EP1K50FC256-3 vs EP1K50FC256-3AA Comparación
Comparación detallada lado a lado de EP1K50FC256-3 por Intel y EP1K50FC256-3AA por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1K50FC256-3 | EP1K50FC256-3AA |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $54,40 | $92,00 |
| Series | ACEX-1K | ACEX-1K |
| Family | ACEX 1K | ACEX 1K Device Family (2.5V) |
| Logic Elements (LEs) | 2,880 | — |
| Typical Gates | 50,000 | — |
| Embedded RAM Bits | 40,960 | — |
| Logic Array Blocks (LABs) | 360 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Maximum User I/O | 186 | — |
| Core Voltage | 2.5 V | 2.5 V (2.375 V to 2.625 V) |
| Process Technology | 0.22 um CMOS | 0.22 µm CMOS SRAM |
| Maximum Frequency | 166.67 MHz | — |
| Speed Grade | -3 | -3 (faster tier) |
| Encapsulado | 256-pin FineLine BGA (FBGA-256) | 256-BGA (FBGA, 17x17 mm) |
| Package Dimensions | 17 x 17 mm | — |
| Temperatura de funcionamiento | Commercial (0C to +70C) [DATA_NEEDED: exact operating temp grade] | 0 °C to 70 °C (commercial) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Programming Interface | JTAG (IEEE 1149.1), ByteBlaster | — |
| Number of Logic Elements | — | 2880 |
| Number of LABs (Logic Array Blocks) | — | 360 |
| Total RAM Bits | — | 40960 |
| Number of I/O Pins | — | 186 |
| Number of Gates | — | 50000 (typical) |
| Configuration Method | — | SRAM (volatile, requires external config device) |
| Number of PLLs | — | 4 (per family datasheet) |
| Number of Global Clocks | — | [DATA_NEEDED: number of global clocks] |
| Estado RoHS | — | non_compliant (legacy BGA, pre-RoHS or exemption dependent on date code) |