10AS066K2F35E2SG - Arria 10 SX SoC FPGA, 660K LE, 1152-FBGA | Intel
N.º de pieza: 10AS066K2F35E2SG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $4126.44 | $4.126,44 |
| 10 | $3820 | $38.200,00 |
| 100 | $3450 | $345.000,00 |
| 500 | $3120 | $1.560.000,00 |
| 1.000 | $2890 | $2.890.000,00 |
10AS066K2F35E2SG Descripción general
An SoC FPGA is a single silicon device that combines a general-purpose applications processor subsystem with a programmable logic fabric. In the Arria 10 SX hierarchy, the ARM Cortex-A9 MPCore handles operating-system, networking and control-plane tasks, while the FPGA fabric accelerates latency-critical datapath, DSP, and interface-bridging functions. This heterogeneous architecture reduces bill-of-material count, simplifies board layout, and enables deterministic hardware/software partitioning that discrete processor-plus-FPGA designs cannot match. Compared with pure FPGAs, SoC FPGAs lower system power by offloading housekeeping tasks to the HPS, and compared with pure ASIC SoCs, they retain post-production flexibility for protocol updates and bug fixes.
Key features of the 10AS066K2F35E2SG include 660 K logic elements, 20 nm process technology, embedded DSP blocks supporting fixed- and floating-point operations up to 1.5 GHz, dual Cortex-A9 MPCore CPUs with NEON media engine, integrated CoreSight debug and trace, on-chip hard memory controllers for DDR3/DDR4, and the high-density 1152-ball FC-FBGA package that supports the -E2 speed grade at industrial temperatures. The -E2 suffix denotes the slower of two industrial speed grades, trading peak Fmax for power savings and timing margin, which is preferred for production builds where thermal headroom matters more than absolute throughput.
Technically, the device integrates heterogeneous resources including programmable logic fabric, M20K SRAM blocks, variable-precision DSP blocks, mixed-precision PHYs (transceivers up to 14.1 Gbps depending on variant), and the dual-core HPS. The 20 nm TSMC process and Intel's adaptive logic module (ALM) architecture deliver high logic utilization at moderate core voltages, while hard IP blocks accelerate memory and serial interface performance without consuming fabric.
Typical applications include wireless baseband processing, military radar signal processing, industrial machine vision, broadcast video processing, and high-performance test and measurement equipment. The Arria 10 SX series is engineered for applications that demand deterministic real-time performance combined with the flexibility of a general-purpose OS running on the HPS.
When designing with this part, ensure that the PCB supports the 35 x 35 mm FC-FBGA land pattern, with controlled-impedance routing for transceiver channels and matched-length DDR traces to the HPS memory controller. Power-rail sequencing must satisfy the 0.9 V core first, followed by transceiver and I/O rails, per Intel's PowerTree guidance.
This page synthesizes distributor pricing from authorized channels, drop-in alternatives within the Arria 10 family, and practical PCB and thermal design notes not found in the standalone manufacturer datasheet.
Alternativas directas para 10AS066K2F35E2SG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10AS066K2F35E2SG (mismo factor de forma y huella) — difiere en Package, Logic Elements, Speed Grade, RoHS Status, Mounting Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10AS066K2F35E2LG
✅ Sustitución directa✓ En stock
$3360 / unidad
Ver hoja de datos →10AS066K2F35E1HG
✅ Sustitución directa✓ En stock
$3290 / unidad
Ver hoja de datos →10AS066K1F35E1HG
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →10AS048K2F35E2SG
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →10AS066H4F34I3SG
✅ Sustitución directa✓ En stock
$2295 / unidad
Ver hoja de datos →10AS066K2F35E2SG Valores máximos y características eléctricas
| Series | Arria 10 SX |
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 660,000 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| DSP Performance | Up to 1.5 GHz (variable-precision DSP) |
| HPS CPU Cores | Dual ARM Cortex-A9 MPCore |
| HPS Debug | CoreSight |
| User I/O | 396 |
| Encapsulado | 1152-ball FC-FBGA (F35), 35 x 35 mm |
| Speed Grade | -2 (E2 industrial, slower timing corner) |
| Temperatura de funcionamiento | Industrial grade (per E2 suffix) |
| Tipo de montaje | Surface Mount (flip-chip BGA) |
| Estado RoHS | Compliant (per distributor listing) |
Guía de configuración de pines de 10AS066K2F35E2SG 1152-ball fc-fbga (f35), 35 x 35 mm
Configuración de pines para 10AS066K2F35E2SG (encapsulado 1152-ball fc-fbga (f35), 35 x 35 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10AS066K2F35E2SG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10AS066K2F35E2SG es adecuado para 6 aplicacións: Wireless Baseband Processing, Military Radar Signal Processing, Industrial Machine Vision, Broadcast Video Processing, Test and Measurement Equipment, Medical Imaging (Ultrasound / CT).
Wireless Baseband Processing
The 10AS066K2F35E2SG is well suited to wireless baseband processing because its 660K logic elements and variable-precision DSP blocks running up to 1.5 GHz deliver the throughput required for LTE and 5G NR channel decoding, FFT/iFFT kernels, and crest-factor reduction. The dual Cortex-A9 MPCore HPS runs the protocol stack, RRM, and MAC scheduler, while the FPGA fabric accelerates the PHY datapath, keeping deterministic latency on the time-critical path. The 1152-ball F35 package supports up to 14.1 Gbps transceiver channels for CPRI and JESD204B backhaul links, and the -E2 speed grade provides industrial temperature margin for outdoor base-station deployments.
Recomendado
Military Radar Signal Processing
The 10AS066K2F35E2SG fits military radar signal processing workloads because its 1.5 GHz floating-point DSP blocks perform pulse compression, MTI filtering, and beamforming kernels with deterministic throughput. The 660K logic elements provide parallel datapath density for phased-array calibration, while the integrated Cortex-A9 HPS handles tracking, classification, and network interfaces. The 1152-FBGA F35 footprint with -E2 industrial speed grade supports ruggedized enclosures with extended temperature operation, and the on-chip hard memory controllers feed DDR3/DDR4 buffers directly to DSP blocks for low-latency sample processing.
Recomendado
Industrial Machine Vision
The 10AS066K2F35E2SG is appropriate for industrial machine vision systems because its programmable fabric accelerates image preprocessing, defect detection, and convolutional inference, while the dual-core Cortex-A9 HPS runs the application layer, PLC communication, and HMI. The 396 user I/O support multi-camera aggregation through LVDS, MIPI CSI-2, or GigE Vision bridges, and the integrated CoreSight debug infrastructure simplifies firmware bring-up. The -E2 industrial speed grade and 35 x 35 mm FC-FBGA package fit factory-floor enclosures where ambient temperatures can rise and vibration tolerance matters.
Recomendado
Broadcast Video Processing
The 10AS066K2F35E2SG fits broadcast video processing because its DSP blocks handle 4K/UHD HEVC and AVC decode/encode pipelines, and its FPGA fabric accelerates color-space conversion, deinterlacing, and frame-rate conversion in real time. The 396 user I/O accept SDI, HDMI, and DisplayPort inputs via FPGA IP, while the Cortex-A9 HPS runs the device control plane, network management, and firmware updates. The 1152-ball F35 package supports multi-transceiver operation for SMPTE ST 2110 IP-based broadcast workflows, and the -E2 speed grade delivers reliable operation in 24/7 broadcast equipment racks.
Recomendado
Test and Measurement Equipment
The 10AS066K2F35E2SG is suited to high-end test and measurement equipment such as oscilloscopes, signal analyzers, and protocol testers because its 1.5 GHz DSP blocks implement real-time FFT, digital downconversion, and trigger-decision logic. The dual-core HPS runs the user interface, SCPI command parser, and LAN connectivity, while the FPGA fabric handles sample acquisition and parallel DSP. The 14.1 Gbps transceivers interface to high-speed ADCs and DACs via JESD204B/C, and the -E2 industrial speed grade ensures calibration stability across lab and field environments.
Recomendado
Medical Imaging (Ultrasound / CT)
The 10AS066K2F35E2SG suits medical imaging systems because its variable-precision DSP blocks perform beamforming, image reconstruction, and Doppler processing for ultrasound or CT front-end electronics. The Cortex-A9 HPS handles the patient interface, DICOM networking, and display pipeline, while the FPGA fabric ensures deterministic latency on the real-time imaging path. The 1152-ball F35 package and -E2 industrial speed grade fit medical equipment where reliability, thermal stability, and regulatory compliance drive design decisions, with 396 user I/O supporting multi-channel transducer arrays.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10AS066K2F35E2SG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10AS066K2F35E2LG | 10AS066K2F35E1HG | 10AS066K1F35E1HG | 10AS048K2F35E2SG | 10AS066H4F34I3SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA F35 (35x35 mm) | 1152-FBGA F35 (same) | 1152-FBGA F35 (same) | 1152-FBGA F35 (same) | 1152-FBGA F35 (same) | 1152-FBGA F34 (verify mechanical compatibility) |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 480,000 | 660,000 |
| Speed Grade | -E2 industrial (slower) | -E2 industrial | -E1 industrial (faster) | -E1 industrial (faster) | -E2 industrial | -I3 industrial |
| HPS Cores | Dual Cortex-A9 | Dual Cortex-A9 | Dual Cortex-A9 | Dual Cortex-A9 | Dual Cortex-A9 | Dual Cortex-A9 |
| DSP Performance | Up to 1.5 GHz | Up to 1.5 GHz | Up to 1.5 GHz | Up to 1.5 GHz | Up to 1.5 GHz | Up to 1.5 GHz |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
Diferenciadores clave
- Lower dynamic power from -E2 speed grade (frente a 10AS066K2F35E1HG)
- Higher logic-element density than 480K variant (frente a 10AS048K2F35E2SG)
- Drop-in lead-free alternative available (frente a 10AS066K2F35E2LG)
Notas de diseño
The 1152-ball FC-FBGA F35 package measures 35 x 35 mm and requires a high-layer-count PCB (typically 12+ layers) with microvia stack-ups to fan out from the 1.0 mm ball pitch. Use Intel's recommended land pattern and via-in-pad or dog-bone fan-out per the Arria 10 device handbook PCB chapter. Match-length impedance-controlled routing is mandatory for DDR3/DDR4 interfaces and for 14.1 Gbps transceiver channels, with reference stack-ups available from Intel's board design resource center.
Estimated: at full fabric utilization and 1.5 GHz DSP activity, the 10AS066K2F35E2SG may dissipate 15 to 25 W, requiring a heatsink plus thermal interface material or top-side cold plate. Place NTC thermistors near the package center to monitor junction temperature, and follow Intel's PowerTree guidelines for sequencing the 0.9 V core rail before transceiver and I/O supplies. Use the Quartus Prime PowerPlay analyzer to estimate dynamic power per design block before committing to the thermal solution.
Do not substitute a -E2 speed grade part for a -I3 or -E3 grade design without re-running timing closure in Quartus Prime, because the speed grade shift of approximately 10 to 15 percent Fmax per step can break critical paths. Confirm the K1 versus K2 silicon-variant ordering code matches the datasheet expected for your transceiver PLL configuration, and verify transceiver channel count against the variant's resource table before PCB layout.
For 14.1 Gbps transceiver channels, follow Intel's Transceiver Link Design guidelines for pre-emphasis, equalization, and PCB material selection (typically Megtron 6 or equivalent low-loss dielectric). Maintain 100 ohm differential impedance on transceiver pairs and keep stubs shorter than 150 mil to preserve signal integrity. Use IBIS-AMI models for system-level channel simulation before fabrication.
Información de cumplimiento
RoHS compliance per distributor listing. Industrial grade E2 suffix, not AEC-Q100 qualified. Specific REACH, halogen-free, and conflict-mineral status not provided in source data; verify with Intel product compliance documentation for production qualification.
