5CGXBC9E7F31C8N vs 5CGXBC9E6F31C7N Comparación
Comparación detallada lado a lado de 5CGXBC9E7F31C8N por Intel y 5CGXBC9E6F31C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 5CGXBC9E7F31C8N | 5CGXBC9E6F31C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $297,50 | $348,00 |
| Family | Cyclone V GX | Cyclone V GX |
| Logic Elements | 301,000 | 301,000 |
| Adaptive Logic Modules (ALMs) | 113,560 | 113,560 |
| Embedded Memory Bits | 14,251,008 (approx. 13.6 Mbit) | — |
| DSP Blocks (18x18) | 480 | 342 |
| Maximum User I/O Pins | 480 | — |
| Transceivers | 6 channels up to 3.125 Gbps | 12 (3.125 Gbps) |
| Transceiver Protocols | PCIe Gen2, CPRI, OBSAI, GbE, SDI | — |
| Hard PCIe Controllers | 2 (x4/x4 or x8) | — |
| PLLs | 4 | 6 |
| Global Clock Networks | 16 | 12 |
| Hard Memory Controller | DDR2/DDR3/LPDDR2 (soft IP) | — |
| Process Technology | TSMC 28nm low-power | — |
| Core Voltage | 1.1 V | — |
| Encapsulado | 896-pin FBGA (F31), 1.0 mm pitch | 896-pin FBGA (F31) |
| Temperatura de funcionamiento | 0C to +85C (commercial) | -40C to +85C (industrial) |
| Configuration Mode | AS, PS, FPP, CvP (PCIe) | — |
| Estado RoHS | Compliant | Compliant |
| Embedded Memory | — | 14,251,008 bits |
| Embedded Memory Blocks (M9K) | — | 1,720 |
| Maximum User I/O | — | 480 |
| PCIe Hard IP Blocks | — | 2 (Gen2 x1, x2, x4) |
| Process Node | — | 28 nm TSMC |
| Core Supply Voltage (VCCINT) | — | 1.1 V |
| Maximum Internal Clock Frequency | — | 800 MHz |
| Package Dimensions | — | 31 mm x 31 mm |