10AX090S2F45E2LG vs 10AX090S3F45E2LG Comparación
Comparación detallada lado a lado de 10AX090S2F45E2LG por Intel y 10AX090S3F45E2LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX090S2F45E2LG | 10AX090S3F45E2LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.750,00 | $12.480,00 |
| Family | Arria 10 GX | — |
| Logic Elements | 900,000 | 900,000 |
| Embedded Memory (bits) | 59,234,304 | 59,234,304 |
| DSP Blocks | Variable-precision, 24-bit multiplier base | 1,518 |
| Adaptive Logic Modules (ALMs) | 338,200 | 339,620 |
| Transceiver Channels | Up to 24 (data rate per channel up to 14.1 Gbps) | — |
| Hard Memory Controllers | 4, supports DDR4 / DDR3 / RLDRAM3 / QDR IV | — |
| PCIe Hard IP | PCI Express Gen3 x8 / Gen2 x8 | — |
| Process Technology | 20 nm Tri-Gate (FinFET) | — |
| Speed Grade | E2 (commercial/extended) | S3 (-2 speed grade equivalent) |
| Encapsulado | 1932-ball FCBGA, 45 mm body (F45) | 1932-ball FCBGA (F45, 45mm flip-chip BGA) |
| Operating Temperature Grade | Industrial (per -LG suffix convention; verify against order code) | — |
| Core Voltage (Vcc) | 0.9 V (nominal; per family datasheet) | — |
| User I/O Banks | [DATA_NEEDED: total user I/O count for 10AX090S2F45E2LG] | 12 |
| RoHS / Lead-Free | Yes (LG suffix indicates Pb-free) | — |
| Configuration Interface | Active serial (EPCQ-L), JTAG, Fast Passive Parallel | — |
| Series | — | Arria 10 GX |
| Transceivers | — | 624 (per package aggregate channels) |
| Maximum Transceiver Data Rate | — | 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT) |
| Process Node | — | TSMC 20nm |
| Core Voltage (nominal) | — | 0.9 V |
| Maximum User I/O | — | 624 |
| Rango de temperatura de funcionamiento | — | 0C to 100C (E2 commercial) |
| Tipo de montaje | — | Surface Mount (BGA) |
| Estado RoHS | — | Compliant |
| Memory Interfaces | — | DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3 |