XCZU19EG-2FFVB1517I - Zynq UltraScale+ MPSoC | AMD
MPN: XCZU19EG-2FFVB1517I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $3900 | $39,000.00 |
| 100 | $3200 | $320,000.00 |
| 500 | $2900 | $1,450,000.00 |
| 1,000 | $2600 | $2,600,000.00 |
Drop-in alternatives for XCZU19EG-2FFVB1517I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XCZU19EG-2FFVB1517E
β Drop-Inπ Reference alternative (not in catalog)
XCZU19EG-1FFVB1517I
β Drop-Inπ Reference alternative (not in catalog)
XCZU19EG-3FFVB1517I
β Drop-Inπ Reference alternative (not in catalog)
XCZU19EG-2FFVB1517C
β Drop-Inπ Reference alternative (not in catalog)
XCZU19EG-1FFVB1517E
β Drop-Inπ Reference alternative (not in catalog)
XCZU19EG-2FFVB1517I Maximum Ratings & Electrical Characteristics
| Product Type | Zynq UltraScale+ MPSoC EG System-on-Chip (SoC) FPGA |
| Processor Subsystem | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight |
| Graphics Processor | ARM Mali-400 MP2 |
| FPGA Logic Cells | 1143K+ |
| Max Clock Frequencies | 533 MHz, 600 MHz, 1.3 GHz |
| Package | 1517-FCBGA (40x40 mm) |
| Speed Grade | -2 |
| Temperature Grade | Industrial (I) [DATA_NEEDED: exact range from AMD datasheet] |
| Total Device Transceivers | 72 |
| Accessible GTH Transceivers (FFVB1517 package) | 16 |
| Family Series | Zynq UltraScale+ MPSoC EG |
| Mounting Type | Surface Mount |
| Supply Voltage | [DATA_NEEDED: VCCINT/VCCAUX values] |
| I/O Count | [DATA_NEEDED: I/O count per package pinout file] |
| Block RAM | [DATA_NEEDED: BRAM capacity] |
| DSP Slices | [DATA_NEEDED: DSP slices] |
| RoHS Status | [DATA_NEEDED: RoHS status] |
XCZU19EG-2FFVB1517I 16 Pin Configuration Guide
Complete pinout information for XCZU19EG-2FFVB1517I (16 package) with 16 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XCZU19EG-2FFVB1517I.
Refer to the datasheet for full pin configuration.
Estimated pin count: 16 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XCZU19EG-2FFVB1517I is suitable for 6 applications: 5G Wireless / Fronthaul, Aerospace & Defense, Medical Imaging, Industrial Automation & Machine Vision, Data Center / SmartNIC, Video / Camera Surveillance.
5G Wireless / Fronthaul
The XCZU19EG-2FFVB1517I's 1,143K+ logic cells and 16 accessible GTH transceivers enable 5G baseband, beamforming, and fronthaul processing. The ARM Cortex-A53 cluster runs protocol stacks at up to 1.3 GHz while Cortex-R5 cores handle deterministic radio control. In a typical ORAN RU design, the MPSoC interfaces to DDR4 memory for buffering and JESD204B ADCs/DACs for RF sampling; the high-speed transceivers transport CPRI/eCPRI data to the DU. The industrial temperature grade supports outdoor installation. Recommended DDR4 memory: MT40A512M16JY-075E from XAIPART's portfolio.
Recommended
Aerospace & Defense
For avionics and defense signal processing, the Zynq UltraScale+ MPSoC EG combines 1,143K+ logic cells with hardened ARM processing, enabling sensor fusion, radar, and secure communication. The -2 speed grade gives the 1.3 GHz A53 performance needed for software-defined radio and electronic warfare algorithms. The 'I' industrial grade supports rugged environments; the 1517-FCBGA package offers manageable board area with exposed thermal path. Use MT29F1G08ABAEAWP-IT:E NAND for boot image storage and MT40A512M16JY-075E DDR4 for high-bandwidth data. Designers must use AMD Vivado Design Suite for bitstream generation and pin assignment validation.
Recommended
Medical Imaging
In CT, ultrasound, and endoscopy systems, XCZU19EG-2FFVB1517I accelerates image reconstruction and AI inference in programmable logic while the A53 cluster manages device control. The 1,143K+ logic cells implement high-throughput filtering and beamforming; 16 GTH transceivers connect to gigabit serial interfaces and acquisition cards. DDR4 memory like MT40A512M16JY-075E buffers large image frames. The industrial temperature grade and hardened safety features help comply with medical standards, but proper isolation and power sequencing are essential. Companion MCU STM32H747BGT6 can handle system management and user interface tasks.
Recommended
Industrial Automation & Machine Vision
The XCZU19EG-2FFVB1517I delivers real-time vision processing, multi-axis robot control, and industrial Ethernet protocols in one SoC. The dual Cortex-R5 cores at up to 600 MHz provide hard real-time response for servo loops, while 1,143K+ logic cells implement vision pipelines and convolutional neural networks. The FPGA fabric supports EtherCAT, PROFINET, and time-sensitive networking bridges using the GTH transceivers. For system management, pair with STM32H747BGT6 MCU; for image buffering, use DDR4 MT40A512M16JY-075E. The industrial temperature grade suits 24/7 production environments; thermal design must account for high utilization.
Recommended
Data Center / SmartNIC
As a SmartNIC or network accelerator, the XCZU19EG-2FFVB1517I offloads packet filtering, cryptography, and storage transport from server CPUs. The 1,143K+ logic cells implement 100G-class data paths; 16 GTH transceivers connect to QSFP/SFP cages. The 1.3 GHz A53 cluster runs Linux/DPDK control planes, while the Mali-400 GPU handles lightweight rendering or compression tasks. DDR4 SDRAM like MT40A512M16JY-075E provides large buffering. The device's high power must be managed with airflow and PMIC sequencing. Use the Vivado high-level synthesis flow for rapid acceleration development.
Recommended
Video / Camera Surveillance
In high-resolution video surveillance systems, the XCZU19EG-2FFVB1517I performs multi-channel video decode, AI analytics, and display encoding. The 1,143K+ logic cells plus Mali-400 MP2 GPU support 4K/8K processing; the Cortex-A53 subsystem runs analytics software at up to 1.3 GHz. GTH transceivers carry serial camera inputs, and DDR4 memory caches multiple streams. The industrial temperature grade suits outdoor camera enclosures. Pair with XC7A100T as a front-end capture FPGA for additional MIPI/CSI bridging if needed, and use MT40A512M16JY-075E DDR4 for frame storage.
Recommended
Recommended Products Summary
Engineering reference data for XCZU19EG-2FFVB1517I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XCZU19EG-2FFVB1517E | XCZU19EG-1FFVB1517I | XCZU19EG-3FFVB1517I |
|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD |
| Package | 1517-FCBGA (40x40 mm) | 1517-FCBGA (40x40 mm) - same | 1517-FCBGA (40x40 mm) - same | 1517-FCBGA (40x40 mm) - same |
| Speed Grade | -2 | -2 | -1 | -3 |
| FPGA Logic Cells | 1,143K+ | 1,143K+ | 1,143K+ | 1,143K+ |
| Max Processor Frequencies | 1.3 GHz / 600 MHz / 533 MHz | 1.3 GHz / 600 MHz / 533 MHz | [DATA_NEEDED: lower -1 frequency] | [DATA_NEEDED: higher -3 frequency] |
| Accessible GTH Transceivers (FFVB1517) | 16 | 16 | 16 | 16 |
| Total Device Transceivers | 72 | 72 | 72 | 72 |
| Temperature Grade | Industrial (I) | E-grade (verify) | Industrial (I) | Industrial (I) |
| Design Tool Support | AMD Vivado Design Suite | AMD Vivado Design Suite | AMD Vivado Design Suite | AMD Vivado Design Suite |
Key Differentiators
- Balanced -2 speed grade with 1,143K+ logic cells (vs XCZU19EG-1FFVB1517I)
- Industrial temperature grade (I) in the same footprint (vs XCZU19EG-2FFVB1517C)
- 16 accessible GTH transceivers in FFVB1517 package (vs XCZU19EG-2FFVB1517E)
Design Notes
The XCZU19EG-2FFVB1517I requires multiple power rails including VCCINT, VCCAUX, VCCBRAM, and VCCO. Exact voltage levels and sequencing requirements must follow the AMD Zynq UltraScale+ MPSoC power management documentation; the verified web data does not include rail values. Use a PMIC with controllable sequencing to avoid current spikes during power-up. [DATA_NEEDED: precise voltage/current limits]
With 1,143K+ logic cells and 1.3 GHz A53 operation, this MPSoC can dissipate high power. The 1517-FCBGA package requires a heatsink or forced-air cooling for most applications. Since the suffix 'I' indicates industrial temperature grade, verify the exact junction temperature limit and thermal resistance from the datasheet. Budget thermal simulation time before finalizing the mechanical design.
Design the PCB with controlled impedance for the 16 accessible GTH serial lanes in the FFVB1517 package. Keep differential pairs short, use ground vias around transceiver lanes, and place AC-coupling capacitors close to the TX pins. Follow AMD's PCB design guidelines (UG583) and use the official package pinout file (UG1075) to map every ball.
Do not assume all 72 transceivers are accessible in the FFVB1517 package; only 16 GTHs are pinned out. Choose the D1760 package if you require additional GTY channels. Also confirm Vivado version support for this device; some Vivado releases do not include XCZU19EG-2FFVB1517I in their device list. Check the AMD support forum before starting a new project.
Compliance Information
Compliance data not included in the verified web data; consult the official AMD Xilinx product documentation for RoHS/REACH declarations.
