EP1K30FC256-2 vs EP1K30FI256-2 Comparación
Comparación detallada lado a lado de EP1K30FC256-2 por Intel y EP1K30FI256-2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1K30FC256-2 | EP1K30FI256-2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $22,95 | $18,20 |
| Family | ACEX-1K | ACEX-1K |
| Logic Elements | 1,728 | — |
| Typical Gates | 30,000 | — |
| Configurable Logic Blocks (CLBs) | 216 | — |
| On-chip RAM Bits | 24,576 | — |
| User I/O Pins | 171 | 171 |
| Speed Grade | -2 | -2 |
| Core Voltage | 2.5 V | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Encapsulado | 256-ball FineLine BGA (FBGA) | 256-ball FBGA |
| Recuento de pines | 256 | — |
| Configuration Method | SRAM (volatile, serial PROM or JTAG) | — |
| JTAG Support | Yes (IEEE 1149.1 boundary scan) | — |
| Tipo de memoria | Dual-port EAB blocks | — |
| Maximum Frequency | 200 MHz | — |
| Operating Temperature Grade | Commercial | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status not in verified web data] |
| Logic Elements (LEs) | — | 1728 |
| Typical Gate Count | — | 30,000 gates |
| Embedded RAM Bits | — | 24,576 bits |
| Logic Array Blocks (LABs) | — | 216 |
| Maximum Internal Frequency | — | 200 MHz |
| Core Supply Voltage (VCCINT) | — | 2.375 V to 2.625 V (2.5 V typical) |
| Temperatura de funcionamiento | — | -40 °C to +85 °C (Industrial) |
| Configuration Interface | — | JTAG / Serial / ByteBlaster |