EP1SGX25DF67216 vs EP1SGX25DF672C6 Comparaison
Comparaison détaillée côte à côte de EP1SGX25DF67216 par Altera et EP1SGX25DF672C6 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP1SGX25DF67216 | EP1SGX25DF672C6 |
|---|---|---|
| Marque | Altera | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $198,00 | $96,50 |
| Family | Stratix GX | — |
| Logic Elements | 25,660 | 25,660 LE |
| Total RAM Bits | 1,944,576 | 1,944,576 bits |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Number of PLLs | 4 | — |
| Number of Transceiver Channels | 8 (4 in each of 2 banks) | — |
| Max Transceiver Data Rate | 3.1875 Gbps per channel | 3.125 Gbps |
| Min Transceiver Data Rate | 500 Mbps | — |
| Core Supply Voltage | 1.5 V | — |
| Auxiliary Supply Voltage | 3.3 V | — |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Maximum User I/O Pins | [DATA_NEEDED: user I/O count for DF672 package] | — |
| Boîtier | 672-ball FineLine BGA (DF672) | 672-BBGA FineLine BGA |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Température de fonctionnement | Industrial, -40C to +100C (I-suffix family) | 0C to +85C (commercial) |
| On-Die Termination | Yes, 100-ohm differential | — |
| Pre-emphasis / Equalization | Programmable (transmitter pre-emphasis; receiver adaptive equalization) | — |
| Configuration Schemes | Passive serial, fast passive parallel, JTAG, Altera enhanced configuration | — |
| Statut RoHS | Lead-free / RoHS compliant (per Altera product family documentation) | — |
| Series | — | Stratix GX |
| Number of LABs | — | 2,566 |
| User I/O Count | — | 455 |
| Number of Transceivers | — | 6 channels (per Stratix GX family) |
| Core Voltage | — | 1.5 V |
| Package Dimensions | — | 33 x 33 mm |
| Ball Pitch | — | 1.0 mm |
| Lead-Free / RoHS | — | Lead-Free (per FBGA suffix family) |
| Process Technology | — | CMOS |