EP1SGX25DF67216 vs EP1SGX25DF672C6 Comparación
Comparación detallada lado a lado de EP1SGX25DF67216 por Altera y EP1SGX25DF672C6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1SGX25DF67216 | EP1SGX25DF672C6 |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $198,00 | $96,50 |
| Family | Stratix GX | — |
| Logic Elements | 25,660 | 25,660 LE |
| Total RAM Bits | 1,944,576 | 1,944,576 bits |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Number of PLLs | 4 | — |
| Number of Transceiver Channels | 8 (4 in each of 2 banks) | — |
| Max Transceiver Data Rate | 3.1875 Gbps per channel | 3.125 Gbps |
| Min Transceiver Data Rate | 500 Mbps | — |
| Core Supply Voltage | 1.5 V | — |
| Auxiliary Supply Voltage | 3.3 V | — |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Maximum User I/O Pins | [DATA_NEEDED: user I/O count for DF672 package] | — |
| Encapsulado | 672-ball FineLine BGA (DF672) | 672-BBGA FineLine BGA |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Temperatura de funcionamiento | Industrial, -40C to +100C (I-suffix family) | 0C to +85C (commercial) |
| On-Die Termination | Yes, 100-ohm differential | — |
| Pre-emphasis / Equalization | Programmable (transmitter pre-emphasis; receiver adaptive equalization) | — |
| Configuration Schemes | Passive serial, fast passive parallel, JTAG, Altera enhanced configuration | — |
| Estado RoHS | Lead-free / RoHS compliant (per Altera product family documentation) | — |
| Series | — | Stratix GX |
| Number of LABs | — | 2,566 |
| User I/O Count | — | 455 |
| Number of Transceivers | — | 6 channels (per Stratix GX family) |
| Core Voltage | — | 1.5 V |
| Package Dimensions | — | 33 x 33 mm |
| Ball Pitch | — | 1.0 mm |
| Lead-Free / RoHS | — | Lead-Free (per FBGA suffix family) |
| Process Technology | — | CMOS |