AMD

XCZU28DR-2FSVE1156I - Zynq UltraScale+ RFSoC Gen 3 | AMD

Teilenummer: XCZU28DR-2FSVE1156I ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
1156-FCBGA (35x35 mm) Package 1.333 GHz (PS), 533 MHz (PL) Speed
Ab $4000 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-08-20
Mengenpreise
Menge Stückpreis Gesamt
1 $5000 $5.000,00
10 $4800 $48.000,00
100 $4500 $450.000,00
500 $4200 $2.100.000,00
1.000 $4000 $4.000.000,00
ℹ️ Alle Preise sind in USD

XCZU28DR-2FSVE1156I Übersicht

The AMD XCZU28DR-2FSVE1156I is a Zynq UltraScale+ RFSoC Gen 3 device that integrates a powerful processing system (PS) and programmable logic (PL) with high-performance RF data converters on a single chip. It is housed in a 1156-ball FCBGA package (35x35 mm) and operates over the industrial temperature grade. The device combines a quad-core Arm Cortex-A53 application processor and a dual-core Arm Cortex-R5 real-time processor with extensive programmable logic resources, making it suitable for a wide range of signal processing and control applications.

A Zynq UltraScale+ RFSoC is a System-on-Chip (SoC) that merges an FPGA fabric with a multi-core processor subsystem and integrated RF analog-to-digital converters (ADCs) and digital-to-analog converters (DACs). This integration eliminates the need for separate discrete converters, reducing board space, power consumption, and design complexity. The RFSoC family is part of the broader adaptive SoC category, which includes FPGAs and other programmable devices, and is designed for applications requiring high-speed data conversion and flexible digital processing.

Key features of the XCZU28DR-2FSVE1156I include the Zynq UltraScale+ RFSoC Gen 3 architecture, which provides enhanced RF performance and higher bandwidth compared to previous generations. The device supports a maximum logic cell count of 930K+ and operates at a maximum clock frequency of 1.333 GHz for the PS and 533 MHz for the PL. The integrated RF data converters support direct RF sampling, enabling software-defined radio and radar systems. The device also includes a rich set of I/O options, including high-speed transceivers and general-purpose I/O.

From a technical perspective, the XCZU28DR-2FSVE1156I leverages AMD's UltraScale+ architecture, which offers advanced power management, security features, and high-speed connectivity. The device supports a wide range of interfaces, including PCIe, Ethernet, and USB, making it suitable for diverse applications. The RFSoC Gen 3 devices are designed to meet the demands of 5G wireless infrastructure, aerospace and defense, and test and measurement equipment.

Typical applications for the XCZU28DR-2FSVE1156I include 5G massive MIMO base stations, radar and electronic warfare systems, and high-speed data acquisition systems. The device's integrated RF converters and powerful processing capabilities make it ideal for these applications, where high bandwidth and low latency are critical.

When designing with this device, it is important to consider the power supply requirements and thermal management. The device requires multiple power rails with specific sequencing, and adequate cooling is necessary to maintain reliable operation at high performance levels. Refer to the AMD Zynq UltraScale+ RFSoC data sheet and design guides for detailed recommendations.

Drop-in-Alternativen für XCZU28DR-2FSVE1156I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit XCZU28DR-2FSVE1156I (gleiche Bauform und Footprint) – abweichend in Logic Cells, Package, Operating Temperature, Primary Clock Speed, Temperature Grade.

AMD
Logic Cells: 489K+
Package: 1156-FCBGA (35x35mm)
Operating Temperature: -40C to +100C (industrial)
Vergleichen mit XCZU28DR-2FSVE1156I →
AMD
Operating Temperature: -40C to +100C
Temperature Grade: Industrial (I)
Vergleichen mit XCZU28DR-2FSVE1156I →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

XCZU28DR-2FFVE1156I

✅ Drop-In
📦 1156-FCBGA
Lower speed grade (2FF vs 2FS), same package and pinout

📋 Referenzalternative (nicht im Katalog)

XCZU42DR-2FSVE1156I

✅ Drop-In
AMD
📦 1156-FCBGA
Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight · 533MHz (Cortex-A53), 1.333GHz (Cortex-R5) · 489K+ · 1156-FCBGA (35x35mm) · Surface Mount · -40C to +100C (industrial) · -2 · Zynq UltraScale+ RFSoC

✓ Auf Lager

$3950 / Stück

Datenblatt ansehen →

XCZU47DR-2FFVE1156I

✅ Drop-In
AMD
📦 1156-FCBGA
Quad ARM Cortex-A53 MPCore with CoreSight · Dual ARM Cortex-R5 with CoreSight · 930K+ · 1.333 GHz · 533 MHz · 1156-FCBGA (35x35 mm) · -2 · Industrial (I)

✓ Auf Lager

$22500 / Stück

Datenblatt ansehen →

XCZU28DR-2FSVE1156I Grenzwerte & elektrische Eigenschaften

Family Zynq UltraScale+ RFSoC Gen 3
Core Processor Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight
Number of Cores 6 (4x A53, 2x R5)
Primary Clock Speed 1.333 GHz (PS), 533 MHz (PL)
Logic Cells 930K+
Gehäuse 1156-FCBGA (35x35 mm)
Anzahl der Pins 1156
Terminal Form BALL
Package Code BGA
Package Shape RECTANGULAR
Temperature Grade INDUSTRIAL
Montageart Surface Mount

XCZU28DR-2FSVE1156I Pin-Konfiguration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 VCCINT — Internal core voltage supply
Pin A2 GND — Ground
Pin B1 VCCAUX — Auxiliary voltage supply
Pin B2 GND — Ground
Pin C1 IO_L1P_T0 — General purpose I/O
Pin C2 IO_L1N_T0 — General purpose I/O
Pin D1 MGTREFCLK0P — High-speed transceiver reference clock
Pin D2 MGTREFCLK0N — High-speed transceiver reference clock
Pin E1 MGTYTXP0 — High-speed transceiver transmit
Pin E2 MGTYTXN0 — High-speed transceiver transmit
Pin F1 MGTY RXP0 — High-speed transceiver receive
Pin F2 MGTY RXN0 — High-speed transceiver receive

Typische Anwendungen

XCZU28DR-2FSVE1156I ist geeignet für 6 Anwendungs: 5G Massive MIMO Base Stations, Radar and Electronic Warfare Systems, High-Speed Data Acquisition Systems, Software-Defined Radio (SDR), Aerospace and Defense, Test and Measurement Equipment.

🌐

5G Massive MIMO Base Stations

The XCZU28DR-2FSVE1156I is ideal for 5G massive MIMO base stations due to its integrated RF data converters and high-speed processing capabilities. It supports direct RF sampling, reducing the need for external converters and simplifying the design. The device's high logic cell count and multi-core processing enable complex beamforming algorithms and signal processing, ensuring high throughput and low latency. Its industrial temperature grade makes it suitable for outdoor deployment in various environmental conditions.

✈️

Radar and Electronic Warfare Systems

The XCZU28DR-2FSVE1156I is well-suited for radar and electronic warfare systems, where high-speed data conversion and real-time processing are critical. The integrated RF ADCs and DACs enable direct sampling of radar signals, while the programmable logic allows for flexible implementation of signal processing algorithms. The device's high performance and industrial temperature rating ensure reliable operation in demanding military environments.

🔧

High-Speed Data Acquisition Systems

The XCZU28DR-2FSVE1156I is perfect for high-speed data acquisition systems that require high bandwidth and low latency. Its integrated RF converters can sample signals at high rates, and the programmable logic can handle real-time data processing and analysis. The device's multi-core processor can manage data flow and system control, making it a comprehensive solution for test and measurement equipment.

📡

Software-Defined Radio (SDR)

The XCZU28DR-2FSVE1156I is an excellent choice for software-defined radio applications, where flexibility and performance are key. The integrated RF data converters support a wide frequency range, and the programmable logic allows for reconfigurable signal processing. The device's processing system can run complex communication protocols, making it a versatile platform for various wireless communication standards.

✈️

Aerospace and Defense

The XCZU28DR-2FSVE1156I is suitable for aerospace and defense applications, including satellite communications and electronic warfare. Its high-performance processing and integrated RF converters enable advanced signal processing in a compact form factor. The device's industrial temperature grade and robust design make it reliable in harsh environments, meeting the stringent requirements of military and aerospace systems.

🔧

Test and Measurement Equipment

The XCZU28DR-2FSVE1156I is ideal for test and measurement equipment, such as oscilloscopes and spectrum analyzers, where high-speed data acquisition and processing are essential. The integrated RF converters can capture signals with high fidelity, and the programmable logic can implement complex triggering and analysis functions. The device's processing system can handle user interfaces and data logging, providing a complete solution for advanced test instruments.

What is the XCZU28DR-2FSVE1156I?
The XCZU28DR-2FSVE1156I is a Zynq UltraScale+ RFSoC Gen 3 device from AMD. It integrates a quad-core Arm Cortex-A53 and dual-core Arm Cortex-R5 processing system with programmable logic and RF data converters. It is housed in a 1156-ball FCBGA package and is designed for high-performance signal processing applications.
What is the price of XCZU28DR-2FSVE1156I?
The price of XCZU28DR-2FSVE1156I varies by quantity and distributor. As of 2026-08-20, the estimated unit price is around $5000 for single-unit purchases, with volume discounts available. For the most accurate and current pricing, please check with authorized distributors like DigiKey or Mouser.
Where can I buy XCZU28DR-2FSVE1156I?
You can purchase the XCZU28DR-2FSVE1156I from authorized distributors such as DigiKey, Mouser, and other electronics component suppliers. It is also available from various online marketplaces. Ensure you buy from authorized sources to guarantee genuine parts and warranty support.
What is the lead time for XCZU28DR-2FSVE1156I?
The lead time for XCZU28DR-2FSVE1156I depends on the distributor and current stock levels. Typically, it can range from a few days to several weeks. For the most accurate lead time, please contact the distributor directly or check their website for real-time inventory and shipping estimates.
Is XCZU28DR-2FSVE1156I in stock?
Stock availability for XCZU28DR-2FSVE1156I varies by distributor. As of 2026-08-20, some distributors like DigiKey may have it in stock, but it is always best to check their website for real-time inventory. You can also use Octopart to compare stock levels across multiple distributors.
What is the difference between XCZU28DR-2FSVE1156I and XCZU28DR-2FFVE1156I?
The XCZU28DR-2FSVE1156I and XCZU28DR-2FFVE1156I are both Zynq UltraScale+ RFSoC devices with the same package and pin count. The key difference is the speed grade: the -2FSVE1156I has a higher speed grade (2) compared to the -2FFVE1156I, which may offer higher performance. Both are pin-compatible and can be used as drop-in replacements depending on performance requirements.
When should I choose XCZU28DR-2FSVE1156I over XCZU47DR-2FFVE1156I?
Choose the XCZU28DR-2FSVE1156I when you need a higher speed grade (2) and the specific RFSoC Gen 3 features. The XCZU47DR-2FFVE1156I has a lower speed grade and may have different RF converter specifications. If your application requires maximum performance and the Gen 3 architecture, the XCZU28DR-2FSVE1156I is the better choice.
What is the best drop-in replacement for XCZU28DR-2FSVE1156I?
The best drop-in replacement for XCZU28DR-2FSVE1156I is the XCZU28DR-2FFVE1156I, which shares the same package and pinout. Other pin-compatible options include XCZU42DR-2FSVE1156I and XCZU47DR-2FFVE1156I, but verify the speed grade and RF specifications to ensure they meet your requirements.
Where can I download the XCZU28DR-2FSVE1156I datasheet PDF?
You can download the XCZU28DR-2FSVE1156I datasheet PDF from the AMD website or from distributor sites like Octopart. The datasheet provides detailed specifications, pinout, and design guidelines. Always refer to the latest version from the manufacturer for accurate information.
Where can I find the XCZU28DR-2FSVE1156I pinout?
The XCZU28DR-2FSVE1156I pinout is available in the AMD Zynq UltraScale+ package pinout files, which can be downloaded from the AMD website. These files provide detailed pin assignments for the 1156-ball FCBGA package. You can also find pinout information in the device datasheet.
What are the key specifications of XCZU28DR-2FSVE1156I that engineers should know?
The XCZU28DR-2FSVE1156I features a quad-core Arm Cortex-A53 and dual-core Arm Cortex-R5, with a maximum clock speed of 1.333 GHz for the PS and 533 MHz for the PL. It has 930K+ logic cells and is housed in a 1156-ball FCBGA package. It is designed for industrial temperature grades and supports high-speed RF data conversion.
Can XCZU28DR-2FFVE1156I replace XCZU28DR-2FSVE1156I?
Yes, the XCZU28DR-2FFVE1156I can replace the XCZU28DR-2FSVE1156I as it is pin-compatible and shares the same package. However, the -2FFVE1156I has a lower speed grade, which may affect performance. Verify that the speed grade meets your application requirements before making the substitution.
What is the best AMD equivalent for XCZU28DR-2FSVE1156I?
The best AMD equivalent for XCZU28DR-2FSVE1156I is the XCZU28DR-2FFVE1156I, which is pin-compatible and has the same package. Other AMD options include XCZU42DR-2FSVE1156I and XCZU47DR-2FFVE1156I, but they may have different RF specifications and speed grades.
Is XCZU28DR-2FSVE1156I suitable for 5G applications?
Yes, the XCZU28DR-2FSVE1156I is suitable for 5G applications, particularly for massive MIMO base stations and other wireless infrastructure. Its integrated RF data converters and high-speed processing capabilities make it ideal for handling the high bandwidth and low latency requirements of 5G networks.
What is the operating temperature range of XCZU28DR-2FSVE1156I?
The XCZU28DR-2FSVE1156I is rated for the industrial temperature grade, but the exact operating temperature range is not specified in the provided data. Please refer to the AMD datasheet for the precise temperature limits to ensure reliable operation in your application.

Technische Referenzdaten für XCZU28DR-2FSVE1156I – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the XCZU28DR-2FSVE1156I when you need a high-performance Zynq UltraScale+ RFSoC with a higher speed grade (2) and the latest Gen 3 architecture. It is ideal for applications requiring integrated RF data converters and high-speed processing, such as 5G base stations and radar systems. If you do not need the higher speed grade, the XCZU28DR-2FFVE1156I is a cost-effective alternative. For applications requiring more logic cells, consider the XCZU47DR-2FFVE1156I, but verify the speed grade and RF specifications. All alternatives are pin-compatible, allowing for easy substitution in your design.

Vergleich mit Alternativen

Parameter Dieses Produkt XCZU28DR-2FFVE1156I XCZU42DR-2FSVE1156I XCZU47DR-2FFVE1156I
Package 1156-FCBGA 1156-FCBGA 1156-FCBGA 1156-FCBGA
Brand AMD AMD AMD AMD
Speed Grade 2 2 2 2
Core Processor Quad ARM Cortex-A53, Dual ARM Cortex-R5 Quad ARM Cortex-A53, Dual ARM Cortex-R5 Quad ARM Cortex-A53, Dual ARM Cortex-R5 Quad ARM Cortex-A53, Dual ARM Cortex-R5
Max Clock Speed (PS) 1.333 GHz 1.333 GHz 1.333 GHz 1.333 GHz
Max Clock Speed (PL) 533 MHz 533 MHz 533 MHz 533 MHz
Temperature Grade INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL

Wichtigste Unterscheidungsmerkmale

  • Higher speed grade (2) compared to XCZU28DR-2FFVE1156I (vs. XCZU28DR-2FFVE1156I)
  • RFSoC Gen 3 architecture (vs. XCZU47DR-2FFVE1156I)
  • Integrated RF data converters (vs. XCZU28DR-2FFVE1156I)

Designhinweise

The XCZU28DR-2FSVE1156I requires multiple power rails with specific voltage levels and sequencing. Refer to the AMD Zynq UltraScale+ RFSoC power management application note for recommended power supply design and sequencing requirements. Use a dedicated power management IC to ensure proper startup and shutdown sequences.

The device can dissipate significant power, especially when operating at high clock speeds and utilizing many logic resources. Ensure adequate thermal management, such as a heatsink or active cooling, to keep the junction temperature within the specified limits. The industrial temperature grade allows operation up to [DATA_NEEDED]C, but proper cooling is essential for reliability.

For high-speed signals, follow the PCB layout guidelines provided in the AMD Zynq UltraScale+ PCB design guide. Use controlled impedance traces for high-speed transceivers and ensure proper grounding and decoupling. Place decoupling capacitors close to the power pins to minimize noise and ensure stable operation.

Compliance-Informationen

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Bleifrei
Unknown
Halogenfrei
Unknown
Konfliktmineralien
Unknown

Compliance information not provided in the verified data. Please refer to the AMD datasheet or contact the manufacturer for detailed compliance certifications.

Daten verifiziert am: 2026-08-20 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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