AFS600-1FG256K vs AFS600-FG256K Comparación
Comparación detallada lado a lado de AFS600-1FG256K por Microchip Technology y AFS600-FG256K por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
AFS600-1FG256K - 600K Fusion Mixed-Signal FPGA | Microchip
AFS600-1FG256K ✓ ActivoComparación de especificaciones
| Parámetro | AFS600-1FG256K | AFS600-FG256K |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Device Type | Fusion mixed-signal field-programmable gate array (FPGA) | Fusion mixed-signal FPGA |
| Programmable Logic | Flash-based programmable logic | Flash-based CMOS programmable logic |
| Equivalent System Gates | 600,000 gates | — |
| Logic Cells | 13,824 logic cells | 13,824 logic cells |
| User I/O | 119 I/O | — |
| Maximum Frequency | 1282.05 MHz | — |
| Core Supply Voltage | 1.5 V | — |
| Integrated Analog | Configurable analog resources | — |
| Embedded Memory | Large flash memory blocks | — |
| Clock Management | Comprehensive clock generation and management circuitry | — |
| Encapsulado | 256-terminal plastic ball grid array (256-LBGA) | — |
| Terminal Count | 256 terminals | — |
| Package Shape | Square | — |
| Terminal Pitch | 1.00 mm | — |
| Package Dimensions | 17 mm x 17 mm | — |
| Tipo de montaje | Surface mount | Surface mount |
| Ordering Package Option | Tray | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | 0°C to 70°C |
| System Gates | — | 600,000 system gates |
| Configuration Technology | — | Nonvolatile flash configuration |
| Power-Off Retention | — | Program retained when powered off |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| Process Technology | — | 130 nm CMOS |
| Metal Layers | — | 7 metal layers |
| Logic Family | — | CMOS |
| Tensión de alimentación | — | 1.5 V |
| Package Type | — | BGA-256, 1.0 mm pitch |
| Recuento de pines | — | 256 pins |
| ARM Support | — | Optional ARM support in the Fusion family |