EP1K30FC256-1 vs EP1K10FC256-1 对比
详细并排对比 EP1K30FC256-1 出自 Intel 和 EP1K10FC256-1 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP1K30FC256-1 | EP1K10FC256-1 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $17.85 | $22.62 |
| Family | ACEX-1K | ACEX-1K |
| Logic Elements | 17,280 | 576 |
| Typical Gates | 30,000 | 10,000 |
| Logic Cells | 1,728 | — |
| Embedded RAM Bits | 24,576 | — |
| User I/O Pins | 171 | — |
| Logic Array Blocks (LABs) | 216 | — |
| Embedded Array Blocks (EABs) | 6 | — |
| Core Voltage (VCCINT) | 2.5 V | — |
| I/O Voltage (VCCIO) | 3.3 V / 2.5 V (multi-voltage) | — |
| Operating Temperature Grade | Commercial (0C to +70C) | — |
| Speed Grade | -1 (standard, slowest in family) | -1 |
| Maximum Internal Frequency | 250 MHz (per family datasheet) | — |
| Process Technology | 2.5 V CMOS | 0.22 µm CMOS, SRAM-based |
| 封装 | 256-pin FineLine BGA (FBGA) | 256-ball FBGA (FineLine BGA), 1.0 mm pitch |
| 安装类型 | Surface Mount (BGA) | — |
| Configuration Interface | Passive Serial / Passive Parallel / JTAG | — |
| Programming Method | SRAM-based, in-system programmable | — |
| RoHS 状态 | Compliant | Compliant |
| Maximum User I/Os | — | 136 |
| Embedded Memory (EAB RAM) | — | 12,288 bits |
| Number of EABs | — | 3 (each 4 kbit) |
| Core Voltage | — | 2.5 V |
| I/O Voltage Tolerance | — | 3.3 V / 2.5 V LVTTL/LVCMOS compatible |
| Internal Operating Frequency | — | Up to 250 MHz |
| Pin/Ball Count | — | 256 |
| 工作温度 | — | 0°C to +85°C (Commercial) |
| Configuration Method | — | JTAG (IEEE 1149.1) / EPC series boot PROM |