10AX115U3F45E2SG vs 10AX115U2F45E2SG Comparación
Comparación detallada lado a lado de 10AX115U3F45E2SG por Intel y 10AX115U2F45E2SG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX115U3F45E2SG | 10AX115U2F45E2SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $5.800,00 | $6.920,66 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory Bits | 68,857,856 (≈ 52.99 Mbit) | 68,857,560 |
| Number of Transceivers | [DATA_NEEDED: per-die transceiver count, F45 package variant] | — |
| Maximum Transceiver Data Rate | 17.4 Gbps | — |
| DSP Blocks | Variable-precision, hardened floating-point | 1,518 (variable-precision, hardened FP) |
| Hard Memory Controllers | 2 (DDR4/DDR3/QDRII+/RLDRAM3) | — |
| Hard PCIe Gen3 IP Blocks | 2 × PCIe Gen3 (x8/x4/x2/x1) | — |
| Encapsulado | 1932-ball FCBGA (F45, 45×45 mm, 1.0 mm pitch) | 1932-ball FCBGA (45 mm) |
| Process Node | 20 nm Tri-Gate (Intel) | 20 nm |
| Speed Grade | -2 (E2 commercial/extended) | 2 |
| Temperatura de funcionamiento | Industrial (junction -40 °C to +100 °C) – device grade U | — |
| Supply Voltage Core | [DATA_NEEDED: VCC/VCCP core voltage] | — |
| Configuration Method | FPGA configuration via serial/parallel flash, JTAG | — |
| RoHS Compliance | Compliant | — |
| Nivel MSL | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] | — |
| Logic Elements | — | 1,150,000 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory Blocks | — | 2,134 M20K blocks (approx.) |
| User I/Os | — | 480 |
| Transceivers | — | Up to 24 (GX, 12.5 Gbps) |
| PCIe Hard IP | — | Gen3 x8 |
| Memory Interfaces | — | DDR4, QDR-IV, RLDRAM3 |
| Temperature Grade | — | E2 (industrial) |
| Tipo de montaje | — | Surface Mount |
| Estado RoHS | — | Compliant |
| Configuration Memory | — | SRAM-based (volatile, requires config device) |