EP1SGX25F1020C6 vs EP1SGX25DF1020C6 Comparación
Comparación detallada lado a lado de EP1SGX25F1020C6 por Intel y EP1SGX25DF1020C6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1SGX25F1020C6 | EP1SGX25DF1020C6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $645,00 | $289,00 |
| Family | Stratix GX | Stratix GX |
| Logic Elements | 25,660 | — |
| LABs/CLBs | 2,566 | — |
| Total RAM Bits | 1,944,576 | 1,944,576 |
| User I/O Pins | 607 | — |
| Encapsulado | 1020-ball FineLine BGA (FBGA-1020) | — |
| Package Dimensions | 33 x 33 mm, 1.0 mm pitch | — |
| Core Voltage | 1.5 V | — |
| Temperatura de funcionamiento | 0C to 85C (commercial) | 0 °C to +85 °C (commercial) |
| Logic Family | CMOS | CMOS |
| Transceivers | Up to 20 multi-gigabit channels (this die density supports up to 14 active) | Embedded multi-gigabit transceivers (3.125 Gbps class) |
| Transceiver Data Rate | 622 Mbps to 3.1875 Gbps | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Lead Free | Yes | — |
| Estado RoHS | [DATA_NEEDED: rohs status] | Lead-free per datasheet |
| Nivel MSL | [DATA_NEEDED: msl level] | — |
| Device Logic Elements | — | 25,660 |
| LABs / CLBs | — | 2,566 |
| Number of I/O | — | 607 (614 user pins per datasheet) |
| Core Supply Voltage | — | 1.5 V (1.425 V min, 1.575 V max) |
| Package Type | — | 1020-BBGA / FC-FBGA |
| Package Size | — | 33 x 33 mm, 1.0 mm pitch |
| Process Technology | — | 130 nm CMOS |
| Configuration Method | — | Passive Serial, Fast Passive Parallel, JTAG |