XCZU19EG-2FFVB1517I - Zynq UltraScale+ MPSoC | AMD
Teilenummer: XCZU19EG-2FFVB1517I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4250 | $4.250,00 |
| 10 | $3900 | $39.000,00 |
| 100 | $3200 | $320.000,00 |
| 500 | $2900 | $1.450.000,00 |
| 1.000 | $2600 | $2.600.000,00 |
XCZU19EG-2FFVB1517I Übersicht
An MPSoC is a multi-processor system-on-chip that combines a processor system (PS) with programmable logic (PL) fabric, allowing designers to integrate software-based control and hardware-accelerated datapaths on one die. Within the programmable-logic hierarchy, the Zynq UltraScale+ MPSoC sits above traditional FPGAs by adding hardened ARM cores, memory controllers, and high-speed transceivers. This class of device is commonly used in 5G wireless, aerospace, defense, medical imaging, and data center acceleration.
Key features of the XCZU19EG-2FFVB1517I include high logic density with 1,143K+ logic cells, a -2 speed grade for balanced performance, and industrial temperature grade (I suffix) for extended environmental operation. The 1517-FCBGA package exposes 16 accessible GTH transceivers; the device contains 72 total transceivers, but the D1760 package is required to access all GTY channels. The quad A53 cluster can run Linux, while the dual R5 cores handle deterministic real-time control.
From a technical depth perspective, the Zynq UltraScale+ architecture uses 16nm FinFET process technology. The programmable logic can implement complex DSP pipelines, AI inference engines, and custom protocol bridges. The hardened PS includes DDR4 memory controllers, but the exact DDR4 PHY configuration and I/O bank assignments must be verified in the AMD package pinout file. The Mali-400 MP2 GPU accelerates lightweight graphics or compute-display tasks.
Typical applications include 5G/6G radio and fronthaul processing, radar and electronic warfare subsystems, medical imaging and ultrasound beamforming, industrial machine vision, SmartNIC acceleration, and multi-channel video surveillance. The combination of hardened processors and scalable logic gives designers flexibility to partition functions between software and hardware.
When designing with this device, plan a proper multi-rail power sequence and a robust thermal solution. Because exact VCCINT/VCCAUX voltage levels and thermal data are not included in the verified web snippets, refer to the official AMD Zynq UltraScale+ MPSoC data sheets and package pinout files before final board design.
Drop-in-Alternativen für XCZU19EG-2FFVB1517I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
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XCZU19EG-2FFVB1517E
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XCZU19EG-1FFVB1517I
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XCZU19EG-3FFVB1517I
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XCZU19EG-2FFVB1517C
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XCZU19EG-1FFVB1517E
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XCZU19EG-2FFVB1517I Grenzwerte & elektrische Eigenschaften
| Product Type | Zynq UltraScale+ MPSoC EG System-on-Chip (SoC) FPGA |
| Processor Subsystem | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight |
| Graphics Processor | ARM Mali-400 MP2 |
| FPGA Logic Cells | 1143K+ |
| Max Clock Frequencies | 533 MHz, 600 MHz, 1.3 GHz |
| Gehäuse | 1517-FCBGA (40x40 mm) |
| Speed Grade | -2 |
| Total Device Transceivers | 72 |
| Accessible GTH Transceivers (FFVB1517 package) | 16 |
| Family Series | Zynq UltraScale+ MPSoC EG |
| Montageart | Surface Mount |
XCZU19EG-2FFVB1517I 16 Pinbelegungsleitfaden
Pinbelegung für XCZU19EG-2FFVB1517I (16-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für XCZU19EG-2FFVB1517I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
XCZU19EG-2FFVB1517I ist geeignet für 6 Anwendungs: 5G Wireless / Fronthaul, Aerospace & Defense, Medical Imaging, Industrial Automation & Machine Vision, Data Center / SmartNIC, Video / Camera Surveillance.
5G Wireless / Fronthaul
The XCZU19EG-2FFVB1517I's 1,143K+ logic cells and 16 accessible GTH transceivers enable 5G baseband, beamforming, and fronthaul processing. The ARM Cortex-A53 cluster runs protocol stacks at up to 1.3 GHz while Cortex-R5 cores handle deterministic radio control. In a typical ORAN RU design, the MPSoC interfaces to DDR4 memory for buffering and JESD204B ADCs/DACs for RF sampling; the high-speed transceivers transport CPRI/eCPRI data to the DU. The industrial temperature grade supports outdoor installation. Recommended DDR4 memory: MT40A512M16JY-075E from XAIPART's portfolio.
Empfohlen
Aerospace & Defense
For avionics and defense signal processing, the Zynq UltraScale+ MPSoC EG combines 1,143K+ logic cells with hardened ARM processing, enabling sensor fusion, radar, and secure communication. The -2 speed grade gives the 1.3 GHz A53 performance needed for software-defined radio and electronic warfare algorithms. The 'I' industrial grade supports rugged environments; the 1517-FCBGA package offers manageable board area with exposed thermal path. Use MT29F1G08ABAEAWP-IT:E NAND for boot image storage and MT40A512M16JY-075E DDR4 for high-bandwidth data. Designers must use AMD Vivado Design Suite for bitstream generation and pin assignment validation.
Empfohlen
Medical Imaging
In CT, ultrasound, and endoscopy systems, XCZU19EG-2FFVB1517I accelerates image reconstruction and AI inference in programmable logic while the A53 cluster manages device control. The 1,143K+ logic cells implement high-throughput filtering and beamforming; 16 GTH transceivers connect to gigabit serial interfaces and acquisition cards. DDR4 memory like MT40A512M16JY-075E buffers large image frames. The industrial temperature grade and hardened safety features help comply with medical standards, but proper isolation and power sequencing are essential. Companion MCU STM32H747BGT6 can handle system management and user interface tasks.
Empfohlen
Industrial Automation & Machine Vision
The XCZU19EG-2FFVB1517I delivers real-time vision processing, multi-axis robot control, and industrial Ethernet protocols in one SoC. The dual Cortex-R5 cores at up to 600 MHz provide hard real-time response for servo loops, while 1,143K+ logic cells implement vision pipelines and convolutional neural networks. The FPGA fabric supports EtherCAT, PROFINET, and time-sensitive networking bridges using the GTH transceivers. For system management, pair with STM32H747BGT6 MCU; for image buffering, use DDR4 MT40A512M16JY-075E. The industrial temperature grade suits 24/7 production environments; thermal design must account for high utilization.
Empfohlen
Data Center / SmartNIC
As a SmartNIC or network accelerator, the XCZU19EG-2FFVB1517I offloads packet filtering, cryptography, and storage transport from server CPUs. The 1,143K+ logic cells implement 100G-class data paths; 16 GTH transceivers connect to QSFP/SFP cages. The 1.3 GHz A53 cluster runs Linux/DPDK control planes, while the Mali-400 GPU handles lightweight rendering or compression tasks. DDR4 SDRAM like MT40A512M16JY-075E provides large buffering. The device's high power must be managed with airflow and PMIC sequencing. Use the Vivado high-level synthesis flow for rapid acceleration development.
Empfohlen
Video / Camera Surveillance
In high-resolution video surveillance systems, the XCZU19EG-2FFVB1517I performs multi-channel video decode, AI analytics, and display encoding. The 1,143K+ logic cells plus Mali-400 MP2 GPU support 4K/8K processing; the Cortex-A53 subsystem runs analytics software at up to 1.3 GHz. GTH transceivers carry serial camera inputs, and DDR4 memory caches multiple streams. The industrial temperature grade suits outdoor camera enclosures. Pair with XC7A100T as a front-end capture FPGA for additional MIPI/CSI bridging if needed, and use MT40A512M16JY-075E DDR4 for frame storage.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XCZU19EG-2FFVB1517I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XCZU19EG-2FFVB1517E | XCZU19EG-1FFVB1517I | XCZU19EG-3FFVB1517I |
|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD |
| Package | 1517-FCBGA (40x40 mm) | 1517-FCBGA (40x40 mm) - same | 1517-FCBGA (40x40 mm) - same | 1517-FCBGA (40x40 mm) - same |
| Speed Grade | -2 | -2 | -1 | -3 |
| FPGA Logic Cells | 1,143K+ | 1,143K+ | 1,143K+ | 1,143K+ |
| Accessible GTH Transceivers (FFVB1517) | 16 | 16 | 16 | 16 |
| Total Device Transceivers | 72 | 72 | 72 | 72 |
| Temperature Grade | Industrial (I) | E-grade (verify) | Industrial (I) | Industrial (I) |
| Design Tool Support | AMD Vivado Design Suite | AMD Vivado Design Suite | AMD Vivado Design Suite | AMD Vivado Design Suite |
Wichtigste Unterscheidungsmerkmale
- Balanced -2 speed grade with 1,143K+ logic cells (vs. XCZU19EG-1FFVB1517I)
- Industrial temperature grade (I) in the same footprint (vs. XCZU19EG-2FFVB1517C)
- 16 accessible GTH transceivers in FFVB1517 package (vs. XCZU19EG-2FFVB1517E)
Designhinweise
The XCZU19EG-2FFVB1517I requires multiple power rails including VCCINT, VCCAUX, VCCBRAM, and VCCO. Exact voltage levels and sequencing requirements must follow the AMD Zynq UltraScale+ MPSoC power management documentation; the verified web data does not include rail values. Use a PMIC with controllable sequencing to avoid current spikes during power-up. [DATA_NEEDED: precise voltage/current limits]
With 1,143K+ logic cells and 1.3 GHz A53 operation, this MPSoC can dissipate high power. The 1517-FCBGA package requires a heatsink or forced-air cooling for most applications. Since the suffix 'I' indicates industrial temperature grade, verify the exact junction temperature limit and thermal resistance from the datasheet. Budget thermal simulation time before finalizing the mechanical design.
Design the PCB with controlled impedance for the 16 accessible GTH serial lanes in the FFVB1517 package. Keep differential pairs short, use ground vias around transceiver lanes, and place AC-coupling capacitors close to the TX pins. Follow AMD's PCB design guidelines (UG583) and use the official package pinout file (UG1075) to map every ball.
Do not assume all 72 transceivers are accessible in the FFVB1517 package; only 16 GTHs are pinned out. Choose the D1760 package if you require additional GTY channels. Also confirm Vivado version support for this device; some Vivado releases do not include XCZU19EG-2FFVB1517I in their device list. Check the AMD support forum before starting a new project.
Compliance-Informationen
Compliance data not included in the verified web data; consult the official AMD Xilinx product documentation for RoHS/REACH declarations.