EP1C12F256C6 - Cyclone FPGA, 12,060 LEs, 256-BGA | Intel
N.º de pieza: EP1C12F256C6 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $80.48 | $80,48 |
| 10 | $72.43 | $724,30 |
| 100 | $64.38 | $6.438,00 |
| 250 | $56.34 | $14.085,00 |
| 500 | $48.29 | $24.145,00 |
EP1C12F256C6 Descripción general
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory and DSP resources that can be reconfigured after manufacturing to implement arbitrary digital logic. FPGAs sit hierarchically between application-specific integrated circuits (ASICs) and microcontrollers in the digital design landscape: they offer ASIC-level parallelism and throughput while preserving the programmability and short time-to-market of processor-based designs. The Cyclone family specifically targets high-volume, cost-sensitive applications where traditional FPGA pricing has historically been a barrier.
The EP1C12F256C6 features 12,060 logic elements organized into 1,206 logic array blocks (LABs), 239,616 RAM bits (52 M4K memory blocks of 4,608 bits each), and 17 embedded 18x18 multipliers for DSP operations. It includes two PLLs for clock management and multiplication, supports LVDS, LVTTL, SSTL-2, SSTL-3, and PCI I/O standards, and offers true LVDS support up to 640 Mbps. The 256-FBGA package has a 17 mm x 17 mm body with a 1.0 mm ball pitch, enabling compact PCB layouts.
The Cyclone I architecture uses 4-input look-up tables (LUTs), dedicated carry chains for fast arithmetic, and embedded multiplier blocks for efficient DSP implementations. The device supports configuration via active serial (AS), passive serial (PS), and JTAG modes, with built-in decompression of configuration bitstreams. The 130 nm process delivers an attractive performance-per-watt profile, making the family suitable for thermally constrained embedded applications.
Typical applications for the EP1C12F256C6 include industrial control and factory automation, telecommunications line cards and DSLAMs, video processing and image capture pipelines, consumer electronics such as digital displays and set-top boxes, automotive infotainment prototypes, and cost-sensitive prototyping for ASIC migration. The combination of high logic density, embedded multipliers, and abundant I/O makes it well-suited for glue logic replacement, bus bridging, and moderate-complexity DSP functions.
When designing with the EP1C12F256C6, use Quartus II version 13.0 sp1 or earlier for full design support, since newer Quartus versions have dropped Cyclone I device support. Pay attention to decoupling: place 0.1 uF and 10 uF capacitors near each power pin pair, and use a 4-layer PCB with continuous ground and power planes to minimize SSO noise. The 256-FBGA package requires via-in-pad or microvia technology for reliable assembly.
This page synthesizes distributor stock and pricing, same-family Cyclone drop-in alternatives, and practical Quartus II design notes that go beyond the device datasheet, giving engineers a single reference for sourcing, substitution, and design bring-up.
Alternativas directas para EP1C12F256C6 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1C12F256C6 (mismo factor de forma y huella) — difiere en Package, Process Technology, Family, Speed Grade, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1C12F256C6N
✅ Sustitución directa✓ En stock
$51.9 / unidad
Ver hoja de datos →EP1C12F256C7N
✅ Sustitución directa✓ En stock
$27.95 / unidad
Ver hoja de datos →EP1C12F256C8N
✅ Sustitución directa✓ En stock
$15.1 / unidad
Ver hoja de datos →EP1C12F256I7
✅ Sustitución directa✓ En stock
$49.95 / unidad
Ver hoja de datos →EP1C12F256I6
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP1C12F256C6 Valores máximos y características eléctricas
| Series | Cyclone I |
| Logic Elements | 12,060 |
| Logic Array Blocks (LABs) | 1,206 |
| Embedded RAM Bits | 239,616 bits (52 M4K blocks) |
| Embedded 18x18 Multipliers | 17 |
| Maximum User I/Os | 185 |
| PLLs | 2 |
| Process Technology | 130 nm SRAM, 1.5 V core |
| Encapsulado | 256-BGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) |
| Temperatura de funcionamiento | 0C to +85C (commercial, C6 speed grade) |
| Speed Grade | C6 (mid-tier) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL-2/3, PCI |
| LVDS Data Rate | Up to 640 Mbps |
| Tipo de montaje | Surface Mount (BGA) |
Guía de configuración de pines de EP1C12F256C6 256-bga (fineline bga, 17x17 mm, 1.0 mm pitch)
Configuración de pines para EP1C12F256C6 (encapsulado 256-bga (fineline bga, 17x17 mm, 1.0 mm pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP1C12F256C6.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP1C12F256C6 es adecuado para 6 aplicacións: Industrial Control and Factory Automation, Telecommunications Line Cards, Video Processing and Image Capture, Consumer Electronics and Display Controllers, Automotive Infotainment Prototyping, ASIC Prototyping and Glue Logic Replacement.
Industrial Control and Factory Automation
The EP1C12F256C6 fits industrial automation because its 12,060 logic elements and 17 embedded 18x18 multipliers handle multi-axis motor control loops, encoder decoding, and fieldbus protocol bridging simultaneously. The 185 user I/Os accommodate multiple RS-485 ports, digital I/O banks, and PWM channels for servo drives, while two PLLs generate the precise clock trees required for CAN, EtherCAT, or Profibus interfaces. The commercial 0C to +85C operating range covers most factory-floor enclosures. Placing the EP1C12F256C6 between the MCU and the power-stage drivers, with 0.1 uF and 10 uF decoupling on every VCCINT/VCCIO pair, yields deterministic control latency that pure software solutions cannot match.
Recomendado
Telecommunications Line Cards
The EP1C12F256C6 is well matched to telecom line cards because its 239,616 bits of embedded RAM implement channelized buffers and lookup tables for T1/E1 framers and DSL PHY interfaces. The 17 multipliers accelerate Reed-Solomon and Viterbi forward error correction, while the 256-FBGA package's 185 I/Os support LVDS links to upstream ASICs at up to 640 Mbps per the Cyclone I datasheet. Its 1.5 V core consumption keeps board thermal budgets manageable in densely populated line-card shelves. Pair the FPGA with an external PHY and use the two PLLs to derive independent clocks for transmit and receive paths without jitter accumulation.
Recomendado
Video Processing and Image Capture
The EP1C12F256C6 suits video processing because its 12,060 logic elements and 17 multipliers can implement pipelined Sobel, FIR, and color-space conversion filters at VGA to 720p resolutions in real time. The 52 M4K memory blocks store line buffers and frame-grab FIFOs without external SRAM, reducing BOM cost on cost-sensitive cameras and display controllers. The 185 user I/Os drive parallel RGB or LVDS panel interfaces, and the device's JTAG and AS configuration paths enable in-field firmware updates. Place the FPGA downstream of the image sensor and upstream of the LCD controller, using one PLL to double the input pixel clock for internal processing pipelines.
Recomendado
Consumer Electronics and Display Controllers
The EP1C12F256C6 is attractive for consumer display controllers because its 12,060 logic elements, 52 M4K RAM blocks, and 17 multipliers implement scalers, deinterlacers, and OSD compositors in a single chip. The 185 user I/Os accommodate HDMI bridge interfaces, LVDS panel links, and multiple I2C/SPI control buses. The 130 nm process and 1.5 V core deliver an attractive performance-per-watt ratio for thermally enclosed set-top boxes and digital photo frames. Use the two PLLs to generate independent pixel clocks for the input source and the output panel, with a 4-layer PCB stack-up to keep SSO noise below the LVDS eye-mask limits.
Recomendado
Automotive Infotainment Prototyping
The EP1C12F256C6 enables rapid infotainment prototyping because its 12,060 LEs can emulate I2S audio routers, MOST bus bridges, and LVDS display backbones without waiting for an ASIC spin. The 17 hardware multipliers accelerate audio DSP and equalizer functions, while 185 I/Os interface to touch controllers, CAN transceivers, and rear-seat displays. The commercial temperature range is acceptable for cabin-mounted prototypes; production designs should migrate to AEC-Q100-qualified Cyclone IV or Cyclone 10 LP parts. Place the FPGA on a carrier board with 0.1 uF/10 uF decoupling pairs and a JTAG header for in-vehicle firmware iteration.
Recomendado
ASIC Prototyping and Glue Logic Replacement
The EP1C12F256C6 is widely used for ASIC prototyping because its 12,060 logic elements, 52 M4K RAM blocks, and 17 multipliers provide enough capacity to host a full pre-silicon validation of mid-complexity ASIC RTL. Designers benefit from deterministic timing closure using Quartus II TimeQuest, plus abundant I/O for FPGA-to-ASIC co-emulation. Its 1.5 V core and 130 nm process are well characterized, and the 256-FBGA's 1.0 mm pitch works with standard via-in-pad PCB fabrication. Migrate to Cyclone IV or Cyclone 10 LP for new prototyping starts since Quartus II support ends at version 13.0 sp1 for Cyclone I.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1C12F256C6 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP1C12F256C6N | EP1C12F256C7N | EP1C12F256C8N | EP1C12F256I7 | EP1C12F256I6 |
|---|---|---|---|---|---|---|
| Package | 256-BGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) | 256-BGA - same | 256-BGA - same | 256-BGA - same | 256-BGA - same | 256-BGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | C6 | C6 | C7 (~10% faster than C6) | C8 (~15% faster than C6) | I7 (faster, industrial) | I6 (industrial equivalent of C6) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Logic Elements | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 |
| User I/Os | 185 | 185 | 185 | 185 | 185 | 185 |
Diferenciadores clave
- Drop-in upgrade path to faster speed grades within the same package (frente a EP1C12F256C8N)
- Industrial temperature variant available in identical package (frente a EP1C12F256I7)
- Quartus II 13.0 sp1 toolchain compatibility across all variants (frente a Cross-brand FPGA alternatives)
Notas de diseño
The 256-FBGA package with 1.0 mm ball pitch requires microvia or via-in-pad PCB technology for reliable assembly and escape routing. Use a 4-layer stack-up with continuous ground and power planes directly beneath the BGA to minimize SSO noise and provide low-inductance returns for switching I/Os. Place 0.1 uF decoupling capacitors within 2 mm of every VCCINT and VCCIO ball pair, and add bulk 10 uF capacitors around the BGA perimeter for transient current support.
Cyclone I device support ends at Quartus II version 13.0 sp1 - newer Quartus versions do not include the Cyclone I device library and will refuse to compile. Pin the Quartus version in your design environment and document the toolchain dependency in your project README. When migrating to newer Cyclone families (Cyclone IV, Cyclone 10 LP), expect I/O bank voltage changes, configuration scheme differences, and updated PLL primitives that require RTL updates.
Although the 130 nm process is relatively cool, sustained high toggle rates on all 185 I/Os combined with high internal logic utilization can push junction temperature into the 90C+ range. Use the Quartus II PowerPlay Power Analyzer to estimate worst-case power, and place a thermal copper pour directly under the BGA's exposed pad region. For fully enclosed industrial enclosures, derate the clock frequency by 10-15% if ambient exceeds 70C.
Información de cumplimiento
RoHS and REACH compliance per Altera/Intel product page. The 'N' suffix variants (e.g., EP1C12F256C6N) explicitly confirm lead-free / Pb-free assembly. Not AEC-Q100 qualified - for automotive production, migrate to AEC-Q100-qualified Cyclone IV or Cyclone 10 LP families.
