BSC9131NSN7KHKB vs BSC9131NJN1HHHB557 비교
다음의 상세 나란히 비교: BSC9131NSN7KHKB 제조: NXP Semiconductors 및 BSC9131NJN1HHHB557 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | BSC9131NSN7KHKB | BSC9131NJN1HHHB557 |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 수명 종료 | 활성 |
| Product Type | QorIQ Qonverge network processor SoC | — |
| General-Purpose CPU | PowerPC e500, 1 core, 32-bit | — |
| e500 Core Frequency | 800 MHz | — |
| DSP Processor | StarCore SC3850 at 1 GHz | — |
| Specialist Accelerator | MAPLE-B2F | — |
| 인터페이스 | IFC | — |
| External Memory Support | DDR3 | — |
| 패키지 | 520-FCBGA, 21 x 21 mm | — |
| 핀 수 | 520 balls | — |
| 실장 유형 | Surface Mount | Surface Mount |
| 동작 온도 | 0 C to 105 C | — |
| Core Count | 1 core | [DATA_NEEDED: core count] |
| Word Size | 32-bit | — |
| 수명 주기 상태 | End of Life | Active; in-stock listing reported by LCSC |
| RoHS 상태 | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Unit Price at Quantity 1 | [DATA_NEEDED: unit price] | — |
| Processor Type | — | QorIQ Qonverge multicore baseband processor |
| Processor Category | — | Embedded MPU / communications processor |
| Maximum Processor Frequency | — | 800 MHz |
| Package Type | — | 520-FCBGA |
| Ball Count | — | 520 balls |
| Package Technology | — | Flip-chip ball grid array |
| Memory Interface | — | [DATA_NEEDED: memory interface type and configuration] |
| Network and Serial Interfaces | — | [DATA_NEEDED: network and serial interface list] |
| Input Supply Voltage | — | [DATA_NEEDED: input supply voltage range] |
| I/O Voltage | — | [DATA_NEEDED: I/O voltage range] |
| 동작 온도 범위 | — | [DATA_NEEDED: operating temperature range] |
| 열 저항 | — | [DATA_NEEDED: thermal resistance] |
| Maximum Junction Temperature | — | [DATA_NEEDED: maximum junction temperature] |
| Physical Dimensions | — | [DATA_NEEDED: package dimensions] |
| Manufacturer | — | NXP Semiconductors |