BSC9131NSN7KHKB vs BSC9131NJN1HHHB557 Comparación
Comparación detallada lado a lado de BSC9131NSN7KHKB por NXP Semiconductors y BSC9131NJN1HHHB557 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
BSC9131NSN7KHKB - 800MHz e500 SoC | NXP Semiconductors
BSC9131NSN7KHKB ✗ Fin de vidaComparación de especificaciones
| Parámetro | BSC9131NSN7KHKB | BSC9131NJN1HHHB557 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Activo |
| Product Type | QorIQ Qonverge network processor SoC | — |
| General-Purpose CPU | PowerPC e500, 1 core, 32-bit | — |
| e500 Core Frequency | 800 MHz | — |
| DSP Processor | StarCore SC3850 at 1 GHz | — |
| Specialist Accelerator | MAPLE-B2F | — |
| Interfaz | IFC | — |
| External Memory Support | DDR3 | — |
| Encapsulado | 520-FCBGA, 21 x 21 mm | — |
| Recuento de pines | 520 balls | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | 0 C to 105 C | — |
| Core Count | 1 core | [DATA_NEEDED: core count] |
| Word Size | 32-bit | — |
| Estado del ciclo de vida | End of Life | Active; in-stock listing reported by LCSC |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Unit Price at Quantity 1 | [DATA_NEEDED: unit price] | — |
| Processor Type | — | QorIQ Qonverge multicore baseband processor |
| Processor Category | — | Embedded MPU / communications processor |
| Maximum Processor Frequency | — | 800 MHz |
| Package Type | — | 520-FCBGA |
| Ball Count | — | 520 balls |
| Package Technology | — | Flip-chip ball grid array |
| Memory Interface | — | [DATA_NEEDED: memory interface type and configuration] |
| Network and Serial Interfaces | — | [DATA_NEEDED: network and serial interface list] |
| Input Supply Voltage | — | [DATA_NEEDED: input supply voltage range] |
| I/O Voltage | — | [DATA_NEEDED: I/O voltage range] |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| Resistencia térmica | — | [DATA_NEEDED: thermal resistance] |
| Maximum Junction Temperature | — | [DATA_NEEDED: maximum junction temperature] |
| Physical Dimensions | — | [DATA_NEEDED: package dimensions] |
| Manufacturer | — | NXP Semiconductors |