BSC9131NSN7KHKB vs BSC9131NJN1HHHB557 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng BSC9131NSN7KHKB sa pamamagitan ng NXP Semiconductors at BSC9131NJN1HHHB557 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
BSC9131NSN7KHKB - 800MHz e500 SoC | NXP Semiconductors
BSC9131NSN7KHKB ✗ Tapus ng BuhayPagsanggunian na paghahambing
| Parametro | BSC9131NSN7KHKB | BSC9131NJN1HHHB557 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Tapus ng Buhay | Aktibo |
| Product Type | QorIQ Qonverge network processor SoC | — |
| General-Purpose CPU | PowerPC e500, 1 core, 32-bit | — |
| e500 Core Frequency | 800 MHz | — |
| DSP Processor | StarCore SC3850 at 1 GHz | — |
| Specialist Accelerator | MAPLE-B2F | — |
| Interface | IFC | — |
| External Memory Support | DDR3 | — |
| Packhaging | 520-FCBGA, 21 x 21 mm | — |
| Bilang ng Pin | 520 balls | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0 C to 105 C | — |
| Core Count | 1 core | [DATA_NEEDED: core count] |
| Word Size | 32-bit | — |
| Katayuan ng Lifecycle | End of Life | Active; in-stock listing reported by LCSC |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Unit Price at Quantity 1 | [DATA_NEEDED: unit price] | — |
| Processor Type | — | QorIQ Qonverge multicore baseband processor |
| Processor Category | — | Embedded MPU / communications processor |
| Maximum Processor Frequency | — | 800 MHz |
| Package Type | — | 520-FCBGA |
| Ball Count | — | 520 balls |
| Package Technology | — | Flip-chip ball grid array |
| Memory Interface | — | [DATA_NEEDED: memory interface type and configuration] |
| Network and Serial Interfaces | — | [DATA_NEEDED: network and serial interface list] |
| Input Supply Voltage | — | [DATA_NEEDED: input supply voltage range] |
| I/O Voltage | — | [DATA_NEEDED: I/O voltage range] |
| Hanay ng Temperature na Operasyon | — | [DATA_NEEDED: operating temperature range] |
| Thermal Resistance | — | [DATA_NEEDED: thermal resistance] |
| Maximum Junction Temperature | — | [DATA_NEEDED: maximum junction temperature] |
| Physical Dimensions | — | [DATA_NEEDED: package dimensions] |
| Manufacturer | — | NXP Semiconductors |