EP1K50FC256-3 vs EP1K50FC256-3AA Comparaison
Comparaison détaillée côte à côte de EP1K50FC256-3 par Intel et EP1K50FC256-3AA par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP1K50FC256-3 | EP1K50FC256-3AA |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $54,40 | $92,00 |
| Series | ACEX-1K | ACEX-1K |
| Family | ACEX 1K | ACEX 1K Device Family (2.5V) |
| Logic Elements (LEs) | 2,880 | — |
| Typical Gates | 50,000 | — |
| Embedded RAM Bits | 40,960 | — |
| Logic Array Blocks (LABs) | 360 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Maximum User I/O | 186 | — |
| Core Voltage | 2.5 V | 2.5 V (2.375 V to 2.625 V) |
| Process Technology | 0.22 um CMOS | 0.22 µm CMOS SRAM |
| Maximum Frequency | 166.67 MHz | — |
| Speed Grade | -3 | -3 (faster tier) |
| Boîtier | 256-pin FineLine BGA (FBGA-256) | 256-BGA (FBGA, 17x17 mm) |
| Package Dimensions | 17 x 17 mm | — |
| Température de fonctionnement | Commercial (0C to +70C) [DATA_NEEDED: exact operating temp grade] | 0 °C to 70 °C (commercial) |
| Type de montage | Surface Mount | Surface Mount |
| Programming Interface | JTAG (IEEE 1149.1), ByteBlaster | — |
| Number of Logic Elements | — | 2880 |
| Number of LABs (Logic Array Blocks) | — | 360 |
| Total RAM Bits | — | 40960 |
| Number of I/O Pins | — | 186 |
| Number of Gates | — | 50000 (typical) |
| Configuration Method | — | SRAM (volatile, requires external config device) |
| Number of PLLs | — | 4 (per family datasheet) |
| Number of Global Clocks | — | [DATA_NEEDED: number of global clocks] |
| Statut RoHS | — | non_compliant (legacy BGA, pre-RoHS or exemption dependent on date code) |