ATSAMA5D27C-D5M-CU vs ATSAMA5D22B-CNR Comparación
Comparación detallada lado a lado de ATSAMA5D27C-D5M-CU por Microchip Technology y ATSAMA5D22B-CNR por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
ATSAMA5D27C-D5M-CU - 500MHz Cortex-A5 MPU, 512Mb DDR2 SiP | Microchip
ATSAMA5D27C-D5M-CU ✓ ActivoMicrochip Technology
ATSAMA5D22B-CNR - 500MHz Cortex-A5 MPU 196-TFBGA | Microchip
ATSAMA5D22B-CNR ✓ ActivoComparación de especificaciones
| Parámetro | ATSAMA5D27C-D5M-CU | ATSAMA5D22B-CNR |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $18,40 | $7,21 |
| Part Status | Active | — |
| Core Processor | ARM Cortex-A5 | — |
| Number of Cores / Bus Width | 1 Core, 32-Bit | — |
| Speed | 500 MHz | — |
| Co-Processors / DSP | ARM NEON, FPU | — |
| RAM Controllers | DDR2/LPDDR2 (integrated 512 Mbit DDR2 SiP) | — |
| Graphics Acceleration | Yes (2D) | — |
| Peripheral Touch Controller | Yes (16-bit databus) | — |
| Audio Subsystem | I2S, class-D amplifier interface | — |
| Ethernet | Dual 10/100 GMAC with 1588 PTP | — |
| USB | USB HSIC + 2x USB 2.0 High-Speed | — |
| CAN | 2x CAN-FD | — |
| Serial Interfaces | 3x FLEXCOM (USART/SPI/TWI), 2x SD/MMC, 1x I2C, 1x SPI, 1x UART | — |
| Image Sensor Interface | Yes | — |
| Temperatura de funcionamiento | -40°C to +85°C (Industrial) | -40C to +105C (extended) |
| Encapsulado / Carcasa | 289-LFBGA (14x14 mm, 0.8 mm ball pitch) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Architecture | — | ARM Cortex-A5 (ARMv7-A) |
| Core Count | — | 1 |
| Data Width | — | 32-bit |
| Frecuencia de reloj máxima | — | 500 MHz |
| Core Supply Voltage | — | 1.2 V |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| L2 Cache | — | 128 KB (configurable as SRAM) |
| NEON Media Processing Engine | — | Yes |
| Floating Point Unit | — | Yes |
| ARM TrustZone | — | Yes |
| Peripheral Touch Controller (PTC) | — | Yes |
| Embedded Audio Subsystem | — | Yes (I2S/TDM) |
| Encapsulado | — | 196-TFBGA (11x11x1.2 mm) |
| Ball Pitch | — | 0.8 mm |
| Packaging | — | Tape & Reel (T&R) |