10AX115N2F40I2SG vs 10AX115N2F40E1SG Comparación
Comparación detallada lado a lado de 10AX115N2F40I2SG por Intel y 10AX115N2F40E1SG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX115N2F40I2SG | 10AX115N2F40E1SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.750,00 | $3.325,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | — |
| Embedded Memory Bits | 68,857,856 | 68,857,600 |
| Adaptive Logic Modules (ALMs) | 427,200 | — |
| Registers | 1,708,800 | — |
| User I/O | 600 | — |
| Transceiver Protocol | GX (up to 14.1 Gbps) | — |
| Transceiver Count | [DATA_NEEDED: transceiver count exact value] | [DATA_NEEDED: transceiver count] |
| DSP Blocks | Variable-precision, hard floating-point | [DATA_NEEDED: DSP block count] |
| Encapsulado | 1517-ball FCBGA, 40 x 40 mm, 1.0 mm pitch | 1517-BBGA, FCBGA (F40) |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Speed Grade | 2 | N2 |
| Process Technology | TSMC 20 nm | 20 nm |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount (flip-chip BGA) | Surface Mount |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory Blocks (M20K) | — | [DATA_NEEDED: M20K count] |
| Maximum User I/O Pins | — | 600 |
| Maximum Transceiver Data Rate | — | 17.4 Gbps (chip-to-chip) |
| Hard PCIe IP Blocks | — | PCIe Gen3 |
| Core Voltage | — | 0.9 V |
| Package Dimensions | — | 40 mm x 40 mm |
| Ball Pitch | — | 1.0 mm |
| Temperature Grade | — | E1 (commercial) |
| Temperatura de unión de funcionamiento | — | -40C to +100C |