EP1K30FC256-1 vs EP1K10FC256-1 Comparaison
Comparaison détaillée côte à côte de EP1K30FC256-1 par Intel et EP1K10FC256-1 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP1K30FC256-1 | EP1K10FC256-1 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $17,85 | $22,62 |
| Family | ACEX-1K | ACEX-1K |
| Logic Elements | 17,280 | 576 |
| Typical Gates | 30,000 | 10,000 |
| Logic Cells | 1,728 | — |
| Embedded RAM Bits | 24,576 | — |
| User I/O Pins | 171 | — |
| Logic Array Blocks (LABs) | 216 | — |
| Embedded Array Blocks (EABs) | 6 | — |
| Core Voltage (VCCINT) | 2.5 V | — |
| I/O Voltage (VCCIO) | 3.3 V / 2.5 V (multi-voltage) | — |
| Operating Temperature Grade | Commercial (0C to +70C) | — |
| Speed Grade | -1 (standard, slowest in family) | -1 |
| Maximum Internal Frequency | 250 MHz (per family datasheet) | — |
| Process Technology | 2.5 V CMOS | 0.22 µm CMOS, SRAM-based |
| Boîtier | 256-pin FineLine BGA (FBGA) | 256-ball FBGA (FineLine BGA), 1.0 mm pitch |
| Type de montage | Surface Mount (BGA) | — |
| Configuration Interface | Passive Serial / Passive Parallel / JTAG | — |
| Programming Method | SRAM-based, in-system programmable | — |
| Statut RoHS | Compliant | Compliant |
| Maximum User I/Os | — | 136 |
| Embedded Memory (EAB RAM) | — | 12,288 bits |
| Number of EABs | — | 3 (each 4 kbit) |
| Core Voltage | — | 2.5 V |
| I/O Voltage Tolerance | — | 3.3 V / 2.5 V LVTTL/LVCMOS compatible |
| Internal Operating Frequency | — | Up to 250 MHz |
| Pin/Ball Count | — | 256 |
| Température de fonctionnement | — | 0°C to +85°C (Commercial) |
| Configuration Method | — | JTAG (IEEE 1149.1) / EPC series boot PROM |