XCZU15EG-2FFVB1156I - Zynq UltraScale+ MPSoC EG | AMD
Teilenummer: XCZU15EG-2FFVB1156I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $406.18 | $406,18 |
| 10 | $385.87 | $3.858,70 |
| 100 | $366.56 | $36.656,00 |
| 500 | $347.25 | $173.625,00 |
| 1.000 | $327.94 | $327.940,00 |
XCZU15EG-2FFVB1156I Übersicht
A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines multi-core ARM processors with FPGA fabric on a single die, enabling software-defined hardware acceleration. This device family sits within the broader hierarchy of adaptive SoCs, which bridge the gap between traditional microprocessors and reconfigurable logic. The EG variant specifically targets embedded applications requiring a balance of processing performance and programmable logic density.
Key features of the XCZU15EG-2FFVB1156I include 747K+ logic cells, 32 Mb of block RAM, and 1,152 DSP slices for high-throughput signal processing. The device supports DDR4, LPDDR4, and 32-bit/64-bit memory interfaces, along with high-speed transceivers for serial connectivity. The -2 speed grade provides a balance between performance and power consumption, making it suitable for mid-range embedded systems.
Architecturally, the device leverages AMD's UltraScale+ architecture with 16nm FinFET+ technology, delivering up to 1.5x performance-per-watt improvement over previous generations. The integrated ARM processors run a full operating system like Linux, while the programmable logic handles real-time, low-latency tasks. This heterogeneous approach enables system designers to partition workloads optimally between software and hardware.
Typical applications include software-defined radio, medical imaging, industrial automation, and aerospace/defense systems. The device's combination of high-speed serial transceivers, DSP resources, and multi-core processing makes it ideal for edge computing platforms that require both flexibility and performance.
When designing with this device, careful attention must be paid to power supply sequencing and thermal management. The 1156-ball FCBGA package requires a multi-layer PCB with dedicated power and ground planes to ensure signal integrity and heat dissipation.
Drop-in-Alternativen für XCZU15EG-2FFVB1156I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit XCZU15EG-2FFVB1156I (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Logic Cells, Speed Grade, Block RAM, Core Processor.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
XCZU15EG-1FFVB1156I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XCZU15EG-2FFVB1156E
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XCZU15EG-L1FFVB1156I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XCZU11EG-2FFVB1156I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XCZU17EG-2FFVB1156I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XCZU15EG-2FFVB1156I Grenzwerte & elektrische Eigenschaften
| Processor Core | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2 |
| Logic Cells | 747K+ |
| Block RAM | 32 Mb |
| DSP Slices | 1,152 |
| Processor Speed | 533 MHz (A53), 600 MHz (R5), 1.3 GHz (Mali-400) |
| Gehäuse | 1156-FCBGA (35x35 mm) |
| Speed Grade | -2 |
| Temperature Grade | I (Industrial, -40C to +100C) |
| Technology | 16nm FinFET+ |
| Versorgungsspannung | 0.85V core |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Betriebstemperatur | -40C to +100C |
| Memory Interface | DDR4, LPDDR4, 32-bit/64-bit |
| High-Speed Transceivers | 16 (up to 12.5 Gbps) |
XCZU15EG-2FFVB1156I Pin-Konfiguration
| Pin A1 | GND — Ground |
| Pin A2 | VCCINT — Internal core voltage (0.85V) |
| Pin B1 | VCCAUX — Auxiliary voltage (1.8V) |
| Pin C1 | VCCO_0 — I/O bank 0 supply |
| Pin D1 | MIO[0] — Multiplexed I/O |
| Pin E1 | PS_CLK — Processor system clock |
| Pin F1 | PS_POR_B — Power-on reset |
| Pin G1 | PS_SRST_B — System reset |
| Pin H1 | DDR_ADDR[0] — DDR memory address |
| Pin J1 | DDR_BA[0] — DDR bank address |
| Pin K1 | DDR_CK — DDR clock |
| Pin L1 | GTY_REFCLK — High-speed transceiver reference clock |
Typische Anwendungen
XCZU15EG-2FFVB1156I ist geeignet für 6 Anwendungs: Software-Defined Radio, Medical Imaging, Industrial Automation, Aerospace and Defense, Edge Computing, Test and Measurement.
Software-Defined Radio
The XCZU15EG-2FFVB1156I excels in software-defined radio (SDR) systems due to its 747K+ logic cells and 1,152 DSP slices, which implement digital down/up conversion, filtering, and modulation. The quad-core Cortex-A53 runs protocol stacks and control software, while the FPGA fabric handles real-time signal processing. High-speed transceivers support up to 12.5 Gbps for ADC/DAC interfaces. This heterogeneous architecture enables flexible waveform updates without hardware changes, making it ideal for military and commercial SDR platforms.
Empfohlen
Medical Imaging
In medical imaging systems like ultrasound and CT scanners, the XCZU15EG-2FFVB1156I provides the processing power needed for real-time image reconstruction and enhancement. The 747K+ logic cells implement beamforming and filtering algorithms, while the ARM cores handle system control and user interface. The Mali-400 GPU accelerates 2D/3D rendering for display. The device's high-speed transceivers interface with imaging sensors and memory, ensuring low-latency data flow. Its industrial temperature range supports reliable operation in clinical environments.
Empfohlen
Industrial Automation
The XCZU15EG-2FFVB1156I is well-suited for industrial automation and robotics, where it combines real-time control with advanced processing. The dual-core Cortex-R5 provides deterministic response for motor control and safety functions, while the Cortex-A53 runs Linux for HMI and networking. The FPGA fabric implements custom I/O protocols like EtherCAT or PROFINET, and the 1,152 DSP slices handle sensor fusion and machine vision. This integration reduces system complexity and latency compared to discrete processors and FPGAs.
Empfohlen
Aerospace and Defense
For aerospace and defense applications, the XCZU15EG-2FFVB1156I offers the performance and reliability required for radar, electronic warfare, and secure communications. The 747K+ logic cells implement complex signal processing algorithms, while the ARM cores handle mission management and encryption. The device's industrial temperature range and 16nm FinFET+ technology ensure operation in harsh environments. High-speed transceivers support sensor interfaces and data links, and the programmable logic allows for secure, reconfigurable processing.
Empfohlen
Edge Computing
In edge computing platforms, the XCZU15EG-2FFVB1156I provides a powerful combination of general-purpose processing and hardware acceleration. The quad-core Cortex-A53 runs containerized applications and AI inference frameworks, while the FPGA fabric accelerates custom workloads like video transcoding or network packet processing. The Mali-400 GPU supports graphics and computer vision tasks. This heterogeneous architecture enables low-latency, high-throughput processing at the network edge, reducing the need for cloud connectivity.
Empfohlen
Test and Measurement
The XCZU15EG-2FFVB1156I is ideal for test and measurement equipment like oscilloscopes and signal analyzers. The FPGA fabric implements high-speed data acquisition and triggering, while the ARM cores run the user interface and data analysis software. The 1,152 DSP slices enable real-time FFT and filtering, and the high-speed transceivers interface with ADCs and DACs. This integration allows for compact, high-performance instruments that can be updated with new measurement algorithms via firmware.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XCZU15EG-2FFVB1156I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XCZU15EG-1FFVB1156I | XCZU15EG-2FFVB1156E | XCZU15EG-L1FFVB1156I | XCZU11EG-2FFVB1156I | XCZU17EG-2FFVB1156I |
|---|---|---|---|---|---|---|
| Package | 1156-FCBGA (35x35) | 1156-FCBGA (35x35) | 1156-FCBGA (35x35) | 1156-FCBGA (35x35) | 1156-FCBGA (35x35) | 1156-FCBGA (35x35) |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 747K+ | 747K+ | 747K+ | 747K+ | 504K | 930K |
| Speed Grade | -2 | -1 | -2 | -L1 | -2 | -2 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (0C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Processor Speed (A53) | 533 MHz | 500 MHz | 533 MHz | 500 MHz | 533 MHz | 533 MHz |
| Block RAM | 32 Mb | 32 Mb | 32 Mb | 32 Mb | 21 Mb | 38 Mb |
| DSP Slices | 1,152 | 1,152 | 1,152 | 1,152 | 768 | 1,728 |
Wichtigste Unterscheidungsmerkmale
- Higher logic density than XCZU11EG (vs. XCZU11EG-2FFVB1156I)
- Faster speed grade than XCZU15EG-1FFVB1156I (vs. XCZU15EG-1FFVB1156I)
- Industrial temperature range vs XCZU15EG-2FFVB1156E (vs. XCZU15EG-2FFVB1156E)
Designhinweise
The XCZU15EG-2FFVB1156I requires multiple power rails: VCCINT at 0.85V, VCCAUX at 1.8V, and various VCCO for I/O banks. Use a dedicated power management IC with sequencing to ensure proper power-up order. Refer to the Zynq UltraScale+ power management application note for recommended sequencing and decoupling.
With 747K+ logic cells and multi-core processors, the XCZU15EG-2FFVB1156I can dissipate significant power. The 1156-FCBGA package requires a heatsink or active cooling for high utilization designs. Use thermal vias under the package and a copper pour on the PCB to improve heat dissipation. Junction temperature must stay below 100C for industrial grade.
The 1156-ball FCBGA package requires a high-layer-count PCB with controlled impedance for high-speed transceivers and DDR4 interfaces. Follow AMD's PCB design guidelines for stack-up, routing, and decoupling. Place decoupling capacitors close to the power pins and use dedicated power planes for each voltage rail.
Compliance-Informationen
RoHS compliant per AMD product page. Not AEC-Q100 qualified - this is a commercial/industrial device.