10M08DAU324I7G vs 10M08DAF484I7G Comparación
Comparación detallada lado a lado de 10M08DAU324I7G por Intel y 10M08DAF484I7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M08DAU324I7G | 10M08DAF484I7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $22,10 | $25,80 |
| Series | MAX 10 | MAX 10 |
| Logic Elements (LE) | 8,000 | 8000 |
| Embedded Memory (M9K blocks) | 378 Kbits | — |
| User Flash Memory | 387,072 bits | — |
| Maximum User I/O | 246 | — |
| Encapsulado | 324-LFBGA (UBGA), 1.0 mm pitch | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | -40 °C to +100 °C (Industrial) |
| Supply Voltage (Core) | 1.2 V typical | — |
| Supply Voltage (I/O Banks) | 1.2 V to 3.3 V | — |
| Process Technology | TSMC 55 nm embedded flash | 55 nm |
| DSP Blocks (18x18 Multipliers) | 24 | — |
| PLLs | 4 | — |
| On-chip ADC | Dual 12-bit, 1 MSPS | — |
| Configuration | Internal flash, JTAG, Passive Serial | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | 3 | — |
| Family | — | MAX 10 FPGA |
| Embedded Memory (bits) | — | 387072 |
| Embedded Memory (Kb) | — | 378 |
| Number of I/Os | — | 250 |
| Number of LABs/CLBs | — | [DATA_NEEDED: number of LABs] |
| Number of Logic Array Blocks | — | [DATA_NEEDED: LAB count] |
| Supply Voltage - Core | — | 1.2 V |
| Encapsulado / Carcasa | — | 484-BGA |
| Supplier Device Package | — | 484-FBGA (23x23 mm) |
| Lead Free | — | Yes |
| Configuration Memory | — | Internal flash (non-volatile) |