EP1K30FC256-1 vs EP1K10FC256-1 Comparación
Comparación detallada lado a lado de EP1K30FC256-1 por Intel y EP1K10FC256-1 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1K30FC256-1 | EP1K10FC256-1 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,85 | $22,62 |
| Family | ACEX-1K | ACEX-1K |
| Logic Elements | 17,280 | 576 |
| Typical Gates | 30,000 | 10,000 |
| Logic Cells | 1,728 | — |
| Embedded RAM Bits | 24,576 | — |
| User I/O Pins | 171 | — |
| Logic Array Blocks (LABs) | 216 | — |
| Embedded Array Blocks (EABs) | 6 | — |
| Core Voltage (VCCINT) | 2.5 V | — |
| I/O Voltage (VCCIO) | 3.3 V / 2.5 V (multi-voltage) | — |
| Operating Temperature Grade | Commercial (0C to +70C) | — |
| Speed Grade | -1 (standard, slowest in family) | -1 |
| Maximum Internal Frequency | 250 MHz (per family datasheet) | — |
| Process Technology | 2.5 V CMOS | 0.22 µm CMOS, SRAM-based |
| Encapsulado | 256-pin FineLine BGA (FBGA) | 256-ball FBGA (FineLine BGA), 1.0 mm pitch |
| Tipo de montaje | Surface Mount (BGA) | — |
| Configuration Interface | Passive Serial / Passive Parallel / JTAG | — |
| Programming Method | SRAM-based, in-system programmable | — |
| Estado RoHS | Compliant | Compliant |
| Maximum User I/Os | — | 136 |
| Embedded Memory (EAB RAM) | — | 12,288 bits |
| Number of EABs | — | 3 (each 4 kbit) |
| Core Voltage | — | 2.5 V |
| I/O Voltage Tolerance | — | 3.3 V / 2.5 V LVTTL/LVCMOS compatible |
| Internal Operating Frequency | — | Up to 250 MHz |
| Pin/Ball Count | — | 256 |
| Temperatura de funcionamiento | — | 0°C to +85°C (Commercial) |
| Configuration Method | — | JTAG (IEEE 1149.1) / EPC series boot PROM |