5CSEBA4U19I7LN vs 5CSEBA6U19I7N Comparación
Comparación detallada lado a lado de 5CSEBA4U19I7LN por Intel y 5CSEBA6U19I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
5CSEBA6U19I7N - Cyclone V SE SoC FPGA, 110K LE, Dual ARM Cortex-A9 800MHz | Intel
5CSEBA6U19I7N ✓ ActivoComparación de especificaciones
| Parámetro | 5CSEBA4U19I7LN | 5CSEBA6U19I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $168,00 | $142,75 |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Logic Elements | 40K | 110,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | Dual-core ARM Cortex-A9 MPCore |
| HPS Maximum Frequency | 925 MHz | 800 MHz |
| FPGA Logic Performance | up to 925 MHz DSP / 300 MHz logic | — |
| Embedded Memory (M10K) | [DATA_NEEDED: total M10K bits] | — |
| DSP Blocks (18x18 Multipliers) | 56 | — |
| PLLs | [DATA_NEEDED: PLL count per family datasheet] | 6 (FPGA) + 3 (HPS) |
| Memory Controller | DDR2/DDR3/LPDDR2 with ECC (hardened in HPS) | — |
| HPS Peripherals | UART, SPI, I2C, USB 2.0 OTG, EMAC, SD/MMC, NAND, GPIO | — |
| Encapsulado | 484-pin UFBGA (19x19 mm, 0.8 mm pitch) | 484-pin UBGAFBGA (UBGA-484, 19x19 mm) |
| Process Technology | TSMC 28 nm low-power | TSMC 28 nm low-power |
| Operating Temperature (Industrial) | -40C to +100C (I7 grade, inferred from MPN suffix) | — |
| Supply Voltage (core) | 1.1 V typical (Cyclone V family) | — |
| Estado RoHS | Compliant | Compliant |
| Configuration Scheme | Serial (EPCS) or Quad-Serial Flash | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Series | — | 5CSEBA6 |
| Device Variant | — | 5CSEA6 (U19 package, 110K LE) |
| Embedded Memory | — | 4.45 Mbits (M10K + MLAB) |
| Hard Memory Controller | — | DDR3, DDR3L, LPDDR2 |
| Transceivers | — | Up to 9 channels, 3.125 Gbps |
| DSP Blocks | — | 112 (18x18 multipliers) |
| User I/O Banks | — | 8 |
| Maximum User I/O | — | 288 (package-dependent) |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial) |
| Tensión de alimentación | — | Multi-rail (1.1 V core, 1.5/1.8/2.5/3.0/3.3 V I/O) |
| Configuration Modes | — | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) |