10M08DCF256C8G vs 10M16DCF256C8G Comparación
Comparación detallada lado a lado de 10M08DCF256C8G por Intel y 10M16DCF256C8G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M08DCF256C8G | 10M16DCF256C8G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2,28 | $17,10 |
| Series | MAX 10 | — |
| Logic Elements | 8,000 | — |
| Embedded Memory (bits) | 387,072 (378 Kbits user flash + block SRAM) | — |
| User I/O Count | 178 | — |
| Encapsulado | 256-LBGA (F256, FineLine BGA) | 256-ball FineLine BGA (FBGA), 17 x 17 mm |
| Pitch | 1.0 mm | — |
| Speed Grade | C8 (commercial, slowest speed bin) | C8 |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | — |
| Configuration | Internal flash (instant-on, non-volatile) | — |
| ADC | Dual 12-bit SAR, up to 17 analog inputs | — |
| 18x18 Multipliers | 8 | — |
| PLLs | 2 | — |
| Global Clock Networks | 4 | — |
| Process Technology | TSMC 55 nm embedded flash CMOS | 55 nm |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0 °C to +85 °C (commercial) |
| Design Software | Intel Quartus Prime (Lite / Standard / Pro) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | 3 (168 hours) | — |
| Family | — | MAX 10 |
| Logic Elements (LE) | — | 16000 |
| Maximum User I/O | — | 178 |
| Embedded SRAM | — | 562176 bits (562 Kbit) |
| User Flash | — | 5140 Kbit (5.14 Mbit) |
| Core Voltage | — | 1.2 V |
| Configuration Type | — | Dual-configuration flash (DC) |
| Maximum Operating Frequency | — | 472.5 MHz |
| Non-volatile Configuration | — | Yes (on-chip flash) |