EP1SGX25CF672I7 vs EP1SGX25CF672I6 Comparación
Comparación detallada lado a lado de EP1SGX25CF672I7 por Intel y EP1SGX25CF672I6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1SGX25CF672I7 | EP1SGX25CF672I6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $198,50 | $171,00 |
| Family | Stratix GX | Stratix GX |
| Logic Elements | 25,660 | 25,660 |
| Combinational Logic Blocks (CLBs) | 2,566 | — |
| Total Memory Bits | 1,944,576 | — |
| LAB/CLB Rows | 455 | — |
| Frecuencia de reloj máxima | 4385.97 MHz (one source: 4.7 MHz) | — |
| Combinatorial Delay (CLB) | 9.48 ns (sibling datasheet figure) | — |
| Nominal Core Voltage | 1.5 V | — |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| Rango de temperatura de funcionamiento | -65C to +135C (Military) | — |
| Encapsulado | 672-FBGA (FC-FBGA, FineLine BGA) | 672-ball FBGA (27 x 27 mm, 1 mm pitch) |
| Ball Count | 672 | — |
| Ball Pitch | 1.00 mm | — |
| Package Body Size | 27.00 x 27.00 mm | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | unknown | Compliant (lead-free FBGA) |
| Programming Toolchain | Quartus II / Quartus Prime | — |
| Logic Array Blocks (LABs) | — | 2,566 |
| Total RAM Bits | — | 1,944,576 |
| User I/O Pins | — | 455 |
| Core Supply Voltage | — | 1.425 V to 1.575 V (1.5 V typical) |
| Internal Clock Performance | — | Up to 5000 MHz |
| Temperatura de unión de funcionamiento | — | -40C to +100C |
| Transceiver Count | — | [DATA_NEEDED: precise number of SERDES channels per pin list] |
| DSP Blocks | — | [DATA_NEEDED: DSP block count per Stratix GX device data sheet] |
| Lead-Free | — | Yes |