10M08DCF256I7G vs 10M08DCF256A7G Vergleich
Detaillierter Direktvergleich von 10M08DCF256I7G von Intel und 10M08DCF256A7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M08DCF256I7G | 10M08DCF256A7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $12,20 | $15,20 |
| Series | MAX 10 | MAX 10 |
| Family | MAX 10 FPGA | — |
| Logic Elements (LE) | 8,000 | — |
| Embedded Memory (bits) | 387,072 | — |
| User I/O Count | 178 | — |
| DSP Blocks (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Gehäuse | 256-FBGA (FineLine BGA) | 256-LBGA (FineLine BGA, F256) |
| Montageart | Surface Mount | — |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Supply Voltage - Core | [DATA_NEEDED: core voltage range] | — |
| Supply Voltage - I/O Banks | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Configuration Memory | On-chip dual-configuration flash (non-volatile) | On-die dual-configuration flash (non-volatile) |
| On-die ADC | 12-bit, up to 1 MSa/s | — |
| External Memory Interface | LPDDR2 / DDR3 / DDR3L | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Process Technology | 55 nm NOR-flash-backed CMOS | 55 nm |
| Logic Elements | — | 8,000 LE |
| Embedded Memory | — | 378 Kbit (M9K blocks) |
| Total RAM Bits | — | 387,072 bits |
| User I/Os | — | 178 |
| Operating Supply Voltage (Core) | — | 1.2 V |
| Montagestil | — | SMD/SMT |
| Speed Grade | — | -7 |
| Temperature Grade | — | Automotive (-40C to +125C) |
| Lead Free | — | Yes |
| Integrated ADC | — | 12-bit, 1 MSPS, 16-channel (per family) |