10AX115N2F40I2SG vs 10AX115N2F40E1SG Vergleich
Detaillierter Direktvergleich von 10AX115N2F40I2SG von Intel und 10AX115N2F40E1SG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX115N2F40I2SG | 10AX115N2F40E1SG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.750,00 | $3.325,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | — |
| Embedded Memory Bits | 68,857,856 | 68,857,600 |
| Adaptive Logic Modules (ALMs) | 427,200 | — |
| Registers | 1,708,800 | — |
| User I/O | 600 | — |
| Transceiver Protocol | GX (up to 14.1 Gbps) | — |
| Transceiver Count | [DATA_NEEDED: transceiver count exact value] | [DATA_NEEDED: transceiver count] |
| DSP Blocks | Variable-precision, hard floating-point | [DATA_NEEDED: DSP block count] |
| Gehäuse | 1517-ball FCBGA, 40 x 40 mm, 1.0 mm pitch | 1517-BBGA, FCBGA (F40) |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Speed Grade | 2 | N2 |
| Process Technology | TSMC 20 nm | 20 nm |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (flip-chip BGA) | Surface Mount |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory Blocks (M20K) | — | [DATA_NEEDED: M20K count] |
| Maximum User I/O Pins | — | 600 |
| Maximum Transceiver Data Rate | — | 17.4 Gbps (chip-to-chip) |
| Hard PCIe IP Blocks | — | PCIe Gen3 |
| Core Voltage | — | 0.9 V |
| Package Dimensions | — | 40 mm x 40 mm |
| Ball Pitch | — | 1.0 mm |
| Temperature Grade | — | E1 (commercial) |
| Betriebs-Sperrschichttemperatur | — | -40C to +100C |