XC7VH870T-2FLG1932I - Virtex-7 HT FPGA, 876K Logic Cells | AMD
Teilenummer: XC7VH870T-2FLG1932I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18950 | $18.950,00 |
| 10 | $17850 | $178.500,00 |
| 100 | $16800 | $1.680.000,00 |
| 500 | $15800 | $7.900.000,00 |
| 1.000 | $14900 | $14.900.000,00 |
XC7VH870T-2FLG1932I Übersicht
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the designer after manufacturing, allowing for custom digital logic implementation. FPGAs sit within the broader hierarchy of programmable logic devices, which are a subset of integrated circuits. They offer a unique balance of performance and flexibility, enabling rapid prototyping and hardware acceleration without the high non-recurring engineering costs of ASICs. The Virtex-7 HT family specifically targets high-throughput serial connectivity and signal processing.
Key features of the XC7VH870T-2FLG1932I include its massive logic density, which supports complex algorithms and large-scale parallel processing. The 51.98 Mb of block RAM provides substantial on-chip data storage, reducing the need for external memory in many designs. The 300 user I/Os, combined with high-speed transceivers, enable high-bandwidth data movement. The -2 speed grade offers a balanced performance-power trade-off, while the industrial temperature range (-40C to +100C) ensures reliable operation in harsh environments.
Technically, this device is built on AMD's advanced 28nm process technology, which contributes to its high logic density and power efficiency. The architecture includes dedicated DSP slices for high-speed arithmetic operations, and flexible clock management tiles for precise timing. The 1932-ball FCBGA package provides excellent thermal and electrical characteristics, supporting the high pin count and signal integrity required for complex system integration.
Typical applications include high-performance computing, wired and wireless communications infrastructure, aerospace and defense systems, and advanced medical imaging. Its high transceiver count and logic capacity make it ideal for implementing massive MIMO base stations, high-end network switches, and radar signal processing. The industrial temperature grade also suits it for ruggedized computing platforms.
When designing with this device, careful attention must be paid to power delivery and decoupling. The 0.97V to 1.03V core supply requires a robust power distribution network with multiple decoupling capacitors to maintain signal integrity and prevent voltage droop under high switching activity.
Drop-in-Alternativen für XC7VH870T-2FLG1932I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
XC7VH870T-2FLG1932C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC7VH870T-2FFG1932I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC7VH870T-G2FLG1932E
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC7VX690T-2FLG1932I
⚡ Gleiches Gehäuse ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7V2000T-2FLG1932I
⚡ Gleiches Gehäuse ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7VH870T-2FLG1932I Grenzwerte & elektrische Eigenschaften
| Family | Virtex-7 HT |
| Logic Cells | 876,160 |
| Configurable Logic Blocks (CLBs) | 68,450 |
| Total RAM Bits | 51,978,240 |
| Number of I/Os | 300 |
| Core Supply Voltage | 0.97 V to 1.03 V |
| Gehäuse | 1932-FCBGA (45x45 mm) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +100C (Industrial) |
| Speed Grade | -2 |
| Combinatorial Delay | 0.610 ns (max) |
| RoHS-Status | Compliant |
XC7VH870T-2FLG1932I Pin-Konfiguration
| Pin A1 | GND — Ground |
| Pin A2 | VCCINT — Internal core supply (0.97V-1.03V) |
| Pin B1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| Pin B2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| Pin C1 | VCCAUX — Auxiliary supply (1.8V) |
| Pin C2 | GND — Ground |
| Pin D1 | IO_L2P_T1 — User I/O bank 1, differential pair P |
| Pin D2 | IO_L2N_T1 — User I/O bank 1, differential pair N |
| Pin E1 | VCCIO_0 — I/O bank 0 supply |
| Pin E2 | GND — Ground |
| Pin F1 | IO_L3P_T2 — User I/O bank 2, differential pair P |
| Pin F2 | IO_L3N_T2 — User I/O bank 2, differential pair N |
Typische Anwendungen
XC7VH870T-2FLG1932I ist geeignet für 6 Anwendungs: High-Performance Computing, Wired Communications Infrastructure, Aerospace and Defense, Medical Imaging, Wireless Communications (5G/6G), Test and Measurement.
High-Performance Computing
The XC7VH870T-2FLG1932I excels in high-performance computing (HPC) due to its 876,160 logic cells and 51.98 Mb of block RAM. These resources enable massive parallel processing, essential for accelerating complex algorithms in scientific simulations, financial modeling, and data analytics. The 300 I/Os and high-speed transceivers facilitate high-bandwidth data movement between the FPGA and external processors or memory. Its industrial temperature range ensures reliable operation in data center environments with demanding thermal profiles. The -2 speed grade provides a balanced performance-power trade-off, making it suitable for power-conscious HPC accelerators.
Empfohlen
Wired Communications Infrastructure
In wired communications, the XC7VH870T-2FLG1932I is ideal for high-end network switches and routers. Its high logic density supports complex packet processing and forwarding algorithms, while the 51.98 Mb of RAM enables large lookup tables and buffering. The 300 I/Os and high-speed transceivers handle multiple 100G/400G Ethernet links, providing the bandwidth needed for core network equipment. The industrial temperature grade ensures reliable operation in central offices and edge data centers. The -2 speed grade offers the performance required for line-rate processing without excessive power consumption.
Empfohlen
Aerospace and Defense
The XC7VH870T-2FLG1932I is well-suited for aerospace and defense applications such as radar signal processing and secure communications. Its 876,160 logic cells enable complex beamforming and pulse compression algorithms, while the 51.98 Mb of RAM supports large data buffers. The industrial temperature range (-40C to +100C) is critical for operation in unpressurized aircraft or ground-based military systems. The 300 I/Os interface with high-speed ADCs and DACs, and the -2 speed grade provides the necessary throughput for real-time processing. Its robust package ensures reliability in harsh environments.
Empfohlen
Medical Imaging
For medical imaging systems like MRI and CT scanners, the XC7VH870T-2FLG1932I provides the computational power needed for real-time image reconstruction. Its 876,160 logic cells handle complex filtering and transform algorithms, while the 51.98 Mb of RAM stores intermediate image data. The 300 I/Os connect to high-speed sensor interfaces, and the industrial temperature range ensures reliable operation in clinical environments. The -2 speed grade balances performance and power, crucial for systems that run continuously. This FPGA enables faster, higher-resolution imaging, improving diagnostic capabilities.
Empfohlen
Wireless Communications (5G/6G)
The XC7VH870T-2FLG1932I is a strong fit for 5G/6G base stations, particularly for massive MIMO and beamforming. Its high logic density supports complex matrix operations and channel estimation, while the 51.98 Mb of RAM handles large coefficient tables. The 300 I/Os and high-speed transceivers interface with multiple RF transceivers, enabling high-order MIMO configurations. The industrial temperature grade is essential for outdoor base station deployment. The -2 speed grade provides the processing power needed for real-time signal processing, making it a key component in next-generation wireless infrastructure.
Empfohlen
Test and Measurement
In test and measurement equipment, the XC7VH870T-2FLG1932I enables high-speed data acquisition and analysis. Its 876,160 logic cells implement complex triggering and signal processing, while the 51.98 Mb of RAM provides deep acquisition buffers. The 300 I/Os connect to high-speed ADCs and DACs, and the industrial temperature range ensures accuracy in lab and field environments. The -2 speed grade supports high sample rates, making it ideal for oscilloscopes, spectrum analyzers, and logic analyzers. This FPGA allows for flexible, reconfigurable test instruments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XC7VH870T-2FLG1932I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XC7VH870T-2FLG1932C | XC7VH870T-2FFG1932I | XC7VH870T-G2FLG1932E |
|---|---|---|---|---|
| Package | 1932-FCBGA (45x45) | 1932-FCBGA (45x45) - same | 1932-FCBGA (45x45) - same | 1932-FCBGA (45x45) - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 876,160 | 876,160 | 876,160 | 876,160 |
| Total RAM Bits | 51,978,240 | 51,978,240 | 51,978,240 | 51,978,240 |
| Number of I/Os | 300 | 300 | 300 | 300 |
| Core Supply Voltage | 0.97V to 1.03V | 0.97V to 1.03V | 0.97V to 1.03V | 0.97V to 1.03V |
| Operating Temperature | -40C to +100C | 0C to +85C | -40C to +100C | 0C to +100C |
| Speed Grade | -2 | -2 | -2 | -G2 |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade for harsh environments (vs. XC7VH870T-2FLG1932C)
- Higher speed grade than -G2 variant (vs. XC7VH870T-G2FLG1932E)
- Standard FLG package variant (vs. XC7VH870T-2FFG1932I)
Designhinweise
The XC7VH870T-2FLG1932I requires a robust power delivery network for its 0.97V to 1.03V core supply. Use multiple voltage regulator modules (VRMs) with remote sensing to maintain tight voltage tolerance under dynamic load. Place bulk decoupling capacitors (e.g., 470uF) near the FPGA and high-frequency ceramic capacitors (0.1uF, 0.01uF) close to each VCCINT pin. Follow AMD's power distribution network guidelines in UG583 for optimal decoupling.
With 876,160 logic cells, the XC7VH870T-2FLG1932I can dissipate significant power, potentially exceeding 50W under full utilization. The 1932-FCBGA package has a low thermal resistance, but a heatsink and forced airflow are typically required. Use a thermal simulation tool to estimate junction temperature. Ensure the industrial temperature range (-40C to +100C) is not exceeded. Consider using a heat spreader and thermal interface material for optimal heat transfer.
For the 1932-FCBGA package, use a high-layer-count PCB (16-20 layers) with controlled impedance for high-speed signals. Route differential pairs with proper spacing and ground shielding. Place decoupling capacitors on the bottom side of the PCB, directly under the FPGA, to minimize inductance. Follow AMD's PCB design guidelines in UG583 for stack-up and routing recommendations. Use via-in-pad for better power integrity.
Compliance-Informationen
RoHS compliant per AMD product page. Not AEC-Q100 qualified as it is not an automotive part. Halogen-free status not specified in available data.
