10M08DAF484I7G vs 10M08DAU324I7G Comparación
Comparación detallada lado a lado de 10M08DAF484I7G por Intel y 10M08DAU324I7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M08DAF484I7G | 10M08DAU324I7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $25,80 | $22,10 |
| Series | MAX 10 | MAX 10 |
| Family | MAX 10 FPGA | — |
| Logic Elements (LE) | 8000 | 8,000 |
| Embedded Memory (bits) | 387072 | — |
| Embedded Memory (Kb) | 378 | — |
| Number of I/Os | 250 | — |
| Number of LABs/CLBs | [DATA_NEEDED: number of LABs] | — |
| Number of Logic Array Blocks | [DATA_NEEDED: LAB count] | — |
| Temperatura de funcionamiento | -40 °C to +100 °C (Industrial) | -40C to +100C (Industrial) |
| Supply Voltage - Core | 1.2 V | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Encapsulado / Carcasa | 484-BGA | — |
| Supplier Device Package | 484-FBGA (23x23 mm) | — |
| Process Technology | 55 nm | TSMC 55 nm embedded flash |
| Estado RoHS | Compliant | Compliant |
| Lead Free | Yes | — |
| Configuration Memory | Internal flash (non-volatile) | — |
| Embedded Memory (M9K blocks) | — | 378 Kbits |
| User Flash Memory | — | 387,072 bits |
| Maximum User I/O | — | 246 |
| Encapsulado | — | 324-LFBGA (UBGA), 1.0 mm pitch |
| Supply Voltage (Core) | — | 1.2 V typical |
| Supply Voltage (I/O Banks) | — | 1.2 V to 3.3 V |
| DSP Blocks (18x18 Multipliers) | — | 24 |
| PLLs | — | 4 |
| On-chip ADC | — | Dual 12-bit, 1 MSPS |
| Configuration | — | Internal flash, JTAG, Passive Serial |
| Nivel MSL | — | 3 |