10M08DAU324I7G vs 10M08DAF484I7G Vergleich
Detaillierter Direktvergleich von 10M08DAU324I7G von Intel und 10M08DAF484I7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M08DAU324I7G | 10M08DAF484I7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $22,10 | $25,80 |
| Series | MAX 10 | MAX 10 |
| Logic Elements (LE) | 8,000 | 8000 |
| Embedded Memory (M9K blocks) | 378 Kbits | — |
| User Flash Memory | 387,072 bits | — |
| Maximum User I/O | 246 | — |
| Gehäuse | 324-LFBGA (UBGA), 1.0 mm pitch | — |
| Betriebstemperatur | -40C to +100C (Industrial) | -40 °C to +100 °C (Industrial) |
| Supply Voltage (Core) | 1.2 V typical | — |
| Supply Voltage (I/O Banks) | 1.2 V to 3.3 V | — |
| Process Technology | TSMC 55 nm embedded flash | 55 nm |
| DSP Blocks (18x18 Multipliers) | 24 | — |
| PLLs | 4 | — |
| On-chip ADC | Dual 12-bit, 1 MSPS | — |
| Configuration | Internal flash, JTAG, Passive Serial | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | 3 | — |
| Family | — | MAX 10 FPGA |
| Embedded Memory (bits) | — | 387072 |
| Embedded Memory (Kb) | — | 378 |
| Number of I/Os | — | 250 |
| Number of LABs/CLBs | — | [DATA_NEEDED: number of LABs] |
| Number of Logic Array Blocks | — | [DATA_NEEDED: LAB count] |
| Supply Voltage - Core | — | 1.2 V |
| Gehäuse / Bauform | — | 484-BGA |
| Supplier Device Package | — | 484-FBGA (23x23 mm) |
| Lead Free | — | Yes |
| Configuration Memory | — | Internal flash (non-volatile) |