XC7K160T-1FB676I - Kintex-7 162240-Cell FPGA | AMD
Teilenummer: XC7K160T-1FB676I ✓ AktivXC7K160T-1FB676I Übersicht
A Kintex-7 FPGA belongs to the programmable-logic hierarchy: field-programmable gate array, FPGA, programmable-logic device, and semiconductor. Unlike a fixed-function ASIC or microcontroller, an FPGA combines configurable logic blocks, programmable interconnects, block RAM, DSP resources, and selectable I/O standards on one device. This makes the family useful when hardware architecture must be updated after design entry, when parallel processing is required, or when product variants share a common board design.
The XC7K160T combines 162,240 logic cells with 400 user I/O in the 676-BBGA FCBGA package. The 28 nm process technology supports a compact, high-performance implementation, and the listed 1 V core supply is a key constraint for power planning and configuration. The -1 speed designation places the device in the Kintex-7 performance range identified alongside the -3, -2, -1L, and -2L grades.
Design engineers must treat this BGA package as a high-speed, multi-supply design rather than a simple two-rail component. Signal-integrity analysis, simultaneous switching-noise control, plane splitting, and thermal management become essential because the device concentrates many programmable and high-speed resources into one package. Configuration storage, startup sequencing, clocking, and power estimation should be evaluated together before schematic capture.
Typical applications include industrial control and automation, communications infrastructure, test and measurement, high-speed signal processing, embedded imaging, and aerospace or defense systems requiring programmable logic. The 400 available I/O is particularly useful for parallel sensor acquisition, control interfaces, memory buses, clock distribution, and multiple communication links implemented in programmable logic.
For a new design, use the AMD Kintex-7 data sheet and package files to establish the exact pinout, differential-pair rules, power rails, and PCB stack-up. Treat any board migration to another 676-ball package variant as requiring a formal ball-map, power, timing, and signal-integrity review rather than an assumption of interchangeability.
This product record combines the verified device identity, package information, speed and temperature distinctions, same-footprint alternatives, comparison parameters, and practical FPGA design guidance to support component selection and PCB planning without relying on generic FPGA assumptions.
Drop-in-Alternativen für XC7K160T-1FB676I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit XC7K160T-1FB676I (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade.
XC7K160T-1FBG676I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC7K160T-1FFG676I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7K160T-2FFG676I
✅ Drop-In ⚠️ Spezifikationen ungeprüftPreis auf Anfrage
Datenblatt ansehen →GX1P170
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC7K160T-1FB676I Grenzwerte & elektrische Eigenschaften
| Device Type | Kintex-7 FPGA |
| Programmable Logic Cells | 162,240 cells |
| User I/O | 400 I/O |
| Process Technology | 28 nm |
| Core Supply Voltage | 1 V |
| Gehäuse | 676-BBGA FCBGA |
| Ball Count | 676 balls |
| Speed Grade | -1 |
| Temperature Grade | Industrial |
| FPGA Family | Kintex-7 |
| Logic Cell Count | 162,240 cells |
| Architecture | 28 nm Kintex-7 FPGA |
| Device Classification | Field Programmable Gate Array (FPGA) |
| Logic Resource Density | 162,240 programmable logic cells |
| Package Type | FCBGA surface-mount package |
| Montageart | Surface Mount |
XC7K160T-1FB676I fcbga surface-mount package Pinbelegungsleitfaden
Pinbelegung für XC7K160T-1FB676I (fcbga surface-mount package-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für XC7K160T-1FB676I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
XC7K160T-1FB676I ist geeignet für 6 Anwendungs: Industrial Control and Automation, Communications and Network Infrastructure, Test and Measurement Systems, High-Speed Signal Processing, Embedded Imaging and Sensor Processing, Aerospace, Defense, and Mission Systems.
Industrial Control and Automation
The XC7K160T-1FB676I suits industrial controllers that combine deterministic parallel logic with numerous field-bus, digital I/O, and acquisition interfaces. Its 162,240 programmable logic cells provide substantial room for protocol controllers, timing logic, interlocks, and data paths, while 400 user I/O support dense external connections. The 28 nm Kintex-7 implementation and industrial-temperature ordering code suit equipment requiring programmable field behavior and updateable logic. Place the device on a multilayer PCB with carefully planned power planes and thermal copper, and validate worst-case timing, I/O standards, and system availability across the required industrial temperature range.
Empfohlen
Communications and Network Infrastructure
For communications equipment, the XC7K160T-1FB676I can implement parallel packet processing, clock recovery, line-rate interfaces, and test or monitoring logic in programmable hardware. Its 400 user I/O are useful for parallel buses and multiple differential interfaces, while the 162,240 logic cells permit high-throughput parallel-to-serial and protocol-processing architectures. The 1 V core supply and 28 nm process demand careful rail sequencing and power estimation in the board design. Engineers should use AMD timing and power constraints for the -1 speed grade and complete signal-integrity analysis for every high-speed interface.
Empfohlen
Test and Measurement Systems
The XC7K160T-1FB676I is appropriate for modular test and measurement platforms requiring configurable acquisition logic, timing generation, pattern processing, and interface aggregation. Programmable logic can implement measurement-specific pipelines and protocols without relying on a fixed controller architecture, while 400 user I/O provide substantial connection capacity. The -1 speed grade supports demanding synchronous logic, and the industrial-temperature ordering code fits laboratory and production-test equipment with controlled ambient conditions. Validate acquisition timing with the AMD timing analyzer, reserve resources for debug logic, and design the FCBGA footprint with the manufacturer-recommended stack-up and thermal path.
Empfohlen
High-Speed Signal Processing
The XC7K160T-1FB676I can support parallel filtering, modulation, correlation, FFT-related pipelines, and other fixed-latency signal-processing functions implemented across its 162,240 logic cells. Four hundred user I/O allow wide parallel data paths into and out of the FPGA, which can be advantageous when throughput is more important than minimizing pin count. The 28 nm process and 1 V core supply offer a modern logic implementation, but sustained processing requires a disciplined power budget. Use vendor timing estimates and board measurements to determine whether the -1 grade or a faster same-footprint grade is needed for timing closure.
Empfohlen
Embedded Imaging and Sensor Processing
The XC7K160T-1FB676I is suitable for embedded imaging systems that combine sensor capture, pixel processing, color conversion, compression, and interface formatting in one programmable device. Its large logic population can host parallel image pipelines and control functions, while 400 user I/O permit connection to image sensors, memory devices, and external processors. The industrial-temperature ordering code supports industrial imaging equipment, provided the complete system thermal design remains within the specified limits. Plan memory interfaces with timing constraints, separate sensitive and noisy supplies where required, and preserve the manufacturer's recommended decoupling and ball-escape geometry.
Empfohlen
Aerospace, Defense, and Mission Systems
The XC7K160T-1FB676I can serve as a programmable core in mission-oriented systems where logic density, extensive I/O, and field updateability are important. The Kintex-7 architecture supports parallel processing, data acquisition, communications, and control functions, while the 676-ball FCBGA limits connector count compared with leaded packages. An industrial-grade ordering designation is not automatically a substitute for a specifically qualified aerospace or defense part number, so the procurement specification must be checked carefully. Qualification, radiation, temperature, software support, and lifecycle requirements should be resolved before the device is approved for a flight or safety-critical program.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XC7K160T-1FB676I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XC7K160T-1FBG676I | XC7K160T-2FBG676I | XC7K160T-1FFG676I | XC7K160T-2FFG676I | GX1P170 |
|---|---|---|---|---|---|---|
| Package | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-ball FCBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | GXC |
Wichtigste Unterscheidungsmerkmale
- Matches the closest same-density Kintex-7 migration option on the principal listed resources (vs. XC7K160T-1FBG676I)
- Provides a faster same-footprint migration path without increasing the listed package ball count (vs. XC7K160T-2FBG676I)
- Supports a distinct cross-manufacturer migration route for qualified 676-ball designs (vs. GX1P170)
Designhinweise
Design the 1 V core rail and all auxiliary rails as a tightly controlled multi-supply system. Follow the AMD power-guidance document for rail sequencing, ramp limits, decoupling, and current estimation rather than relying on a generic BGA power plan. Place local high-frequency decoupling at the device supply balls, use multiple connections where the package allows, and verify that power-source impedance remains acceptable at the switching frequencies present in the design.
Use the exact AMD 676-ball package file for land patterns, ball assignments, and escape routing. A multilayer stack-up with adjacent ground and power planes is generally required to provide return paths and distribute the multi-rail supply network. Keep high-speed nets away from plane splits, preserve the manufacturer's via and antipad recommendations, and complete density, drill, solder-mask, and assembly checks against the selected fabricator's process capability.
Establish a thermal path through the FCBGA into the PCB before committing to enclosure geometry. Place thermal vias according to the package and board guidance, avoid voids beneath the device where practical, and use copper areas to spread heat without compromising high-speed return paths. Validate the design with estimated FPGA activity, the exact -1 speed grade, ambient temperature, airflow, and neighboring heat sources rather than relying on nominal logic utilization alone.
Apply the AMD Kintex-7 select I/O and package constraints to every high-speed interface. Check board skew, loss, reflection, crosstalk, and reference-plane continuity through simulation or measurement. Differential pairs and other sensitive nets require geometry that matches the selected device constraints, while configuration and JTAG paths should remain serviceable for manufacturing test and field debugging.
Compliance-Informationen
No explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status was established for the exact ordering code. Industrial temperature designation does not by itself establish AEC-Q100 qualification.
