EP1K50FC256-3 vs EP1K50FC256-3AA Comparison
Detailed side-by-side comparison of EP1K50FC256-3 by Intel and EP1K50FC256-3AA by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1K50FC256-3 | EP1K50FC256-3AA |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last Time Buy | Obsolete |
| Series | ACEX-1K | ACEX-1K |
| Family | ACEX 1K | ACEX 1K Device Family (2.5V) |
| Logic Elements (LEs) | 2,880 | — |
| Typical Gates | 50,000 | — |
| Embedded RAM Bits | 40,960 | — |
| Logic Array Blocks (LABs) | 360 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Maximum User I/O | 186 | — |
| Core Voltage | 2.5 V | 2.5 V (2.375 V to 2.625 V) |
| Process Technology | 0.22 um CMOS | 0.22 µm CMOS SRAM |
| Maximum Frequency | 166.67 MHz | — |
| Speed Grade | -3 | -3 (faster tier) |
| Package | 256-pin FineLine BGA (FBGA-256) | 256-BGA (FBGA, 17x17 mm) |
| Package Dimensions | 17 x 17 mm | — |
| Operating Temperature | Commercial (0C to +70C) [DATA_NEEDED: exact operating temp grade] | 0 °C to 70 °C (commercial) |
| Mounting Type | Surface Mount | Surface Mount |
| Programming Interface | JTAG (IEEE 1149.1), ByteBlaster | — |
| Number of Logic Elements | — | 2880 |
| Number of LABs (Logic Array Blocks) | — | 360 |
| Total RAM Bits | — | 40960 |
| Number of I/O Pins | — | 186 |
| Number of Gates | — | 50000 (typical) |
| Configuration Method | — | SRAM (volatile, requires external config device) |
| Number of PLLs | — | 4 (per family datasheet) |
| Number of Global Clocks | — | [DATA_NEEDED: number of global clocks] |
| RoHS Status | — | non_compliant (legacy BGA, pre-RoHS or exemption dependent on date code) |