10AS066K2F35E2SG vs 10AS057K2F35E2SG Comparación
Comparación detallada lado a lado de 10AS066K2F35E2SG por Intel y 10AS057K2F35E2SG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AS066K2F35E2SG | 10AS057K2F35E2SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.890,00 | $2.304,55 |
| Series | Arria 10 SX | — |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 660,000 | 570,000 |
| Process Technology | 20 nm | — |
| Core Voltage | 0.9 V | — |
| DSP Performance | Up to 1.5 GHz (variable-precision DSP) | — |
| HPS CPU Cores | Dual ARM Cortex-A9 MPCore | — |
| HPS Debug | CoreSight | — |
| User I/O | 396 | — |
| Encapsulado | 1152-ball FC-FBGA (F35), 35 x 35 mm | 1152-FBGA, FC (35x35 mm) |
| Speed Grade | -2 (E2 industrial, slower timing corner) | E2 (mid-tier) |
| Temperatura de funcionamiento | Industrial grade (per E2 suffix) | [DATA_NEEDED: commercial/industrial grade range] |
| Tipo de montaje | Surface Mount (flip-chip BGA) | Surface Mount (FCBGA) |
| Nivel MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating] |
| Estado RoHS | Compliant (per distributor listing) | Compliant (lead-free) |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count for 570K LE Arria 10 SX] |
| Embedded Memory (M20K blocks) | — | [DATA_NEEDED: M20K count for 570K LE] |
| Embedded Memory (MLAB bits) | — | [DATA_NEEDED: MLAB bits for 570K LE] |
| DSP Blocks (18x19 Multipliers) | — | 1,568 |
| HPS Core | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Max Frequency | — | 1.5 GHz |
| Maximum User I/O | — | 396 |
| Transceiver Count (GX/SX) | — | 24 |
| Transceiver Max Data Rate | — | 17.4 Gbps |
| Hard PCIe Blocks | — | Gen2/Gen3 x4/x8 IP |
| Process Node | — | 20 nm (TSMC) |