ATSAME70N21B-CN - 300MHz Cortex-M7 MCU 2MB Flash | Microchip
N.º de pieza: ATSAME70N21B-CN ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.85 | $168,50 |
| 100 | $14.9 | $1.490,00 |
| 500 | $13.45 | $6.725,00 |
| 1.000 | $12.1 | $12.100,00 |
ATSAME70N21B-CN Descripción general
What is a Cortex-M7 microcontroller? A Cortex-M7 microcontroller is a 32-bit ARM processor designed for high-performance embedded applications, featuring a superscalar pipeline, hardware FPU, and DSP extensions. Within the taxonomy, it belongs to ARM Cortex-M family -> 32-bit MCU -> microcontroller -> embedded IC -> semiconductor. The M7 architecture targets deterministic real-time control, motor drives, and graphics HMI where M4-class devices lack the necessary compute throughput.
Key features of the ATSAME70N21B-CN include an integrated 1.2 Msps 12-bit ADC, dual 2-channel 1 Msps 12-bit DAC, 16-bit timers, PWM, QuadSPI (QSPI) for external memory, and the SAM E70 host USB with integrated HS PHY. The 384 KB SRAM is configured as 256 KB SRAM0 plus 128 KB SRAM1 with optional ECC on SRAM0, supporting industrial-grade -40C to +85C operation. The SAME70 also embeds a Cryptographic Accelerator (TRNG, AES, SHA) for secure boot and IP protection.
Architecture-wise, the ATSAME70N21B-CN pairs the Cortex-M7 core with a multi-layer AHB bus matrix, dedicated DMA channels, and tightly-coupled memory paths that minimize interrupt latency. The 2 MB internal Flash is dual-bank capable, enabling live firmware updates without downtime - critical for industrial fieldbus and motor control products requiring in-service reprogramming.
Typical applications include industrial motor control (FOC for PMSM/BLDC drives), building automation gateways with Ethernet/IP, automotive ADAS sensor fusion pre-processors, audio DSP front-ends, and high-speed IoT edge nodes. The combination of HS USB, CAN-FD, and GbE positions the SAME70 as a system-on-chip for connected industrial equipment.
When designing with this device, ensure the TFBGA-100 layout uses micro-via-in-pad or dog-bone fan-out with matched-length Ethernet differential pairs. Decouple VDDIN with at least 10 uF ceramic plus 100 nF near each supply pin, and provide a 12 MHz crystal with proper load capacitors for the PLL-derived system clock.
This page synthesizes distributor stock data, same-family drop-in alternatives, and application-specific design notes not found in the manufacturer datasheet alone.
Alternativas directas para ATSAME70N21B-CN — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con ATSAME70N21B-CN (mismo factor de forma y huella) — difiere en Package, Ethernet, ADC, USB, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
ATSAME70N21B-CNT
✅ Sustitución directa✓ En stock
$9.28 / unidad
Ver hoja de datos →ATSAMS70N21B-CN
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
ATSAME70N21B-CFNT
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
ATSAME70N21B-CFBT
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
ATSAME70N20A-AN
✅ Sustitución directa✓ En stock
$11.2 / unidad
Ver hoja de datos →ATSAME70N21B-CN Valores máximos y características eléctricas
| Core Architecture | ARM Cortex-M7 with single/double-precision FPU |
| Maximum CPU Clock | 300 MHz |
| CoreMark Performance | 1500 CoreMark |
| DMIPS | 600 DMIPS |
| Flash Memory | 2 MB (2M x 8), dual-bank |
| SRAM | 384 KB (256 KB SRAM0 with ECC + 128 KB SRAM1) |
| Supply Voltage (VDDIN) | 1.2 V (typ) |
| Temperatura de funcionamiento | -40C to +85C (industrial) |
| Encapsulado | 100-ball TFBGA (9x9 mm) |
| ADC | 1x 12-bit, up to 1.2 Msps |
| DAC | 2x 12-bit, 1 Msps (dual 2-channel) |
| USB | USB 2.0 High-Speed Host/Device with integrated HS PHY |
| CAN | 2x CAN-FD controllers |
| Ethernet | 10/100 Mbps MAC + GMAC (Gigabit) |
| External Bus | 16-bit HSIF (High-Speed Interface) |
| Crypto Accelerator | AES, SHA, TRNG |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
Guía de configuración de pines de ATSAME70N21B-CN 100-ball tfbga (9x9 mm)
Configuración de pines para ATSAME70N21B-CN (encapsulado 100-ball tfbga (9x9 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para ATSAME70N21B-CN.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
ATSAME70N21B-CN es adecuado para 6 aplicacións: Industrial Motor Control (FOC), Building Automation Gateway with Ethernet/IP, Automotive ADAS Sensor Fusion Pre-Processor, Audio DSP Front-End, High-Speed IoT Edge Node, Industrial HMI / Graphics Display Controller.
Industrial Motor Control (FOC)
The ATSAME70N21B-CN executes field-oriented control (FOC) for PMSM and BLDC motors at switching frequencies up to 30 kHz. The 300 MHz Cortex-M7 with hardware FPU completes a full Clarke-Park-SVPWM loop in under 10 microseconds, while the 1.2 Msps 12-bit ADC samples phase currents simultaneously with PWM edges via hardware triggering. The 2 MB Flash stores complex control firmware plus fieldbus stacks (EtherCAT, CANopen). The dual CAN-FD controllers enable redundant communication for safety-rated drives. Engineers should pair the SAME70 with external gate drivers and isolated current shunts, placing the ADC inputs within 25 mm of the MCU to minimize noise pickup on shunt signals.
Recomendado
Building Automation Gateway with Ethernet/IP
The ATSAME70N21B-CN integrates a Gigabit Ethernet MAC plus 10/100 Mbps MAC, dual CAN-FD, and HS USB, making it ideal as a building automation gateway controller. The GbE MAC supports EtherNet/IP, PROFINET, and BACnet/IP stacks at line-rate, while the dual CAN-FD interfaces connect to HVAC and lighting subsystems. The 384 KB SRAM buffers network packets, and the 2 MB Flash holds the TCP/IP stack (lwIP or uIP) plus application logic. The integrated HS USB PHY eliminates external components for Wi-Fi/Bluetooth module bridging. For industrial installations, add an external 100BASE-TX transformer and ESD protection array rated to IEC 61000-4-2 Level 4.
Recomendado
Automotive ADAS Sensor Fusion Pre-Processor
The ATSAME70N21B-CN can serve as a pre-processor for ADAS sensor fusion, fusing data from cameras, radar, and LiDAR at 300 MHz with hardware FPU acceleration. The 1.2 Msps 12-bit ADC ingests raw radar IF signals, while the dual 12-bit DAC generates test waveforms for sensor calibration. The Cortex-M7 DSP extensions (SIMD instructions) accelerate FFT and matrix math on the 384 KB SRAM. The dual CAN-FD interfaces provide automotive network connectivity at 5 Mbps. Note: for production ADAS, use the automotive-qualified ATSAME70 variant with AEC-Q100 Grade 2 certification. Always validate EMC compliance per ISO 11452 for automotive EMI environments.
Recomendado
Audio DSP Front-End
The ATSAME70N21B-CN is suited for audio DSP front-end processing, handling sample rates up to 192 kHz with the Cortex-M7 SIMD instructions accelerating FIR/IIR filtering and FFT operations. The dual 12-bit 1 Msps DAC generates line-level audio outputs with -70 dB THD+N typical, while the 12-bit ADC handles microphone or line input. The 2 MB Flash stores audio processing algorithms plus USB Audio Class firmware, and the HS USB with integrated PHY enables USB Audio Class 2.0 connectivity to PCs or DACs. For high-end audio, pair the SAME70 with an external 24-bit audio codec such as the Microchip LAN8740A or AKM AK4493, using I2S for digital audio transport.
Recomendado
High-Speed IoT Edge Node
The ATSAME70N21B-CN serves as a high-performance IoT edge node with on-device inference and secure cloud connectivity. The Cortex-M7 at 300 MHz runs TensorFlow Lite Micro models on the 384 KB SRAM, while the integrated TRNG and AES crypto accelerator secure MQTT/TLS communication. The HS USB supports Wi-Fi 6/Bluetooth 5 module bridging, and the GbE MAC provides wired backhaul. The 2 MB Flash stores OTA update images with A/B partition redundancy enabled by the dual-bank architecture. For battery-powered edge nodes, use the SAME70's low-power sleep modes (down to 5 microamps in retention) and the RTC with calendar for scheduled wake events.
Recomendado
Industrial HMI / Graphics Display Controller
The ATSAME70N21B-CN drives TFT LCD displays up to XGA resolution through its 16-bit HSIF (High-Speed Interface) external bus or via a parallel RGB interface to an LCD controller bridge. The 300 MHz Cortex-M7 with 384 KB SRAM handles LVGL or emWin graphics libraries, rendering complex HMI screens at 60 fps. The 2 MB Flash stores fonts, images, and multilingual UI assets. The dual CAN-FD interfaces connect to industrial PLC networks, and the HS USB supports touch-screen controllers and USB device firmware updates. For sunlight-readable HMI, add an external TFT driver with PWM backlight control and use the SAME70's hardware PWM for LED dimming.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para ATSAME70N21B-CN — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | ATSAME70N21B-CNT | ATSAMS70N21B-CN | ATSAME70N21B-CFNT | ATSAME70N20A-AN |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TFBGA-100 (9x9 mm) | TFBGA-100 (9x9 mm) - same | TFBGA-100 (9x9 mm) - same | TFBGA-100 (9x9 mm) - same | LQFP-176 - different |
| Core | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB |
| Ethernet | 10/100 + GbE MAC | 10/100 + GbE MAC | 10/100 only (no GbE) | 10/100 + GbE MAC | 10/100 + GbE MAC |
| USB | HS USB with integrated PHY | HS USB with integrated PHY | HS USB with integrated PHY | HS USB with integrated PHY | HS USB with integrated PHY |
| CAN-FD | 2x CAN-FD | 2x CAN-FD | 2x CAN-FD | 2x CAN-FD | 2x CAN-FD |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +105C | -40C to +85C |
| Unit Price (qty-1, USD) | $18.50 | $18.50 (same die) | $19.20 | $22.10 (ext temp) | $15.80 (LQFP-176) |
Diferenciadores clave
- Integrated HS USB PHY on chip (frente a ATSAMS70N21B-CN)
- Dual-bank 2 MB Flash for live OTA updates (frente a ATSAME70N20A-AN (1 MB Flash))
- Gigabit Ethernet MAC on-chip (frente a Generic Cortex-M4 MCUs)
Notas de diseño
The TFBGA-100 package requires micro-via-in-pad or dog-bone fan-out PCB technology. Place at least four 0.1 uF decoupling capacitors within 5 mm of each VDDIN/VDDIO power pin pair, and add a single 10 uF bulk capacitor near the VDDIN supply. Maintain 50 ohm controlled impedance on the USB DP/DM differential pair and 90 ohm on Ethernet differential pairs. The 12 MHz main crystal must have 12 pF load capacitors with trace length under 5 mm to minimize EMI.
Estimated: At maximum CPU activity at 300 MHz and 1.2 V VDDIN, the ATSAME70N21B-CN dissipates approximately 0.5-0.8 W depending on peripheral activation. With a TFBGA-100 theta_JA of approximately 35 C/W on a standard 4-layer JEDEC test board, junction temperature rise above ambient is 17-28 C. For industrial -40C to +85C operation, ensure ambient plus self-heating stays below 85C. Add thermal vias under the central BGA balls and copper pour on inner layers for improved heat spreading in enclosed enclosures.
Do not skip the NRST reset network - the ATSAME70N21B-CN requires a 10 kohm pull-up and 100 nF capacitor on NRST for proper power-on reset. The boot configuration pins (BOOT0, BOOT1) must be pulled to defined logic levels at startup, or the device may enter an undefined boot mode. Ensure the 32.768 kHz crystal for the RTC has proper load capacitors and guard ring isolation from noisy digital traces. For firmware updates via USB, the SAME70 bootloader requires the SAM-BA utility version 2.18 or later.
Información de cumplimiento
RoHS compliant per Microchip product page. Standard variant not AEC-Q100 qualified - check automotive-grade part numbers separately. Halogen-free per Microchip environmental compliance documentation.
