A3PE1500-1FG676I vs A3PE1500-2FGG676 Comparación
Comparación detallada lado a lado de A3PE1500-1FG676I por Microchip Technology y A3PE1500-2FGG676 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE1500-1FG676I - ProASIC3E FPGA 1.5M Gates | Microchip
A3PE1500-1FG676I ✓ ActivoMicrochip Technology
A3PE1500-2FGG676 - ProASIC3E FPGA 1.5M Gates | Microchip
A3PE1500-2FGG676 ✓ ActivoComparación de especificaciones
| Parámetro | A3PE1500-1FG676I | A3PE1500-2FGG676 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $65,89 | $33,50 |
| Family | ProASIC3E | — |
| System Gates | 1.5M | 1,500,000 |
| Logic Elements (CLBs) | 38400 | — |
| User I/Os | 444 | — |
| Total RAM Bits | 276480 | 276,480 |
| Max System Performance | 272MHz | — |
| Core Supply Voltage | 1.5V | 1.425 V to 1.575 V |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply voltage range] | — |
| Process Technology | 130nm, 7-layer metal (6 copper), Flash-based CMOS | 130 nm |
| Package Type | FBGA-676 (27 x 27 mm, 1 mm pitch, 2.23 mm height) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Rango de temperatura de funcionamiento | 0°C to 70°C (per DigChip listing) | — |
| Configuration | Non-volatile Flash (single-chip, live at power-up) | Flash-based, reprogrammable |
| Programming | In-system programmable (ISP) via JTAG | — |
| Total Power Consumption | [DATA_NEEDED: total power consumption] | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Estado RoHS | RoHS non-compliant (per DigChip listing) | RoHS Compliant |
| Lead-Free Status | Contains lead (per DigChip listing) | — |
| Product Family | — | ProASIC3E |
| Logic Elements | — | 16KLEs |
| User I/O | — | 444 |
| Temperatura de funcionamiento | — | 0°C to 85°C (TJ) |
| Speed Grade | — | -2 |
| System Performance | — | 310 MHz |
| Encapsulado | — | 676-BGA (FBGA) |
| Terminal Pitch | — | 1.000 mm |
| I/O Standards | — | [DATA_NEEDED: supported I/O standards] |
| PLLs | — | [DATA_NEEDED: number of PLLs/CCs] |
| Security | — | AES-based design security |
| Packaging | — | Tray |
| Lead Free Status | — | Lead Free |