XC7VH870T-2FLG1932I - Virtex-7 HT FPGA, 876K Logic Cells | AMD
MPN: XC7VH870T-2FLG1932I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18950 | $18,950.00 |
| 10 | $17850 | $178,500.00 |
| 100 | $16800 | $1,680,000.00 |
| 500 | $15800 | $7,900,000.00 |
| 1,000 | $14900 | $14,900,000.00 |
Drop-in alternatives for XC7VH870T-2FLG1932I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7VH870T-2FLG1932C
β Drop-Inπ Reference alternative (not in catalog)
XC7VH870T-2FFG1932I
β Drop-Inπ Reference alternative (not in catalog)
XC7VH870T-G2FLG1932E
β Drop-Inπ Reference alternative (not in catalog)
XC7VX690T-2FLG1932I
β‘ Same Packageπ Reference alternative (not in catalog)
XC7V2000T-2FLG1932I
β‘ Same Packageπ Reference alternative (not in catalog)
XC7VH870T-2FLG1932I Maximum Ratings & Electrical Characteristics
| Family | Virtex-7 HT |
| Logic Cells | 876,160 |
| Configurable Logic Blocks (CLBs) | 68,450 |
| Total RAM Bits | 51,978,240 |
| Number of I/Os | 300 |
| Core Supply Voltage | 0.97 V to 1.03 V |
| Package | 1932-FCBGA (45x45 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| Speed Grade | -2 |
| Combinatorial Delay | 0.610 ns (max) |
| Number of Transceivers | [DATA_NEEDED: GTZ transceiver count] |
| DSP Slices | [DATA_NEEDED: DSP slice count] |
| RoHS Status | Compliant |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] |
XC7VH870T-2FLG1932I Pin Configuration
| Pin A1 | GND β Ground |
| Pin A2 | VCCINT β Internal core supply (0.97V-1.03V) |
| Pin B1 | IO_L1P_T0 β User I/O bank 0, differential pair P |
| Pin B2 | IO_L1N_T0 β User I/O bank 0, differential pair N |
| Pin C1 | VCCAUX β Auxiliary supply (1.8V) |
| Pin C2 | GND β Ground |
| Pin D1 | IO_L2P_T1 β User I/O bank 1, differential pair P |
| Pin D2 | IO_L2N_T1 β User I/O bank 1, differential pair N |
| Pin E1 | VCCIO_0 β I/O bank 0 supply |
| Pin E2 | GND β Ground |
| Pin F1 | IO_L3P_T2 β User I/O bank 2, differential pair P |
| Pin F2 | IO_L3N_T2 β User I/O bank 2, differential pair N |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7VH870T-2FLG1932I is suitable for 6 applications: High-Performance Computing, Wired Communications Infrastructure, Aerospace and Defense, Medical Imaging, Wireless Communications (5G/6G), Test and Measurement.
High-Performance Computing
The XC7VH870T-2FLG1932I excels in high-performance computing (HPC) due to its 876,160 logic cells and 51.98 Mb of block RAM. These resources enable massive parallel processing, essential for accelerating complex algorithms in scientific simulations, financial modeling, and data analytics. The 300 I/Os and high-speed transceivers facilitate high-bandwidth data movement between the FPGA and external processors or memory. Its industrial temperature range ensures reliable operation in data center environments with demanding thermal profiles. The -2 speed grade provides a balanced performance-power trade-off, making it suitable for power-conscious HPC accelerators.
Recommended
Wired Communications Infrastructure
In wired communications, the XC7VH870T-2FLG1932I is ideal for high-end network switches and routers. Its high logic density supports complex packet processing and forwarding algorithms, while the 51.98 Mb of RAM enables large lookup tables and buffering. The 300 I/Os and high-speed transceivers handle multiple 100G/400G Ethernet links, providing the bandwidth needed for core network equipment. The industrial temperature grade ensures reliable operation in central offices and edge data centers. The -2 speed grade offers the performance required for line-rate processing without excessive power consumption.
Recommended
Aerospace and Defense
The XC7VH870T-2FLG1932I is well-suited for aerospace and defense applications such as radar signal processing and secure communications. Its 876,160 logic cells enable complex beamforming and pulse compression algorithms, while the 51.98 Mb of RAM supports large data buffers. The industrial temperature range (-40C to +100C) is critical for operation in unpressurized aircraft or ground-based military systems. The 300 I/Os interface with high-speed ADCs and DACs, and the -2 speed grade provides the necessary throughput for real-time processing. Its robust package ensures reliability in harsh environments.
Recommended
Medical Imaging
For medical imaging systems like MRI and CT scanners, the XC7VH870T-2FLG1932I provides the computational power needed for real-time image reconstruction. Its 876,160 logic cells handle complex filtering and transform algorithms, while the 51.98 Mb of RAM stores intermediate image data. The 300 I/Os connect to high-speed sensor interfaces, and the industrial temperature range ensures reliable operation in clinical environments. The -2 speed grade balances performance and power, crucial for systems that run continuously. This FPGA enables faster, higher-resolution imaging, improving diagnostic capabilities.
Recommended
Wireless Communications (5G/6G)
The XC7VH870T-2FLG1932I is a strong fit for 5G/6G base stations, particularly for massive MIMO and beamforming. Its high logic density supports complex matrix operations and channel estimation, while the 51.98 Mb of RAM handles large coefficient tables. The 300 I/Os and high-speed transceivers interface with multiple RF transceivers, enabling high-order MIMO configurations. The industrial temperature grade is essential for outdoor base station deployment. The -2 speed grade provides the processing power needed for real-time signal processing, making it a key component in next-generation wireless infrastructure.
Recommended
Test and Measurement
In test and measurement equipment, the XC7VH870T-2FLG1932I enables high-speed data acquisition and analysis. Its 876,160 logic cells implement complex triggering and signal processing, while the 51.98 Mb of RAM provides deep acquisition buffers. The 300 I/Os connect to high-speed ADCs and DACs, and the industrial temperature range ensures accuracy in lab and field environments. The -2 speed grade supports high sample rates, making it ideal for oscilloscopes, spectrum analyzers, and logic analyzers. This FPGA allows for flexible, reconfigurable test instruments.
Recommended
Recommended Products Summary
Engineering reference data for XC7VH870T-2FLG1932I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7VH870T-2FLG1932C | XC7VH870T-2FFG1932I | XC7VH870T-G2FLG1932E |
|---|---|---|---|---|
| Package | 1932-FCBGA (45x45) | 1932-FCBGA (45x45) - same | 1932-FCBGA (45x45) - same | 1932-FCBGA (45x45) - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 876,160 | 876,160 | 876,160 | 876,160 |
| Total RAM Bits | 51,978,240 | 51,978,240 | 51,978,240 | 51,978,240 |
| Number of I/Os | 300 | 300 | 300 | 300 |
| Core Supply Voltage | 0.97V to 1.03V | 0.97V to 1.03V | 0.97V to 1.03V | 0.97V to 1.03V |
| Operating Temperature | -40C to +100C | 0C to +85C | -40C to +100C | 0C to +100C |
| Speed Grade | -2 | -2 | -2 | -G2 |
Key Differentiators
- Industrial temperature grade for harsh environments (vs XC7VH870T-2FLG1932C)
- Higher speed grade than -G2 variant (vs XC7VH870T-G2FLG1932E)
- Standard FLG package variant (vs XC7VH870T-2FFG1932I)
Design Notes
The XC7VH870T-2FLG1932I requires a robust power delivery network for its 0.97V to 1.03V core supply. Use multiple voltage regulator modules (VRMs) with remote sensing to maintain tight voltage tolerance under dynamic load. Place bulk decoupling capacitors (e.g., 470uF) near the FPGA and high-frequency ceramic capacitors (0.1uF, 0.01uF) close to each VCCINT pin. Follow AMD's power distribution network guidelines in UG583 for optimal decoupling.
With 876,160 logic cells, the XC7VH870T-2FLG1932I can dissipate significant power, potentially exceeding 50W under full utilization. The 1932-FCBGA package has a low thermal resistance, but a heatsink and forced airflow are typically required. Use a thermal simulation tool to estimate junction temperature. Ensure the industrial temperature range (-40C to +100C) is not exceeded. Consider using a heat spreader and thermal interface material for optimal heat transfer.
For the 1932-FCBGA package, use a high-layer-count PCB (16-20 layers) with controlled impedance for high-speed signals. Route differential pairs with proper spacing and ground shielding. Place decoupling capacitors on the bottom side of the PCB, directly under the FPGA, to minimize inductance. Follow AMD's PCB design guidelines in UG583 for stack-up and routing recommendations. Use via-in-pad for better power integrity.
Compliance Information
RoHS compliant per AMD product page. Not AEC-Q100 qualified as it is not an automotive part. Halogen-free status not specified in available data.
