10M08DCF256I7G vs 10M08DCF256A7G Comparación
Comparación detallada lado a lado de 10M08DCF256I7G por Intel y 10M08DCF256A7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M08DCF256I7G | 10M08DCF256A7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $12,20 | $15,20 |
| Series | MAX 10 | MAX 10 |
| Family | MAX 10 FPGA | — |
| Logic Elements (LE) | 8,000 | — |
| Embedded Memory (bits) | 387,072 | — |
| User I/O Count | 178 | — |
| DSP Blocks (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Encapsulado | 256-FBGA (FineLine BGA) | 256-LBGA (FineLine BGA, F256) |
| Tipo de montaje | Surface Mount | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Supply Voltage - Core | [DATA_NEEDED: core voltage range] | — |
| Supply Voltage - I/O Banks | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Configuration Memory | On-chip dual-configuration flash (non-volatile) | On-die dual-configuration flash (non-volatile) |
| On-die ADC | 12-bit, up to 1 MSa/s | — |
| External Memory Interface | LPDDR2 / DDR3 / DDR3L | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Process Technology | 55 nm NOR-flash-backed CMOS | 55 nm |
| Logic Elements | — | 8,000 LE |
| Embedded Memory | — | 378 Kbit (M9K blocks) |
| Total RAM Bits | — | 387,072 bits |
| User I/Os | — | 178 |
| Operating Supply Voltage (Core) | — | 1.2 V |
| Estilo de montaje | — | SMD/SMT |
| Speed Grade | — | -7 |
| Temperature Grade | — | Automotive (-40C to +125C) |
| Lead Free | — | Yes |
| Integrated ADC | — | 12-bit, 1 MSPS, 16-channel (per family) |