XCZU15EG-1FFVB1156E - Zynq UltraScale+ MPSoC EG | AMD
Teilenummer: XCZU15EG-1FFVB1156E ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1200 | $1.200,00 |
| 10 | $1100 | $11.000,00 |
| 100 | $950 | $95.000,00 |
| 500 | $850 | $425.000,00 |
| 1.000 | $750 | $750.000,00 |
XCZU15EG-1FFVB1156E Übersicht
A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that merges a processing system (PS) with programmable logic (PL) on a single die. The PS runs operating systems like Linux or bare-metal applications, while the PL implements custom hardware accelerators, high-speed I/O, and custom peripherals. This architecture enables designers to optimize performance, power, and cost by partitioning tasks between software and hardware.
Key features include 747K+ logic cells, 328 user I/O pins, and a 1156-FCBGA (35x35 mm) package. The device operates with a nominal core voltage of 0.85V (range 0.825V to 0.876V) and supports clock speeds of 500MHz (Cortex-R5), 600MHz (Cortex-A53), and 1.2GHz (Mali-400). The '1' speed grade indicates standard performance, while the 'E' suffix denotes an extended temperature range of 0°C to +100°C.
The XCZU15EG-1FFVB1156E is built on TSMC's 20nm technology, offering a balance of logic density, power efficiency, and performance. The device includes 256KB of on-chip RAM, a rich set of peripherals, and high-speed transceivers for connectivity. Its architecture supports hardware acceleration, real-time control, and advanced graphics, making it suitable for compute-intensive tasks.
Typical applications include software-defined radio, medical imaging, aerospace and defense systems, and industrial automation. The combination of ARM cores and FPGA fabric allows for flexible, high-performance designs that can adapt to evolving requirements.
When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The 1156-FCBGA package requires a multi-layer PCB with dedicated power and ground planes. The device's power sequencing requirements must be followed to ensure reliable operation.
Drop-in-Alternativen für XCZU15EG-1FFVB1156E – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit XCZU15EG-1FFVB1156E (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Speed Grade, Supply Voltage, Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
XCZU15EG-1FFVB1156I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XCZU15EG-2FFVB1156I
✅ Drop-In✓ Auf Lager
$327.94 / Stück
Datenblatt ansehen →XCZU15EG-L1FFVB1156I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XCZU15EG-1FFVC900I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XCZU15EG-2FFVB1156E
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XCZU15EG-1FFVB1156E Grenzwerte & elektrische Eigenschaften
| Family | Zynq UltraScale+ MPSoC EG |
| Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2 |
| Logic Cells | 747K+ |
| Number of I/O | 328 |
| RAM Size | 256KB |
| Gehäuse | 1156-FCBGA (35x35 mm) |
| Montageart | Surface Mount |
| Betriebstemperatur | 0°C to +100°C |
| Core Voltage | 0.85V (nominal), 0.825V min, 0.876V max |
| Technology | 20nm |
| Speed Grade | -1 (standard) |
| Clock Speed | 500MHz (Cortex-R5), 600MHz (Cortex-A53), 1.2GHz (Mali-400) |
| MSL-Level | 4 (72 Hours) |
| Manufacturer Pack Quantity | 1 |
| Versorgungsspannung | 0.85V |
XCZU15EG-1FFVB1156E Pin-Konfiguration
| Pin A1 | GND — Ground |
| Pin A2 | VCCINT — Internal core voltage (0.85V) |
| Pin A3 | IO_L1P_T0 — User I/O bank 0 |
| Pin B1 | VCCAUX — Auxiliary voltage (1.8V) |
| Pin B2 | GND — Ground |
| Pin C1 | IO_L2N_T0 — User I/O bank 0 |
| Pin C2 | VCCBRAM — Block RAM voltage |
| Pin D1 | IO_L3P_T1 — User I/O bank 1 |
| Pin D2 | GND — Ground |
| Pin E1 | IO_L4N_T1 — User I/O bank 1 |
| Pin E2 | VCCINT — Internal core voltage (0.85V) |
| Pin F1 | IO_L5P_T2 — User I/O bank 2 |
Typische Anwendungen
XCZU15EG-1FFVB1156E ist geeignet für 6 Anwendungs: Software-Defined Radio, Medical Imaging, Aerospace and Defense, Industrial Automation, Data Center and Networking, Automotive Driver Assistance.
Software-Defined Radio
The XCZU15EG-1FFVB1156E is ideal for software-defined radio (SDR) systems. Its 747K+ logic cells can implement complex digital signal processing (DSP) chains, including filters, FFTs, and modulation/demodulation. The quad-core Cortex-A53 runs protocol stacks and control software, while the dual-core Cortex-R5 handles real-time tasks. The Mali-400 GPU can support spectrum visualization. The device's high-speed transceivers enable wideband RF interfaces. The 0.85V core voltage and 20nm process provide a good balance of performance and power efficiency for portable or fixed SDR platforms.
Empfohlen
Medical Imaging
In medical imaging systems like ultrasound or CT scanners, the XCZU15EG-1FFVB1156E provides the computational power needed for real-time image processing. The FPGA fabric can accelerate beamforming, filtering, and image reconstruction algorithms, while the ARM cores manage system control and user interfaces. The Mali-400 GPU can render 2D/3D images. The device's 328 I/O pins allow interfacing with high-speed ADCs and sensors. The extended temperature range (0°C to +100°C) is suitable for controlled clinical environments. The 256KB on-chip RAM supports low-latency data buffering.
Empfohlen
Aerospace and Defense
The XCZU15EG-1FFVB1156E is well-suited for aerospace and defense applications such as radar, electronic warfare, and secure communications. The combination of ARM cores and FPGA fabric allows for flexible, reconfigurable processing. The device's 747K+ logic cells can implement complex beamforming and signal intelligence algorithms. The dual-core Cortex-R5 provides deterministic real-time control. The 1156-FCBGA package is robust for harsh environments. The 'E' temperature grade (0°C to +100°C) is suitable for many defense platforms, though the 'I' variant is available for wider ranges. The 20nm technology offers a good balance of performance and power.
Empfohlen
Industrial Automation
For industrial automation and control systems, the XCZU15EG-1FFVB1156E provides a powerful platform for machine vision, motion control, and real-time networking. The FPGA fabric can implement custom motor control loops, vision processing, and industrial Ethernet protocols (e.g., EtherCAT). The ARM cores run Linux or RTOS for system management and HMI. The device's 328 I/O pins interface with sensors, actuators, and encoders. The 0.85V core voltage and 20nm process ensure efficient operation. The extended temperature range (0°C to +100°C) covers most factory environments. The Mali-400 GPU can support graphical HMIs.
Empfohlen
Data Center and Networking
The XCZU15EG-1FFVB1156E can be used in data center and networking equipment for packet processing, security, and acceleration. The FPGA fabric can implement custom packet parsers, encryption engines, and load balancers. The ARM cores handle control plane functions and management. The device's high-speed transceivers support 10/25/40/100G Ethernet. The 747K+ logic cells provide ample resources for complex networking algorithms. The 256KB on-chip RAM reduces latency for time-critical operations. The 0.85V core voltage and 20nm process offer competitive power efficiency for rack-mounted equipment.
Empfohlen
Automotive Driver Assistance
In automotive advanced driver assistance systems (ADAS), the XCZU15EG-1FFVB1156E can process sensor data from cameras, radar, and LiDAR. The FPGA fabric can implement real-time image processing, object detection, and sensor fusion algorithms. The ARM cores run the application software and communicate with vehicle networks. The Mali-400 GPU can support display rendering for driver information. The device's 328 I/O pins interface with various sensors. The extended temperature range (0°C to +100°C) is suitable for passenger cabin applications. The 20nm process provides a balance of performance and power for automotive electronics.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XCZU15EG-1FFVB1156E – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XCZU15EG-1FFVB1156I | XCZU15EG-2FFVB1156I | XCZU15EG-L1FFVB1156I |
|---|---|---|---|---|
| Package | 1156-FCBGA (35x35 mm) | 1156-FCBGA (35x35 mm) - same | 1156-FCBGA (35x35 mm) - same | 1156-FCBGA (35x35 mm) - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 747K+ | 747K+ | 747K+ | 747K+ |
| Temperature Range | 0°C to +100°C | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C |
| Speed Grade | -1 | -1 | -2 | -1 |
| Core Voltage | 0.85V | 0.85V | 0.85V | 0.85V |
| Number of I/O | 328 | 328 | 328 | 328 |
| RAM Size | 256KB | 256KB | 256KB | 256KB |
Wichtigste Unterscheidungsmerkmale
- Extended temperature range (0°C to +100°C) (vs. XCZU15EG-1FFVB1156I)
- Standard speed grade (-1) (vs. XCZU15EG-2FFVB1156I)
- Standard power variant (vs. XCZU15EG-L1FFVB1156I)
Designhinweise
The XCZU15EG-1FFVB1156E requires multiple power rails: VCCINT (0.85V), VCCAUX (1.8V), and VCCBRAM. Use a dedicated power management IC (PMIC) like the TPS650864 to sequence these rails correctly. Ensure proper decoupling with 100nF and 10uF capacitors close to each power pin. The core voltage must be within 0.825V to 0.876V for reliable operation.
The 1156-FCBGA package can dissipate significant power under heavy logic utilization. Use a heatsink or active cooling for applications exceeding 10W. The thermal resistance (theta_JA) is [DATA_NEEDED: theta_JA]. Ensure adequate airflow in the enclosure. The operating temperature range is 0°C to +100°C, so monitor junction temperature to avoid exceeding the maximum.
The 1156-FCBGA package requires a multi-layer PCB with dedicated power and ground planes. Use at least 8 layers for routing. Follow AMD's layout guidelines for high-speed transceivers and DDR interfaces. Place the device on a 35x35 mm footprint with proper solder mask and stencil design. MSL level 4 (72 hours) requires baking before reflow if exposed to humidity.
Compliance-Informationen
RoHS compliant per AMD product page. Not AEC-Q100 qualified - this is a commercial-grade SoC.