10M08DCF256C8G vs 10M16DCF256C8G Vergleich
Detaillierter Direktvergleich von 10M08DCF256C8G von Intel und 10M16DCF256C8G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M08DCF256C8G | 10M16DCF256C8G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2,28 | $17,10 |
| Series | MAX 10 | — |
| Logic Elements | 8,000 | — |
| Embedded Memory (bits) | 387,072 (378 Kbits user flash + block SRAM) | — |
| User I/O Count | 178 | — |
| Gehäuse | 256-LBGA (F256, FineLine BGA) | 256-ball FineLine BGA (FBGA), 17 x 17 mm |
| Pitch | 1.0 mm | — |
| Speed Grade | C8 (commercial, slowest speed bin) | C8 |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | — |
| Configuration | Internal flash (instant-on, non-volatile) | — |
| ADC | Dual 12-bit SAR, up to 17 analog inputs | — |
| 18x18 Multipliers | 8 | — |
| PLLs | 2 | — |
| Global Clock Networks | 4 | — |
| Process Technology | TSMC 55 nm embedded flash CMOS | 55 nm |
| Betriebstemperatur | 0C to +85C (commercial) | 0 °C to +85 °C (commercial) |
| Design Software | Intel Quartus Prime (Lite / Standard / Pro) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | 3 (168 hours) | — |
| Family | — | MAX 10 |
| Logic Elements (LE) | — | 16000 |
| Maximum User I/O | — | 178 |
| Embedded SRAM | — | 562176 bits (562 Kbit) |
| User Flash | — | 5140 Kbit (5.14 Mbit) |
| Core Voltage | — | 1.2 V |
| Configuration Type | — | Dual-configuration flash (DC) |
| Maximum Operating Frequency | — | 472.5 MHz |
| Non-volatile Configuration | — | Yes (on-chip flash) |