A3P1000-2FGG256M vs A3P1000-1FGG256 Comparación
Comparación detallada lado a lado de A3P1000-2FGG256M por Microchip Technology y A3P1000-1FGG256 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3P1000-2FGG256M - ProASIC3 Flash FPGA 11K LE 256-FBGA | Microchip
A3P1000-2FGG256M ✓ ActivoMicrochip Technology
A3P1000-1FGG256 - ProASIC3 Flash FPGA 1M Gates | Microchip
A3P1000-1FGG256 ✓ ActivoComparación de especificaciones
| Parámetro | A3P1000-2FGG256M | A3P1000-1FGG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $25,80 | $48,75 |
| Manufacturer Series | ProASIC3 (A3P1000) | — |
| Logic Elements (VersaTiles) | 11000 LE | — |
| Number of I/Os | 177 | — |
| Embedded Memory | 147456 bits | — |
| Speed Grade | 2 | -1 (commercial) |
| Tensión de alimentación de funcionamiento | 1.5 V | — |
| Encapsulado / Carcasa | FBGA-256 (256-LBGA) | — |
| Estilo de montaje | SMD/SMT | — |
| Minimum Operating Temperature | 0 C | — |
| Maximum Operating Temperature | +85 C | — |
| Configuration Technology | Flash (non-volatile, single-chip) | — |
| Packaging | Tray | [DATA_NEEDED: tray or reel standard quantity] |
| Product | ProASIC3 Series A3P1000 | — |
| Categoría | FPGAs (Field Programmable Gate Array) | — |
| Programming Tool | Microchip Libero SoC | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | RoHS compliant (per JLCPCB listing) |
| Family | — | ProASIC3 Flash FPGA |
| System Gates | — | 1M (approx.) |
| Logic Elements | — | 11K (per distributor listing) |
| Number of I/O | — | 177 |
| Configuration Memory | — | 147456 bit flash (on-chip) |
| Core Supply Voltage | — | 1.5 V |
| Maximum Fabric Frequency | — | [DATA_NEEDED: maximum fabric frequency] |
| Process Technology | — | 130 nm flash |
| Encapsulado | — | 256-LBGA (FBGA-256) |
| Temperatura de funcionamiento | — | 0C to +85C |
| Tipo de montaje | — | Surface Mount |
| Programmability | — | In-system reprogrammable, non-volatile flash |
| Live at Power-Up | — | Yes |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |