XCZU19EG-2FFVB1517I - Zynq UltraScale+ MPSoC | AMD
Артикул: XCZU19EG-2FFVB1517I ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $4250 | $4.250,00 |
| 10 | $3900 | $39.000,00 |
| 100 | $3200 | $320.000,00 |
| 500 | $2900 | $1.450.000,00 |
| 1.000 | $2600 | $2.600.000,00 |
XCZU19EG-2FFVB1517I Обзор
An MPSoC is a multi-processor system-on-chip that combines a processor system (PS) with programmable logic (PL) fabric, allowing designers to integrate software-based control and hardware-accelerated datapaths on one die. Within the programmable-logic hierarchy, the Zynq UltraScale+ MPSoC sits above traditional FPGAs by adding hardened ARM cores, memory controllers, and high-speed transceivers. This class of device is commonly used in 5G wireless, aerospace, defense, medical imaging, and data center acceleration.
Key features of the XCZU19EG-2FFVB1517I include high logic density with 1,143K+ logic cells, a -2 speed grade for balanced performance, and industrial temperature grade (I suffix) for extended environmental operation. The 1517-FCBGA package exposes 16 accessible GTH transceivers; the device contains 72 total transceivers, but the D1760 package is required to access all GTY channels. The quad A53 cluster can run Linux, while the dual R5 cores handle deterministic real-time control.
From a technical depth perspective, the Zynq UltraScale+ architecture uses 16nm FinFET process technology. The programmable logic can implement complex DSP pipelines, AI inference engines, and custom protocol bridges. The hardened PS includes DDR4 memory controllers, but the exact DDR4 PHY configuration and I/O bank assignments must be verified in the AMD package pinout file. The Mali-400 MP2 GPU accelerates lightweight graphics or compute-display tasks.
Typical applications include 5G/6G radio and fronthaul processing, radar and electronic warfare subsystems, medical imaging and ultrasound beamforming, industrial machine vision, SmartNIC acceleration, and multi-channel video surveillance. The combination of hardened processors and scalable logic gives designers flexibility to partition functions between software and hardware.
When designing with this device, plan a proper multi-rail power sequence and a robust thermal solution. Because exact VCCINT/VCCAUX voltage levels and thermal data are not included in the verified web snippets, refer to the official AMD Zynq UltraScale+ MPSoC data sheets and package pinout files before final board design.
Аналоги без доработки для XCZU19EG-2FFVB1517I — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
XCZU19EG-2FFVB1517E
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
XCZU19EG-1FFVB1517I
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
XCZU19EG-3FFVB1517I
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
XCZU19EG-2FFVB1517C
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
XCZU19EG-1FFVB1517E
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
XCZU19EG-2FFVB1517I Максимальные параметры и электрические характеристики
| Product Type | Zynq UltraScale+ MPSoC EG System-on-Chip (SoC) FPGA |
| Processor Subsystem | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight |
| Graphics Processor | ARM Mali-400 MP2 |
| FPGA Logic Cells | 1143K+ |
| Max Clock Frequencies | 533 MHz, 600 MHz, 1.3 GHz |
| Корпус | 1517-FCBGA (40x40 mm) |
| Speed Grade | -2 |
| Total Device Transceivers | 72 |
| Accessible GTH Transceivers (FFVB1517 package) | 16 |
| Family Series | Zynq UltraScale+ MPSoC EG |
| Тип монтажа | Surface Mount |
Руководство по цоколевке XCZU19EG-2FFVB1517I в корпусе 16
Цоколевка для XCZU19EG-2FFVB1517I (корпус 16). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для XCZU19EG-2FFVB1517I.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
XCZU19EG-2FFVB1517I подходит для 6 применениеs: 5G Wireless / Fronthaul, Aerospace & Defense, Medical Imaging, Industrial Automation & Machine Vision, Data Center / SmartNIC, Video / Camera Surveillance.
5G Wireless / Fronthaul
The XCZU19EG-2FFVB1517I's 1,143K+ logic cells and 16 accessible GTH transceivers enable 5G baseband, beamforming, and fronthaul processing. The ARM Cortex-A53 cluster runs protocol stacks at up to 1.3 GHz while Cortex-R5 cores handle deterministic radio control. In a typical ORAN RU design, the MPSoC interfaces to DDR4 memory for buffering and JESD204B ADCs/DACs for RF sampling; the high-speed transceivers transport CPRI/eCPRI data to the DU. The industrial temperature grade supports outdoor installation. Recommended DDR4 memory: MT40A512M16JY-075E from XAIPART's portfolio.
Рекомендуется
Aerospace & Defense
For avionics and defense signal processing, the Zynq UltraScale+ MPSoC EG combines 1,143K+ logic cells with hardened ARM processing, enabling sensor fusion, radar, and secure communication. The -2 speed grade gives the 1.3 GHz A53 performance needed for software-defined radio and electronic warfare algorithms. The 'I' industrial grade supports rugged environments; the 1517-FCBGA package offers manageable board area with exposed thermal path. Use MT29F1G08ABAEAWP-IT:E NAND for boot image storage and MT40A512M16JY-075E DDR4 for high-bandwidth data. Designers must use AMD Vivado Design Suite for bitstream generation and pin assignment validation.
Рекомендуется
Medical Imaging
In CT, ultrasound, and endoscopy systems, XCZU19EG-2FFVB1517I accelerates image reconstruction and AI inference in programmable logic while the A53 cluster manages device control. The 1,143K+ logic cells implement high-throughput filtering and beamforming; 16 GTH transceivers connect to gigabit serial interfaces and acquisition cards. DDR4 memory like MT40A512M16JY-075E buffers large image frames. The industrial temperature grade and hardened safety features help comply with medical standards, but proper isolation and power sequencing are essential. Companion MCU STM32H747BGT6 can handle system management and user interface tasks.
Рекомендуется
Industrial Automation & Machine Vision
The XCZU19EG-2FFVB1517I delivers real-time vision processing, multi-axis robot control, and industrial Ethernet protocols in one SoC. The dual Cortex-R5 cores at up to 600 MHz provide hard real-time response for servo loops, while 1,143K+ logic cells implement vision pipelines and convolutional neural networks. The FPGA fabric supports EtherCAT, PROFINET, and time-sensitive networking bridges using the GTH transceivers. For system management, pair with STM32H747BGT6 MCU; for image buffering, use DDR4 MT40A512M16JY-075E. The industrial temperature grade suits 24/7 production environments; thermal design must account for high utilization.
Рекомендуется
Data Center / SmartNIC
As a SmartNIC or network accelerator, the XCZU19EG-2FFVB1517I offloads packet filtering, cryptography, and storage transport from server CPUs. The 1,143K+ logic cells implement 100G-class data paths; 16 GTH transceivers connect to QSFP/SFP cages. The 1.3 GHz A53 cluster runs Linux/DPDK control planes, while the Mali-400 GPU handles lightweight rendering or compression tasks. DDR4 SDRAM like MT40A512M16JY-075E provides large buffering. The device's high power must be managed with airflow and PMIC sequencing. Use the Vivado high-level synthesis flow for rapid acceleration development.
Рекомендуется
Video / Camera Surveillance
In high-resolution video surveillance systems, the XCZU19EG-2FFVB1517I performs multi-channel video decode, AI analytics, and display encoding. The 1,143K+ logic cells plus Mali-400 MP2 GPU support 4K/8K processing; the Cortex-A53 subsystem runs analytics software at up to 1.3 GHz. GTH transceivers carry serial camera inputs, and DDR4 memory caches multiple streams. The industrial temperature grade suits outdoor camera enclosures. Pair with XC7A100T as a front-end capture FPGA for additional MIPI/CSI bridging if needed, and use MT40A512M16JY-075E DDR4 for frame storage.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для XCZU19EG-2FFVB1517I — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | XCZU19EG-2FFVB1517E | XCZU19EG-1FFVB1517I | XCZU19EG-3FFVB1517I |
|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD |
| Package | 1517-FCBGA (40x40 mm) | 1517-FCBGA (40x40 mm) - same | 1517-FCBGA (40x40 mm) - same | 1517-FCBGA (40x40 mm) - same |
| Speed Grade | -2 | -2 | -1 | -3 |
| FPGA Logic Cells | 1,143K+ | 1,143K+ | 1,143K+ | 1,143K+ |
| Accessible GTH Transceivers (FFVB1517) | 16 | 16 | 16 | 16 |
| Total Device Transceivers | 72 | 72 | 72 | 72 |
| Temperature Grade | Industrial (I) | E-grade (verify) | Industrial (I) | Industrial (I) |
| Design Tool Support | AMD Vivado Design Suite | AMD Vivado Design Suite | AMD Vivado Design Suite | AMD Vivado Design Suite |
Ключевые отличия
- Balanced -2 speed grade with 1,143K+ logic cells (против XCZU19EG-1FFVB1517I)
- Industrial temperature grade (I) in the same footprint (против XCZU19EG-2FFVB1517C)
- 16 accessible GTH transceivers in FFVB1517 package (против XCZU19EG-2FFVB1517E)
Заметки по проектированию
The XCZU19EG-2FFVB1517I requires multiple power rails including VCCINT, VCCAUX, VCCBRAM, and VCCO. Exact voltage levels and sequencing requirements must follow the AMD Zynq UltraScale+ MPSoC power management documentation; the verified web data does not include rail values. Use a PMIC with controllable sequencing to avoid current spikes during power-up. [DATA_NEEDED: precise voltage/current limits]
With 1,143K+ logic cells and 1.3 GHz A53 operation, this MPSoC can dissipate high power. The 1517-FCBGA package requires a heatsink or forced-air cooling for most applications. Since the suffix 'I' indicates industrial temperature grade, verify the exact junction temperature limit and thermal resistance from the datasheet. Budget thermal simulation time before finalizing the mechanical design.
Design the PCB with controlled impedance for the 16 accessible GTH serial lanes in the FFVB1517 package. Keep differential pairs short, use ground vias around transceiver lanes, and place AC-coupling capacitors close to the TX pins. Follow AMD's PCB design guidelines (UG583) and use the official package pinout file (UG1075) to map every ball.
Do not assume all 72 transceivers are accessible in the FFVB1517 package; only 16 GTHs are pinned out. Choose the D1760 package if you require additional GTY channels. Also confirm Vivado version support for this device; some Vivado releases do not include XCZU19EG-2FFVB1517I in their device list. Check the AMD support forum before starting a new project.
Информация о соответствии
Compliance data not included in the verified web data; consult the official AMD Xilinx product documentation for RoHS/REACH declarations.