5CSEBA4U19I7LN vs 5CSEBA6U19I7N Vergleich
Detaillierter Direktvergleich von 5CSEBA4U19I7LN von Intel und 5CSEBA6U19I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
5CSEBA6U19I7N - Cyclone V SE SoC FPGA, 110K LE, Dual ARM Cortex-A9 800MHz | Intel
5CSEBA6U19I7N ✓ AktivSpezifikationsvergleich
| Parameter | 5CSEBA4U19I7LN | 5CSEBA6U19I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $168,00 | $142,75 |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Logic Elements | 40K | 110,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | Dual-core ARM Cortex-A9 MPCore |
| HPS Maximum Frequency | 925 MHz | 800 MHz |
| FPGA Logic Performance | up to 925 MHz DSP / 300 MHz logic | — |
| Embedded Memory (M10K) | [DATA_NEEDED: total M10K bits] | — |
| DSP Blocks (18x18 Multipliers) | 56 | — |
| PLLs | [DATA_NEEDED: PLL count per family datasheet] | 6 (FPGA) + 3 (HPS) |
| Memory Controller | DDR2/DDR3/LPDDR2 with ECC (hardened in HPS) | — |
| HPS Peripherals | UART, SPI, I2C, USB 2.0 OTG, EMAC, SD/MMC, NAND, GPIO | — |
| Gehäuse | 484-pin UFBGA (19x19 mm, 0.8 mm pitch) | 484-pin UBGAFBGA (UBGA-484, 19x19 mm) |
| Process Technology | TSMC 28 nm low-power | TSMC 28 nm low-power |
| Operating Temperature (Industrial) | -40C to +100C (I7 grade, inferred from MPN suffix) | — |
| Supply Voltage (core) | 1.1 V typical (Cyclone V family) | — |
| RoHS-Status | Compliant | Compliant |
| Configuration Scheme | Serial (EPCS) or Quad-Serial Flash | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Series | — | 5CSEBA6 |
| Device Variant | — | 5CSEA6 (U19 package, 110K LE) |
| Embedded Memory | — | 4.45 Mbits (M10K + MLAB) |
| Hard Memory Controller | — | DDR3, DDR3L, LPDDR2 |
| Transceivers | — | Up to 9 channels, 3.125 Gbps |
| DSP Blocks | — | 112 (18x18 multipliers) |
| User I/O Banks | — | 8 |
| Maximum User I/O | — | 288 (package-dependent) |
| Betriebstemperatur | — | -40C to +100C (Industrial) |
| Versorgungsspannung | — | Multi-rail (1.1 V core, 1.5/1.8/2.5/3.0/3.3 V I/O) |
| Configuration Modes | — | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) |