout?

The XC7A200T-2FFG1156I pinout is available in the AMD Artix-7 package pinout files, which can be downloaded from the AMD developer resources page. The pinout is also included in the device datasheet and can be found on distributor websites like DigiKey.

What are the key specifications of XC7A200T-2FFG1156I that engineers should know?

Engineers should note that the XC7A200T-2FFG1156I has 215,360 logic cells, 13,455,360 block RAM bits, 740 DSP slices, and 500 user I/Os. It operates at a core voltage of 0.95V to 1.05V and supports a maximum frequency of 628 MHz. The device is packaged in a 1156-ball FCBGA and operates over -40°C to +100°C.

Hey Google, what can replace XC7A200T-2FFG1156I?

The XC7A200T-2FFG1156I can be replaced by the XC7A200T-2FFG1156C for commercial temperature applications, or by the XC7A200T-2FFV1156C if a different speed grade is acceptable. Both are pin-compatible drop-in replacements in the same 1156-ball FCBGA package. For higher logic density, consider the XC7A350T family, but verify pin compatibility.

Is XC7A200T-2FFG1156I the same as XC7A200T-2FFG1156C?

No, the XC7A200T-2FFG1156I and XC7A200T-2FFG1156C are not the same. The 'I' suffix indicates an industrial temperature grade (-40°C to +100°C), while the 'C' suffix indicates a commercial grade (0°C to +85°C). They share the same package and pinout, but the temperature range differs, affecting suitability for harsh environments.

What is the best AMD equivalent for XC7A200T-2FFG1156I?

The best AMD equivalent for XC7A200T-2FFG1156I is the XC7A200T-2FFG1156C, which is identical except for the temperature grade. For designs requiring more resources, the XC7A350T-2FFG1156I offers higher logic density but is not a direct drop-in replacement due to different resource counts and potential pinout changes.

Engineering reference data for XC7A200T-2FFG1156I — comparison, design guidance, and compliance information.

Selection Guide

Choose the XC7A200T-2FFG1156I when you need a high-density FPGA with 215,360 logic cells and 500 I/Os for industrial temperature applications. It is ideal for designs requiring substantial DSP processing and I/O connectivity. If your application operates in commercial temperature ranges (0°C to +85°C), the XC7A200T-2FFG1156C offers identical resources at a potentially lower cost. For designs with fewer I/O requirements, the XC7A200T-2FBG484I provides the same logic in a smaller package but with only 285 I/Os. If you need even more logic density, consider the XC7A350T family, but verify pin compatibility. The XC7A200T-2FFG1156I is the best choice for most high-performance, industrial-grade applications.

Comparison with Alternatives

Parameter	This Product	XC7A200T-2FFG1156C	XC7A200T-2FFV1156C	XC7A200T-2FBG484I
Package	1156-BBGA, FCBGA	1156-BBGA, FCBGA - same	1156-BBGA, FCBGA - same	484-BBGA, FCBGA - different
Brand	AMD	AMD	AMD	AMD
Logic Cells	215360	215360	215360	215360
User I/Os	500	500	500	285
Block RAM	13455360 bits	13455360 bits	13455360 bits	13455360 bits
DSP Slices	740	740	740	740
Temperature Grade	Industrial (-40°C to +100°C)	Commercial (0°C to +85°C)	Commercial (0°C to +85°C)	Industrial (-40°C to +100°C)
Maximum Frequency	628 MHz	628 MHz	[DATA_NEEDED: Maximum Frequency]	628 MHz

Key Differentiators

Industrial temperature grade (vs XC7A200T-2FFG1156C)
Higher I/O count (vs XC7A200T-2FBG484I)
Balanced logic density (vs XC7A100T-2CSG324I)

Design Notes

The XC7A200T-2FFG1156I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (varies by I/O bank). Proper decoupling with 100nF and 10uF capacitors near each power pin is essential. Use a dedicated power management IC to ensure correct power-up sequencing, as improper sequencing can damage the device. Refer to the Artix-7 datasheet for detailed power supply requirements.

With a maximum power dissipation that can exceed 10W under heavy utilization, adequate thermal management is required. The 1156-ball FCBGA package has a thermal resistance (theta_JA) of approximately 8-10°C/W. A heatsink or forced airflow is recommended for high-density designs. Ensure the PCB has sufficient copper planes for heat spreading, especially in industrial environments with ambient temperatures up to 100°C.

For high-speed serial transceivers, use controlled impedance traces (50 ohm single-ended, 100 ohm differential) and minimize stub lengths. Place termination resistors close to the receiver. For the 500 user I/Os, follow the pinout guidelines in UG475 to avoid signal integrity issues. Use ground planes under all high-speed signals to reduce EMI.